WO2006081286A8 - Multi-layer polishing pad for low-pressure polishing - Google Patents

Multi-layer polishing pad for low-pressure polishing

Info

Publication number
WO2006081286A8
WO2006081286A8 PCT/US2006/002599 US2006002599W WO2006081286A8 WO 2006081286 A8 WO2006081286 A8 WO 2006081286A8 US 2006002599 W US2006002599 W US 2006002599W WO 2006081286 A8 WO2006081286 A8 WO 2006081286A8
Authority
WO
WIPO (PCT)
Prior art keywords
polishing
layer
thickness
compressibility
low
Prior art date
Application number
PCT/US2006/002599
Other languages
French (fr)
Other versions
WO2006081286A3 (en
WO2006081286A2 (en
Inventor
Alain Duboust
Shou-Sung Chang
Wei Lu
Siew Neo
Yan Wang
Antoine Manens
Yongsik Moon
Original Assignee
Applied Materials Inc
Alain Duboust
Shou-Sung Chang
Wei Lu
Siew Neo
Yan Wang
Antoine Manens
Yongsik Moon
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc, Alain Duboust, Shou-Sung Chang, Wei Lu, Siew Neo, Yan Wang, Antoine Manens, Yongsik Moon filed Critical Applied Materials Inc
Priority to JP2007553196A priority Critical patent/JP2008528309A/en
Priority to CN2006800030867A priority patent/CN101107095B/en
Publication of WO2006081286A2 publication Critical patent/WO2006081286A2/en
Publication of WO2006081286A3 publication Critical patent/WO2006081286A3/en
Publication of WO2006081286A8 publication Critical patent/WO2006081286A8/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/046—Lapping machines or devices; Accessories designed for working plane surfaces using electric current
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/02—Backings, e.g. foils, webs, mesh fabrics

Abstract

A polishing pad has a polishing layer and a backing layer secured to the polishing layer. The polishing layer has a polishing surface, a first thickness, a first compressibility, and a hardness between about 40 to 80 Shore D. The backing layer has a second thickness equal to or less than the first thickness and has a second compressibility greater than the first compressibility. The first thickness, first compressibility, second thickness and second compressibility are such that the polishing surface deflects more than the thickness non-uniformity of the polishing layer under an applied pressure of 1.5 psi or less.
PCT/US2006/002599 2005-01-26 2006-01-24 Multi-layer polishing pad for low-pressure polishing WO2006081286A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007553196A JP2008528309A (en) 2005-01-26 2006-01-26 Multilayer polishing pad for low pressure polishing
CN2006800030867A CN101107095B (en) 2005-01-26 2006-01-26 Multi-layer polishing pad for low-pressure polishing

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/043,361 US8066552B2 (en) 2003-10-03 2005-01-26 Multi-layer polishing pad for low-pressure polishing
US11/043,361 2005-01-26

Publications (3)

Publication Number Publication Date
WO2006081286A2 WO2006081286A2 (en) 2006-08-03
WO2006081286A3 WO2006081286A3 (en) 2006-12-14
WO2006081286A8 true WO2006081286A8 (en) 2007-08-30

Family

ID=36499154

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/002599 WO2006081286A2 (en) 2005-01-26 2006-01-24 Multi-layer polishing pad for low-pressure polishing

Country Status (5)

Country Link
US (2) US8066552B2 (en)
JP (1) JP2008528309A (en)
CN (2) CN101143432B (en)
TW (1) TWI321141B (en)
WO (1) WO2006081286A2 (en)

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CN101107095A (en) 2008-01-16
CN101143432B (en) 2011-09-21
CN101143432A (en) 2008-03-19
US20100267318A1 (en) 2010-10-21
WO2006081286A3 (en) 2006-12-14
JP2008528309A (en) 2008-07-31
WO2006081286A2 (en) 2006-08-03
TW200628518A (en) 2006-08-16
US8066552B2 (en) 2011-11-29
TWI321141B (en) 2010-03-01
US20050221723A1 (en) 2005-10-06

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