WO2005124860A3 - Memory module cooling - Google Patents

Memory module cooling Download PDF

Info

Publication number
WO2005124860A3
WO2005124860A3 PCT/US2005/019964 US2005019964W WO2005124860A3 WO 2005124860 A3 WO2005124860 A3 WO 2005124860A3 US 2005019964 W US2005019964 W US 2005019964W WO 2005124860 A3 WO2005124860 A3 WO 2005124860A3
Authority
WO
WIPO (PCT)
Prior art keywords
memory module
module cooling
heatsink
formations
emitting heat
Prior art date
Application number
PCT/US2005/019964
Other languages
French (fr)
Other versions
WO2005124860A2 (en
Inventor
William George Gates
Richard John Harris
Sean Conor Wrycraft
Original Assignee
Sun Microsystems Inc
William George Gates
Richard John Harris
Sean Conor Wrycraft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sun Microsystems Inc, William George Gates, Richard John Harris, Sean Conor Wrycraft filed Critical Sun Microsystems Inc
Publication of WO2005124860A2 publication Critical patent/WO2005124860A2/en
Publication of WO2005124860A3 publication Critical patent/WO2005124860A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heatsink for a memory module includes a substantially planar contact portion for forming a thermal contact with the memory module and for mounting the heatsink on the memory module. One or more formations for emitting heat are also provided, the formations for emitting heat being in thermal communication with the contact portions.
PCT/US2005/019964 2004-06-14 2005-06-07 Memory module cooling WO2005124860A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/867,422 US7079396B2 (en) 2004-06-14 2004-06-14 Memory module cooling
US10/867,422 2004-06-14

Publications (2)

Publication Number Publication Date
WO2005124860A2 WO2005124860A2 (en) 2005-12-29
WO2005124860A3 true WO2005124860A3 (en) 2006-04-27

Family

ID=34971933

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/019964 WO2005124860A2 (en) 2004-06-14 2005-06-07 Memory module cooling

Country Status (2)

Country Link
US (1) US7079396B2 (en)
WO (1) WO2005124860A2 (en)

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Also Published As

Publication number Publication date
US7079396B2 (en) 2006-07-18
WO2005124860A2 (en) 2005-12-29
US20050276021A1 (en) 2005-12-15

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