WO2005114732A1 - Semiconductor integrated circuit including metal mesh structure - Google Patents
Semiconductor integrated circuit including metal mesh structure Download PDFInfo
- Publication number
- WO2005114732A1 WO2005114732A1 PCT/US2005/016549 US2005016549W WO2005114732A1 WO 2005114732 A1 WO2005114732 A1 WO 2005114732A1 US 2005016549 W US2005016549 W US 2005016549W WO 2005114732 A1 WO2005114732 A1 WO 2005114732A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- integrated circuit
- semiconductor integrated
- recited
- layer
- metal
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
- H01L23/5223—Capacitor integral with wiring layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
- H01L23/5225—Shielding layers formed together with wiring layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2005800195935A CN101023525B (en) | 2004-05-13 | 2005-05-13 | Semiconductor integrated circuit including metal mesh structure |
EP05747466A EP1745508A1 (en) | 2004-05-13 | 2005-05-13 | Semiconductor integrated circuit including metal mesh structure |
JP2007513330A JP2007537604A (en) | 2004-05-13 | 2005-05-13 | Semiconductor integrated circuit including metal mesh structure |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US57060204P | 2004-05-13 | 2004-05-13 | |
US60/570,602 | 2004-05-13 | ||
US11/014,143 US7741696B2 (en) | 2004-05-13 | 2004-12-16 | Semiconductor integrated circuit including metal mesh structure |
US11/014,143 | 2004-12-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005114732A1 true WO2005114732A1 (en) | 2005-12-01 |
Family
ID=34969492
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/016549 WO2005114732A1 (en) | 2004-05-13 | 2005-05-13 | Semiconductor integrated circuit including metal mesh structure |
Country Status (5)
Country | Link |
---|---|
US (1) | US7741696B2 (en) |
EP (1) | EP1745508A1 (en) |
JP (1) | JP2007537604A (en) |
CN (2) | CN101023525B (en) |
WO (1) | WO2005114732A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8841771B2 (en) | 2009-10-09 | 2014-09-23 | Renesas Electronics Corporation | Semiconductor device |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8129266B2 (en) * | 2008-07-09 | 2012-03-06 | Semiconductor Componenets Industries, LLC | Method of forming a shielded semiconductor device and structure therefor |
TWI497679B (en) * | 2009-11-27 | 2015-08-21 | Advanced Semiconductor Eng | Semiconductor package and manufacturing method thereof |
US8569894B2 (en) | 2010-01-13 | 2013-10-29 | Advanced Semiconductor Engineering, Inc. | Semiconductor package with single sided substrate design and manufacturing methods thereof |
TWI411075B (en) | 2010-03-22 | 2013-10-01 | Advanced Semiconductor Eng | Semiconductor package and manufacturing method thereof |
CN102314524B (en) * | 2010-06-30 | 2012-12-05 | 中国科学院微电子研究所 | Method for optimizing electromagnetic distribution of integrated circuit layout |
US8941222B2 (en) | 2010-11-11 | 2015-01-27 | Advanced Semiconductor Engineering Inc. | Wafer level semiconductor package and manufacturing methods thereof |
US9406658B2 (en) | 2010-12-17 | 2016-08-02 | Advanced Semiconductor Engineering, Inc. | Embedded component device and manufacturing methods thereof |
US9245083B2 (en) | 2011-10-13 | 2016-01-26 | Globalfoundries Inc. | Method, structures and method of designing reduced delamination integrated circuits |
CN102610592B (en) * | 2012-03-09 | 2016-11-02 | 上海华虹宏力半导体制造有限公司 | Groove MOS Electro-static Driven Comb structure making process and integrated circuit |
JP6560175B2 (en) * | 2016-09-13 | 2019-08-14 | 株式会社東芝 | Semiconductor device |
CN107316857A (en) * | 2017-07-20 | 2017-11-03 | 无锡中感微电子股份有限公司 | A kind of sensitive circuit structure and system level chip |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5925921A (en) * | 1998-02-13 | 1999-07-20 | Microchip Technology Incorporated | Geometrical layout technique for a circular capacitor within an array of matched capacitors on a semiconductor device |
US6066537A (en) * | 1998-02-02 | 2000-05-23 | Tritech Microelectronics, Ltd. | Method for fabricating a shielded multilevel integrated circuit capacitor |
US6278148B1 (en) | 1997-03-19 | 2001-08-21 | Hitachi, Ltd. | Semiconductor device having a shielding conductor |
US20030052352A1 (en) * | 2001-09-06 | 2003-03-20 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and method of fabricating the same |
US20030205746A1 (en) | 2001-11-13 | 2003-11-06 | Fujitsu Limited | Semiconductor device and method for fabricating the same |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02209735A (en) | 1989-02-09 | 1990-08-21 | Seiko Epson Corp | Semiconductor device |
JPH04142065A (en) | 1990-10-02 | 1992-05-15 | Fujitsu Ltd | Manufacture of semiconductor device |
US5151769A (en) * | 1991-04-04 | 1992-09-29 | General Electric Company | Optically patterned RF shield for an integrated circuit chip for analog and/or digital operation at microwave frequencies |
JPH0590489A (en) * | 1991-09-30 | 1993-04-09 | Fujitsu Ltd | Semiconductor integrated circuit |
JPH0770837B2 (en) * | 1992-05-20 | 1995-07-31 | インターナショナル・ビジネス・マシーンズ・コーポレイション | Electronic package substrate and method having multilayer wiring |
US5410107A (en) * | 1993-03-01 | 1995-04-25 | The Board Of Trustees Of The University Of Arkansas | Multichip module |
JPH11330393A (en) * | 1997-03-19 | 1999-11-30 | Hitachi Ltd | Semiconductor device |
FR2768852B1 (en) | 1997-09-22 | 1999-11-26 | Sgs Thomson Microelectronics | REALIZATION OF AN INTERMETALLIC CAPACITOR |
US6020614A (en) | 1998-03-25 | 2000-02-01 | Worley; Eugene Robert | Method of reducing substrate noise coupling in mixed signal integrated circuits |
JP2000223653A (en) * | 1999-02-02 | 2000-08-11 | Rohm Co Ltd | Semiconductor device having chip-on-chip structure and semiconductor chip using the same |
AUPQ436399A0 (en) * | 1999-12-01 | 1999-12-23 | Bhp Steel (Jla) Pty Limited | Hot rolling thin strip |
JP3967544B2 (en) | 1999-12-14 | 2007-08-29 | 株式会社東芝 | MIM capacitor |
JP3715502B2 (en) * | 2000-03-14 | 2005-11-09 | 株式会社東芝 | Semiconductor device and manufacturing method thereof |
US6844236B2 (en) * | 2001-07-23 | 2005-01-18 | Agere Systems Inc. | Method and structure for DC and RF shielding of integrated circuits |
KR100390918B1 (en) * | 2001-08-30 | 2003-07-12 | 주식회사 하이닉스반도체 | a method for manufacturing of semiconductor memory device |
JP3998975B2 (en) * | 2001-12-28 | 2007-10-31 | 大日本印刷株式会社 | Electromagnetic wave shielding sheet |
US7013436B1 (en) * | 2003-05-25 | 2006-03-14 | Barcelona Design, Inc. | Analog circuit power distribution circuits and design methodologies for producing same |
TWI228295B (en) * | 2003-11-10 | 2005-02-21 | Shih-Hsien Tseng | IC structure and a manufacturing method |
WO2005098954A1 (en) * | 2004-04-02 | 2005-10-20 | Triad Semiconductor, Inc. | Via configurable architecture for customization of analog circuitry in a semiconductor device |
US7430800B2 (en) * | 2005-06-06 | 2008-10-07 | International Business Machines Corporation | Apparatus and method for far end noise reduction using capacitive cancellation by offset wiring |
-
2004
- 2004-12-16 US US11/014,143 patent/US7741696B2/en not_active Expired - Fee Related
-
2005
- 2005-05-13 EP EP05747466A patent/EP1745508A1/en not_active Withdrawn
- 2005-05-13 CN CN2005800195935A patent/CN101023525B/en not_active Expired - Fee Related
- 2005-05-13 JP JP2007513330A patent/JP2007537604A/en active Pending
- 2005-05-13 WO PCT/US2005/016549 patent/WO2005114732A1/en active Application Filing
- 2005-05-13 CN CN201210025733.1A patent/CN102543947B/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6278148B1 (en) | 1997-03-19 | 2001-08-21 | Hitachi, Ltd. | Semiconductor device having a shielding conductor |
US6066537A (en) * | 1998-02-02 | 2000-05-23 | Tritech Microelectronics, Ltd. | Method for fabricating a shielded multilevel integrated circuit capacitor |
US5925921A (en) * | 1998-02-13 | 1999-07-20 | Microchip Technology Incorporated | Geometrical layout technique for a circular capacitor within an array of matched capacitors on a semiconductor device |
US20030052352A1 (en) * | 2001-09-06 | 2003-03-20 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and method of fabricating the same |
US20030205746A1 (en) | 2001-11-13 | 2003-11-06 | Fujitsu Limited | Semiconductor device and method for fabricating the same |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8841771B2 (en) | 2009-10-09 | 2014-09-23 | Renesas Electronics Corporation | Semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
CN102543947A (en) | 2012-07-04 |
JP2007537604A (en) | 2007-12-20 |
CN101023525B (en) | 2012-12-12 |
CN101023525A (en) | 2007-08-22 |
CN102543947B (en) | 2015-03-25 |
US7741696B2 (en) | 2010-06-22 |
US20050253223A1 (en) | 2005-11-17 |
EP1745508A1 (en) | 2007-01-24 |
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