WO2005020285A3 - Extrusion thermo-electric temperature control unit - Google Patents

Extrusion thermo-electric temperature control unit Download PDF

Info

Publication number
WO2005020285A3
WO2005020285A3 PCT/US2004/026668 US2004026668W WO2005020285A3 WO 2005020285 A3 WO2005020285 A3 WO 2005020285A3 US 2004026668 W US2004026668 W US 2004026668W WO 2005020285 A3 WO2005020285 A3 WO 2005020285A3
Authority
WO
WIPO (PCT)
Prior art keywords
thermo
extrusion
control unit
temperature control
sections
Prior art date
Application number
PCT/US2004/026668
Other languages
French (fr)
Other versions
WO2005020285A2 (en
Inventor
Michael R Bonner
Original Assignee
St Clair Systems Inc
Michael R Bonner
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by St Clair Systems Inc, Michael R Bonner filed Critical St Clair Systems Inc
Publication of WO2005020285A2 publication Critical patent/WO2005020285A2/en
Publication of WO2005020285A3 publication Critical patent/WO2005020285A3/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The present invention provides a method of manufacturing a cooling device, comprising the steps of: extruding an elongate hollow body having a plurality of internally projecting, longitudinal fins; cutting a plurality of sections from the elongate hollow body; positioning the sections in substantially parallel, longitudinal alignment; placing at least one thermo-electric heat pump chip between the sections, and connecting the chip to a power supply.
PCT/US2004/026668 2003-08-18 2004-08-18 Extrusion thermo-electric temperature control unit WO2005020285A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US49590503P 2003-08-18 2003-08-18
US60/495,905 2003-08-18

Publications (2)

Publication Number Publication Date
WO2005020285A2 WO2005020285A2 (en) 2005-03-03
WO2005020285A3 true WO2005020285A3 (en) 2005-05-12

Family

ID=34215941

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/026668 WO2005020285A2 (en) 2003-08-18 2004-08-18 Extrusion thermo-electric temperature control unit

Country Status (1)

Country Link
WO (1) WO2005020285A2 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5584183A (en) * 1994-02-18 1996-12-17 Solid State Cooling Systems Thermoelectric heat exchanger
US5942719A (en) * 1997-07-28 1999-08-24 Advanced Modular Power Systems, Inc. Alkali metal thermal to electric conversion (AMTEC) cells
US6002081A (en) * 1996-12-18 1999-12-14 S.E.L. Usa Inc. Thermoelectric component and thermoelectric cooling device
US6003319A (en) * 1995-10-17 1999-12-21 Marlow Industries, Inc. Thermoelectric refrigerator with evaporating/condensing heat exchanger
US6279470B2 (en) * 1998-06-04 2001-08-28 Biontronics S.A. Portable and self-contained system for maintaining prepared meals in a cool state and reheating them

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5584183A (en) * 1994-02-18 1996-12-17 Solid State Cooling Systems Thermoelectric heat exchanger
US6003319A (en) * 1995-10-17 1999-12-21 Marlow Industries, Inc. Thermoelectric refrigerator with evaporating/condensing heat exchanger
US6002081A (en) * 1996-12-18 1999-12-14 S.E.L. Usa Inc. Thermoelectric component and thermoelectric cooling device
US5942719A (en) * 1997-07-28 1999-08-24 Advanced Modular Power Systems, Inc. Alkali metal thermal to electric conversion (AMTEC) cells
US6279470B2 (en) * 1998-06-04 2001-08-28 Biontronics S.A. Portable and self-contained system for maintaining prepared meals in a cool state and reheating them

Also Published As

Publication number Publication date
WO2005020285A2 (en) 2005-03-03

Similar Documents

Publication Publication Date Title
EP4007043A4 (en) Battery module comprising heat dissipating member, and method for manufacturing heat dissipating member
DE60312358D1 (en) Photovoltaic module with adjustable cooling body and method
DE60231371D1 (en) Thermoelectric heat pump
WO2005052483A3 (en) Method of making multi-tube in spiral heat exchanger
IL183311A0 (en) Heat sink with microchannel cooling for power devices
WO2007001317A3 (en) Light emitting chip apparatuses with a thermally superconducting heat transfer medium for thermal management
EP1452614A4 (en) Sintered diamond having high thermal conductivity and method for producing the same and heat sink employing it
DE60333929D1 (en) HEAT EXCHANGER WITH SLICED SLICES
WO2005003503A3 (en) Method and apparatus for managing the temperature of thermal components
EP1605220A4 (en) Heat sunk, laser module, laser device, and laser-processing device
EP1827737A4 (en) Die thermal management through coolant flow control
AU2003288954A1 (en) Shivering supression during cooling to lower body temperature
GB2400056B (en) Method and apparatus for manufacturing heat exchanger tubing
CN201017875Y (en) Luminous diode heat radiation structure
AU2003286400A8 (en) Thermoelectric heat pumps
DE50214558D1 (en) Component for thermal insulation
TW200625568A (en) Solid cooling structure and formation thereof with integrated package
EP1821342A4 (en) Heat sink material, method for manufacturing such heat sink material, and semiconductor laser device
WO2005020285A3 (en) Extrusion thermo-electric temperature control unit
DE602004027814D1 (en) Fault
WO2009139591A3 (en) Rapid cooling device and refrigerator having same
DE502004007852D1 (en) INTEGRATED COOLING CIRCUIT ARRANGEMENT, OPERATING METHOD AND MANUFACTURING METHOD
GB2408847B (en) Semiconductor laser with integrated heating element and method of manufacturing same
ZA200200994B (en) Method for cooling heating grade heat exchanger in unsteady state.
BONNER Extrusion thermo-electric temperature control unit

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DPEN Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed from 20040101)
122 Ep: pct application non-entry in european phase