WO2005098976A3 - Semiconductor light emitting devices including a luminescent conversion element and methods for packaging the same - Google Patents

Semiconductor light emitting devices including a luminescent conversion element and methods for packaging the same Download PDF

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Publication number
WO2005098976A3
WO2005098976A3 PCT/US2005/009778 US2005009778W WO2005098976A3 WO 2005098976 A3 WO2005098976 A3 WO 2005098976A3 US 2005009778 W US2005009778 W US 2005009778W WO 2005098976 A3 WO2005098976 A3 WO 2005098976A3
Authority
WO
WIPO (PCT)
Prior art keywords
light emitting
conversion element
packaging
methods
semiconductor light
Prior art date
Application number
PCT/US2005/009778
Other languages
French (fr)
Other versions
WO2005098976A2 (en
Inventor
Michael Leung
Thomas G Coleman
Maryanne Becerra
Original Assignee
Cree Inc
Michael Leung
Thomas G Coleman
Maryanne Becerra
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Inc, Michael Leung, Thomas G Coleman, Maryanne Becerra filed Critical Cree Inc
Priority to JP2007506264A priority Critical patent/JP5285271B2/en
Priority to EP05730762.1A priority patent/EP1730793B1/en
Publication of WO2005098976A2 publication Critical patent/WO2005098976A2/en
Publication of WO2005098976A3 publication Critical patent/WO2005098976A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations

Abstract

Methods of packaging a semiconductor light emitting device include dispensing a first quantity of encapsulant material into a cavity including the light emitting device. The first quantity of encapsulant material in the cavity is treated to form a hardened upper surface thereof having a selected shape. A luminescent conversion element is provided on the upper surface of the treated first quantity of encapsulant material. The luminescent conversion element includes a wavelength conversion material and has a thickness at a middle region of the cavity greater than proximate a sidewall of the cavity.
PCT/US2005/009778 2004-03-31 2005-03-24 Semiconductor light emitting devices including a luminescent conversion element and methods for packaging the same WO2005098976A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007506264A JP5285271B2 (en) 2004-03-31 2005-03-24 Semiconductor light emitting device having light emitting conversion element and packaging method thereof
EP05730762.1A EP1730793B1 (en) 2004-03-31 2005-03-24 Semiconductor light emitting devices including a luminescent conversion element and methods for packaging the same

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US55831404P 2004-03-31 2004-03-31
US60/558,314 2004-03-31
US63770004P 2004-12-21 2004-12-21
US60/637,700 2004-12-21
US11/055,194 US7517728B2 (en) 2004-03-31 2005-02-10 Semiconductor light emitting devices including a luminescent conversion element
US11/055,194 2005-02-10

Publications (2)

Publication Number Publication Date
WO2005098976A2 WO2005098976A2 (en) 2005-10-20
WO2005098976A3 true WO2005098976A3 (en) 2006-06-15

Family

ID=35054898

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/009778 WO2005098976A2 (en) 2004-03-31 2005-03-24 Semiconductor light emitting devices including a luminescent conversion element and methods for packaging the same

Country Status (6)

Country Link
US (4) US7517728B2 (en)
EP (1) EP1730793B1 (en)
JP (1) JP5285271B2 (en)
KR (1) KR20060135848A (en)
TW (2) TWI452740B (en)
WO (1) WO2005098976A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
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US9012937B2 (en) 2007-10-10 2015-04-21 Cree, Inc. Multiple conversion material light emitting diode package and method of fabricating same

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