WO2004094693A3 - Gas distribution plate assembly for large area plasma enhanced chemical vapor deposition - Google Patents
Gas distribution plate assembly for large area plasma enhanced chemical vapor deposition Download PDFInfo
- Publication number
- WO2004094693A3 WO2004094693A3 PCT/US2004/011477 US2004011477W WO2004094693A3 WO 2004094693 A3 WO2004094693 A3 WO 2004094693A3 US 2004011477 W US2004011477 W US 2004011477W WO 2004094693 A3 WO2004094693 A3 WO 2004094693A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- gas distribution
- distribution plate
- vapor deposition
- chemical vapor
- large area
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45565—Shower nozzles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
- C23C16/509—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
- C23C16/5096—Flat-bed apparatus
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/511—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using microwave discharges
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005518601A JP2006515039A (en) | 2003-04-16 | 2004-04-14 | Gas distribution plate assembly for large area plasma chemical vapor deposition |
CN2004800052710A CN1754008B (en) | 2003-04-16 | 2004-04-14 | Gas distribution plate assembly for large area plasma enhanced chemical vapor deposition |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/417,592 | 2003-04-16 | ||
US10/417,592 US6942753B2 (en) | 2003-04-16 | 2003-04-16 | Gas distribution plate assembly for large area plasma enhanced chemical vapor deposition |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004094693A2 WO2004094693A2 (en) | 2004-11-04 |
WO2004094693A3 true WO2004094693A3 (en) | 2005-02-10 |
Family
ID=33158943
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2004/011477 WO2004094693A2 (en) | 2003-04-16 | 2004-04-14 | Gas distribution plate assembly for large area plasma enhanced chemical vapor deposition |
Country Status (6)
Country | Link |
---|---|
US (1) | US6942753B2 (en) |
JP (2) | JP2006515039A (en) |
KR (1) | KR100696021B1 (en) |
CN (2) | CN1754008B (en) |
TW (1) | TWI276701B (en) |
WO (1) | WO2004094693A2 (en) |
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US6942753B2 (en) * | 2003-04-16 | 2005-09-13 | Applied Materials, Inc. | Gas distribution plate assembly for large area plasma enhanced chemical vapor deposition |
-
2003
- 2003-04-16 US US10/417,592 patent/US6942753B2/en not_active Expired - Lifetime
-
2004
- 2004-04-14 KR KR1020057012394A patent/KR100696021B1/en active IP Right Grant
- 2004-04-14 CN CN2004800052710A patent/CN1754008B/en not_active Expired - Lifetime
- 2004-04-14 JP JP2005518601A patent/JP2006515039A/en active Pending
- 2004-04-14 WO PCT/US2004/011477 patent/WO2004094693A2/en active Application Filing
- 2004-04-14 CN CN201110394067.4A patent/CN102443783B/en not_active Expired - Lifetime
- 2004-04-16 TW TW093110755A patent/TWI276701B/en not_active IP Right Cessation
-
2009
- 2009-11-30 JP JP2009272100A patent/JP5302865B2/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US6132512A (en) * | 1997-01-08 | 2000-10-17 | Ebara Corporation | Vapor-phase film growth apparatus and gas ejection head |
US6024799A (en) * | 1997-07-11 | 2000-02-15 | Applied Materials, Inc. | Chemical vapor deposition manifold |
EP1118693A2 (en) * | 2000-01-20 | 2001-07-25 | Applied Materials, Inc. | Suspended gas distribution manifold for plasma chamber |
US20030019580A1 (en) * | 2000-03-30 | 2003-01-30 | Strang Eric J. | Method of and apparatus for tunable gas injection in a plasma processing system |
Also Published As
Publication number | Publication date |
---|---|
CN1754008A (en) | 2006-03-29 |
US20040206305A1 (en) | 2004-10-21 |
CN102443783B (en) | 2014-04-30 |
JP2010077537A (en) | 2010-04-08 |
WO2004094693A2 (en) | 2004-11-04 |
JP2006515039A (en) | 2006-05-18 |
TWI276701B (en) | 2007-03-21 |
KR100696021B1 (en) | 2007-03-16 |
KR20050096111A (en) | 2005-10-05 |
CN102443783A (en) | 2012-05-09 |
US6942753B2 (en) | 2005-09-13 |
CN1754008B (en) | 2012-01-11 |
TW200500492A (en) | 2005-01-01 |
JP5302865B2 (en) | 2013-10-02 |
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