WO2006073553A3 - Cooling apparatus, system, and associated method - Google Patents

Cooling apparatus, system, and associated method Download PDF

Info

Publication number
WO2006073553A3
WO2006073553A3 PCT/US2005/040595 US2005040595W WO2006073553A3 WO 2006073553 A3 WO2006073553 A3 WO 2006073553A3 US 2005040595 W US2005040595 W US 2005040595W WO 2006073553 A3 WO2006073553 A3 WO 2006073553A3
Authority
WO
WIPO (PCT)
Prior art keywords
cooling apparatus
circuit board
printed circuit
associated method
major surfaces
Prior art date
Application number
PCT/US2005/040595
Other languages
French (fr)
Other versions
WO2006073553A2 (en
Inventor
Julie F Asfia
Chung-Lung Chen
Qingjun Cai
Original Assignee
Boeing Co
Julie F Asfia
Chung-Lung Chen
Qingjun Cai
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=36589078&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2006073553(A3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Boeing Co, Julie F Asfia, Chung-Lung Chen, Qingjun Cai filed Critical Boeing Co
Priority to CN2005800458470A priority Critical patent/CN101095386B/en
Priority to JP2007550364A priority patent/JP4881879B2/en
Priority to AT05851466T priority patent/ATE512573T1/en
Priority to EP05851466.2A priority patent/EP1834515B2/en
Publication of WO2006073553A2 publication Critical patent/WO2006073553A2/en
Publication of WO2006073553A3 publication Critical patent/WO2006073553A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20663—Liquid coolant with phase change, e.g. heat pipes
    • H05K7/20672—Liquid coolant with phase change, e.g. heat pipes within sub-racks for removing heat from electronic boards
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20663—Liquid coolant with phase change, e.g. heat pipes
    • H05K7/20681—Liquid coolant with phase change, e.g. heat pipes within cabinets for removing heat from sub-racks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes

Abstract

A cooling apparatus, system, and method are provided. The cooling apparatus includes at least one printed circuit board having opposed major surfaces, and at least one electrical component or other heat source positioned on one major surface of the printed circuit board. The cooling apparatus also includes a pulsating heat pipe having at least a portion that is positioned to either extend along and proximate to one of the major surfaces or be embedded within the printed circuit board. As such, the pulsating heat pipe is capable of transferring heat from the printed circuit board.
PCT/US2005/040595 2005-01-06 2005-11-09 Cooling apparatus, system, and associated method WO2006073553A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2005800458470A CN101095386B (en) 2005-01-06 2005-11-09 Cooling apparatus, method for cooling printed circuit board
JP2007550364A JP4881879B2 (en) 2005-01-06 2005-11-09 COOLING DEVICE, SYSTEM AND RELATED METHOD
AT05851466T ATE512573T1 (en) 2005-01-06 2005-11-09 COOLING DEVICE, SYSTEM AND ASSOCIATED METHOD
EP05851466.2A EP1834515B2 (en) 2005-01-06 2005-11-09 Cooling apparatus, system, and associated method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/030,704 US7345877B2 (en) 2005-01-06 2005-01-06 Cooling apparatus, system, and associated method
US11/030,704 2005-01-06

Publications (2)

Publication Number Publication Date
WO2006073553A2 WO2006073553A2 (en) 2006-07-13
WO2006073553A3 true WO2006073553A3 (en) 2007-03-01

Family

ID=36589078

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/040595 WO2006073553A2 (en) 2005-01-06 2005-11-09 Cooling apparatus, system, and associated method

Country Status (6)

Country Link
US (1) US7345877B2 (en)
EP (1) EP1834515B2 (en)
JP (1) JP4881879B2 (en)
CN (1) CN101095386B (en)
AT (1) ATE512573T1 (en)
WO (1) WO2006073553A2 (en)

Families Citing this family (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7983042B2 (en) * 2004-06-15 2011-07-19 Raytheon Company Thermal management system and method for thin membrane type antennas
DE102006041788B4 (en) 2006-09-06 2012-06-14 Airbus Operations Gmbh An aircraft electronics cooling device for an aircraft with a liquid cooling system
CN100572908C (en) * 2006-11-17 2009-12-23 富准精密工业(深圳)有限公司 Led lamp
US20080115911A1 (en) * 2006-11-22 2008-05-22 Tyco Electronics Corporation Heat dissipation system for solarlok photovoltaic interconnection system
TWI316174B (en) * 2006-11-29 2009-10-21 Asustek Comp Inc Heat-sink backing plate module, circuit board, and electronic apparatus having the same
CN200994225Y (en) * 2006-12-29 2007-12-19 帛汉股份有限公司 Circuit substrate structure
US7460367B2 (en) * 2007-03-05 2008-12-02 Tracewell Systems, Inc. Method and system for dissipating thermal energy from conduction-cooled circuit card assemblies which employ remote heat sinks and heat pipe technology
DE102007045733B3 (en) * 2007-09-25 2009-02-05 Qimonda Ag Memory module comprises board with two sides, where memory chips are arranged on former and latter side, where longitudinally proceeding heat pipe module is arranged on former side
US8919426B2 (en) * 2007-10-22 2014-12-30 The Peregrine Falcon Corporation Micro-channel pulsating heat pipe
US7843693B2 (en) * 2007-11-02 2010-11-30 The Boeing Company Method and system for removing heat
US8223494B2 (en) * 2007-12-31 2012-07-17 General Electric Company Conduction cooled circuit board assembly
US7626820B1 (en) * 2008-05-15 2009-12-01 Sun Microsystems, Inc. Thermal transfer technique using heat pipes with integral rack rails
US9500416B2 (en) * 2008-05-31 2016-11-22 The Boeing Company Thermal management device and method for making the same
JP5404261B2 (en) * 2009-04-16 2014-01-29 モレックス インコーポレイテド Cooling device, electronic board, electronic equipment
US8059409B2 (en) * 2009-06-19 2011-11-15 General Electric Company Avionics chassis
US8023267B2 (en) * 2009-06-19 2011-09-20 General Electric Company Avionics chassis
JPWO2010147199A1 (en) * 2009-06-19 2012-12-06 株式会社安川電機 Wiring board and power conversion device
US7911796B2 (en) * 2009-06-19 2011-03-22 General Electric Company Avionics chassis
US8222541B2 (en) * 2009-06-19 2012-07-17 General Electric Company Avionics chassis
US9036351B2 (en) * 2009-06-22 2015-05-19 Xyber Technologies, Llc Passive cooling system and method for electronics devices
US8582298B2 (en) 2009-06-22 2013-11-12 Xyber Technologies Passive cooling enclosure system and method for electronics devices
US8522569B2 (en) 2009-10-27 2013-09-03 Industrial Idea Partners, Inc. Utilization of data center waste heat for heat driven engine
FR2956280A1 (en) * 2010-02-09 2011-08-12 Kontron Modular Computers Sa AUXILIARY DEVICE FOR EVACUATION BY CONDUCTION OF HEAT PRODUCED BY AN ELECTRONIC CARD
CN101852378A (en) * 2010-07-02 2010-10-06 上海交通大学 LED tunnel illuminating lamp
CN102316699B (en) * 2010-07-07 2015-10-14 富泰华工业（深圳）有限公司 Cooling means, the circuit board repair device using this cooling device method and equipment
CN101936676A (en) * 2010-09-13 2011-01-05 天津大学 Multi-channel parallel looped pulsating heat pipe
TWI422318B (en) * 2010-10-29 2014-01-01 Ind Tech Res Inst Data center module
TW201221034A (en) * 2010-11-05 2012-05-16 Inventec Corp Cooling system of server and cooling method thereof
FR2969379B1 (en) * 2010-12-17 2013-02-15 Thales Sa COOLING AN ELECTRONIC EQUIPMENT
JP5722710B2 (en) * 2011-06-16 2015-05-27 株式会社アドバンテスト Board assembly and electronic component testing apparatus
US10006720B2 (en) 2011-08-01 2018-06-26 Teledyne Scientific & Imaging, Llc System for using active and passive cooling for high power thermal management
US9155230B2 (en) * 2011-11-28 2015-10-06 Asetek Danmark A/S Cooling system for a server
US9921003B2 (en) * 2012-01-19 2018-03-20 Lockheed Martin Corporation Wickless heat pipe and thermal ground plane
US8913391B2 (en) * 2012-01-30 2014-12-16 Alcatel Lucent Board-level heat transfer apparatus for communication platforms
US9132645B2 (en) * 2012-11-29 2015-09-15 Palo Alto Research Center Incorporated Pulsating heat pipe spreader for ink jet printer
WO2014085993A1 (en) * 2012-12-05 2014-06-12 Telefonaktiebolaget L M Ericsson (Publ) System and method for regulating temperature of electronic component
US11006548B2 (en) * 2013-02-01 2021-05-11 Smart Embedded Computing, Inc. Method and device to provide uniform cooling in rugged environments
FR3007122B1 (en) * 2013-06-18 2017-09-08 Commissariat Energie Atomique COOLING OF ELECTRONIC AND / OR ELECTRICAL COMPONENTS BY PULSE CALODUC AND THERMAL CONDUCTION ELEMENT
EP2858464A1 (en) * 2013-10-03 2015-04-08 ABB Oy Electric apparatus
US9826662B2 (en) * 2013-12-12 2017-11-21 General Electric Company Reusable phase-change thermal interface structures
US9333599B2 (en) * 2013-12-20 2016-05-10 General Electric Company Electronics chassis and method of fabricating the same
JP6394331B2 (en) * 2013-12-27 2018-09-26 富士通株式会社 Cooling parts and electronic equipment
CN106575139A (en) * 2014-07-08 2017-04-19 Adc科技股份有限公司 Robust redundant-capable leak-resistant cooled enclosure wall
US9827697B2 (en) * 2014-08-29 2017-11-28 The Boeing Company Systems and methods for curing complex fiber-reinforced composite structures
CN104244683A (en) * 2014-10-09 2014-12-24 中国航空工业集团公司洛阳电光设备研究所 Electronic case
US10220725B2 (en) * 2015-05-13 2019-03-05 Ge Global Sourcing Llc System and method for passively cooling an enclosure
EP3144625B1 (en) * 2015-09-21 2018-07-04 ABB Schweiz AG Cooling assembly and method for manufacturing the same
EP3147621B1 (en) * 2015-09-24 2019-09-11 ABB Schweiz AG Cooling device and method for cooling at least two power electronic devices
US10383261B2 (en) * 2015-10-20 2019-08-13 Ge Global Sourcing Llc Heat transfer chassis and method for forming the same
US10136557B2 (en) * 2015-12-04 2018-11-20 General Electric Company Thermal management systems and methods for heat generating electronics
US9750160B2 (en) 2016-01-20 2017-08-29 Raytheon Company Multi-level oscillating heat pipe implementation in an electronic circuit card module
CN106028745B (en) * 2016-06-16 2019-04-30 北京纳源丰科技发展有限公司 A kind of radiator structure of the server cabinet based on secondary heat pipe
IT201600129385A1 (en) * 2016-12-21 2018-06-21 Leonardo Spa Two-phase passive fluid cooling system, particularly for cooling electronic equipment, such as avionics.
EP3361847B1 (en) * 2017-02-14 2021-03-31 ABB Schweiz AG A heat exchanger
US10178800B2 (en) * 2017-03-30 2019-01-08 Honeywell International Inc. Support structure for electronics having fluid passageway for convective heat transfer
EP3407693B1 (en) 2017-05-22 2022-11-09 Pfannenberg GmbH Heat exchanger for cooling an electronic enclosure
DE102017222148A1 (en) * 2017-12-07 2019-06-13 Siemens Mobility GmbH Fanless cooling system
US10527365B1 (en) * 2018-07-09 2020-01-07 International Business Machines Corporation Disconnect assembly for active cooling of packaged electronics
US10921869B2 (en) * 2019-06-27 2021-02-16 Intel Corporation Chassis embedded heat pipe
WO2021032229A1 (en) * 2019-08-19 2021-02-25 Lea Kelbsch Housing for heat-emitting components
US11112840B2 (en) * 2019-08-22 2021-09-07 Abaco Systems, Inc. Electronics chassis with oscillating heat pipe (OHP)
US11160184B2 (en) * 2019-10-08 2021-10-26 Hamilton Sundstrand Corporation Vehicle circuit card assembly
IT201900023076A1 (en) * 2019-12-05 2021-06-05 Provides Metalmeccanica S R L COOLING SYSTEM FOR DATA CENTER
EP4070631B1 (en) 2019-12-05 2023-04-26 Wieland Provides S.r.l. Cooling system of electronic systems, in particular for data centre
US11765871B2 (en) * 2020-03-26 2023-09-19 Ge Aviation Systems Llc Aircraft and method for thermal management
US11849539B2 (en) * 2020-08-13 2023-12-19 Toyota Motor Engineering & Manufacturing North America, Inc. Embedded cooling systems utilizing heat pipes
EP4001820A1 (en) * 2020-11-20 2022-05-25 Nokia Technologies Oy Oscillating heat pipe
DE102021213315A1 (en) 2021-11-26 2023-06-01 Robert Bosch Gesellschaft mit beschränkter Haftung cooler

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4921041A (en) * 1987-06-23 1990-05-01 Actronics Kabushiki Kaisha Structure of a heat pipe
WO2002102124A2 (en) * 2001-06-12 2002-12-19 Liebert Corporation Single or dual buss thermal transfer system
US20030037910A1 (en) * 2001-08-27 2003-02-27 Genrikh Smyrnov Method of action of the pulsating heat pipe, its construction and the devices on its base
EP1363481A2 (en) * 2002-05-10 2003-11-19 The Furukawa Electric Co., Ltd. Heat pipe circuit board
JP2004003816A (en) * 2002-04-02 2004-01-08 Mitsubishi Electric Corp Heat transport element, semiconductor device using heat transport element, and extra-atmospheric mobile using heat transport element
CN1684252A (en) * 2004-04-12 2005-10-19 中南大学 Circulation flowing pulsating heat pipe for cooling electronic device

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3651865A (en) * 1970-08-21 1972-03-28 Us Air Force Cooled electronic equipment mounting plate
JPS58180692A (en) * 1982-04-10 1983-10-22 高橋　勝昭 Delignification of pulp material
US4924041A (en) * 1989-04-26 1990-05-08 General Electric Company Universal circuit breaker interlock arrangement
US5283715A (en) 1992-09-29 1994-02-01 International Business Machines, Inc. Integrated heat pipe and circuit board structure
US5697428A (en) 1993-08-24 1997-12-16 Actronics Kabushiki Kaisha Tunnel-plate type heat pipe
US6104611A (en) * 1995-10-05 2000-08-15 Nortel Networks Corporation Packaging system for thermally controlling the temperature of electronic equipment
JPH10160367A (en) * 1996-12-02 1998-06-19 Hitachi Ltd Flat plate type heat pipe and electronic device, employing the same
JPH10209660A (en) * 1997-01-20 1998-08-07 Nippon Telegr & Teleph Corp <Ntt> Electronic device
CA2199239A1 (en) * 1997-03-05 1998-09-05 Trevor Zapach Electronic unit
JPH11168163A (en) * 1997-12-04 1999-06-22 Nippon Telegr & Teleph Corp <Ntt> Electronic circuit package cooling device
EP0946085A1 (en) * 1998-03-24 1999-09-29 Lucent Technologies Inc. Electronic apparatus having an environmentally sealed external enclosure
US6055157A (en) 1998-04-06 2000-04-25 Cray Research, Inc. Large area, multi-device heat pipe for stacked MCM-based systems
US6008987A (en) * 1998-04-21 1999-12-28 Nortel Networks Corporation Electronic circuitry
US6490159B1 (en) * 2000-09-06 2002-12-03 Visteon Global Tech., Inc. Electrical circuit board and method for making the same
US6657121B2 (en) * 2001-06-27 2003-12-02 Thermal Corp. Thermal management system and method for electronics system
US6388882B1 (en) 2001-07-19 2002-05-14 Thermal Corp. Integrated thermal architecture for thermal management of high power electronics
US6674643B2 (en) * 2001-08-09 2004-01-06 International Business Machines Corporation Thermal connector for transferring heat between removable printed circuit boards
JP3896840B2 (en) * 2001-12-13 2007-03-22 ソニー株式会社 COOLING DEVICE, ELECTRONIC DEVICE DEVICE, AND COOLING DEVICE MANUFACTURING METHOD
US6643132B2 (en) * 2002-01-04 2003-11-04 Intel Corporation Chassis-level thermal interface component for transfer of heat from an electronic component of a computer system
US6804117B2 (en) 2002-08-14 2004-10-12 Thermal Corp. Thermal bus for electronics systems
US20050174735A1 (en) * 2003-08-26 2005-08-11 Nagui Mankaruse High performance cooling systems
JP4408224B2 (en) * 2004-01-29 2010-02-03 富士通株式会社 Housing with heat dissipation function
US7193850B2 (en) * 2004-08-31 2007-03-20 Hamilton Sundstrand Corporation Integrated heat removal and vibration damping for avionic equipment

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4921041A (en) * 1987-06-23 1990-05-01 Actronics Kabushiki Kaisha Structure of a heat pipe
WO2002102124A2 (en) * 2001-06-12 2002-12-19 Liebert Corporation Single or dual buss thermal transfer system
US20030037910A1 (en) * 2001-08-27 2003-02-27 Genrikh Smyrnov Method of action of the pulsating heat pipe, its construction and the devices on its base
JP2004003816A (en) * 2002-04-02 2004-01-08 Mitsubishi Electric Corp Heat transport element, semiconductor device using heat transport element, and extra-atmospheric mobile using heat transport element
EP1363481A2 (en) * 2002-05-10 2003-11-19 The Furukawa Electric Co., Ltd. Heat pipe circuit board
CN1684252A (en) * 2004-04-12 2005-10-19 中南大学 Circulation flowing pulsating heat pipe for cooling electronic device

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
DATABASE INSPEC [online] THE INSTITUTION OF ELECTRICAL ENGINEERS, STEVENAGE, GB; 2004, KARIMI G ET AL: "Review and assessment of Pulsating Heat Pipe mechanism for high heat flux electronic cooling", XP002409418, Database accession no. 8117888 *
THE NINTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS 1-4 JUNE 2004 LAS VEGAS, NV, USA, vol. 2, 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) IEEE Piscataway, NJ, USA, pages 52 - 59 Vol.2, ISBN: 0-7803-8357-5 *

Also Published As

Publication number Publication date
US7345877B2 (en) 2008-03-18
JP4881879B2 (en) 2012-02-22
CN101095386A (en) 2007-12-26
ATE512573T1 (en) 2011-06-15
EP1834515A2 (en) 2007-09-19
CN101095386B (en) 2012-06-13
US20060146496A1 (en) 2006-07-06
EP1834515B1 (en) 2011-06-08
EP1834515B2 (en) 2019-09-18
JP2008527709A (en) 2008-07-24
WO2006073553A2 (en) 2006-07-13

Similar Documents

Publication Publication Date Title
WO2006073553A3 (en) Cooling apparatus, system, and associated method
GB2431777B (en) Impingement cooling of components in an electronic system
WO2003090278A3 (en) Dual-sided heat removal system
TWI371997B (en) Printed wiring board and method for manufacturing the same
WO2005104314A3 (en) Method for production of electronic and optoelectronic circuits
EP2020024A4 (en) Substrate transfer equipment and high speed substrate processing system using the same
AU2003260274A1 (en) Printed circuit board and method for producing the same
WO2008086027A3 (en) Printed circuit board retaining device
EP2071907A4 (en) Flex-rigid printed circuit board, and method for manufacturing the flex-rigid printed circuit board
WO2006099936A3 (en) Device and method for determining the temperature of a heat sink
EP1643817A4 (en) Etching solution, method of etching and printed wiring board
WO2007118831A3 (en) Electronic component module
WO2006077167A3 (en) Method for the continuous laying of a conductor on a printed circuit board and device for carrying out said method
WO2005069828A3 (en) Thermal protection for electronic components during processing
HK1073965A1 (en) Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module
EP1307075A3 (en) Prepreg and circuit board and method for manufacturing the same
ATE557576T1 (en) CIRCUIT BOARD WITH ELECTRONIC COMPONENT
WO2008157143A3 (en) Edge connection structure for printed circuit boards
GB0322290D0 (en) Circuit board support arrangement,method,and method for using the same
EP1542518A4 (en) Board for printed wiring, printed wiring board, and method for manufacturing them
WO2007119123A3 (en) Interconnects and heat dissipators based on nanostructures
TWI316174B (en) Heat-sink backing plate module, circuit board, and electronic apparatus having the same
EP2007931A4 (en) Polyimide substrate and method of manufacturing printed wiring board using the same
EP1722018A4 (en) Double glass cloth, and prepreg and substrate for printed wiring board using the glass cloth
GB2448270B (en) Circuit board and radiating heat system for circuit board

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 2005851466

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 200580045847.0

Country of ref document: CN

WWE Wipo information: entry into national phase

Ref document number: 2007550364

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

WWP Wipo information: published in national office

Ref document number: 2005851466

Country of ref document: EP