WO2006105514A3 - Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides - Google Patents
Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides Download PDFInfo
- Publication number
- WO2006105514A3 WO2006105514A3 PCT/US2006/012394 US2006012394W WO2006105514A3 WO 2006105514 A3 WO2006105514 A3 WO 2006105514A3 US 2006012394 W US2006012394 W US 2006012394W WO 2006105514 A3 WO2006105514 A3 WO 2006105514A3
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- WO
- WIPO (PCT)
- Prior art keywords
- package
- assembly
- lower sides
- package assembly
- substrate surfaces
- Prior art date
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- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
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- H01L2924/19101—Disposition of discrete passive components
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- H01L2924/19106—Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate
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- H01L2924/19101—Disposition of discrete passive components
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- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Abstract
Stacked package assemblies include first and second stacked packages, each having at least one die affixed to, and electrically interconnected with, a die attach side of the package substrate. One package is inverted in relation to the other; that is, the die attach sides of the package substrates face one another, and the 'land' sides of the substrates face away from one another. Z-lnterconnectio of the packages is by wire bonds connecting the first and second package substrates. The assembly is encapsulated in such a way th both the second package substrate (one side of the assembly) and a portion of the first package substrate (on the opposite side of the assembly) are exposed, so that second level interconnection and interconnection with additional components may be made. In some embodiments the first package is a chip scale package, and the second package is a land grid array package.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020077025326A KR101172527B1 (en) | 2005-03-31 | 2006-03-31 | Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides |
JP2008504521A JP2008535273A (en) | 2005-03-31 | 2006-03-31 | Semiconductor stacked package assembly having substrate surfaces exposed on top and bottom surfaces |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
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US66727705P | 2005-03-31 | 2005-03-31 | |
US60/667,277 | 2005-03-31 | ||
US69218205P | 2005-06-20 | 2005-06-20 | |
US60/692,182 | 2005-06-20 | ||
US11/306,628 US7364945B2 (en) | 2005-03-31 | 2006-01-04 | Method of mounting an integrated circuit package in an encapsulant cavity |
US11/306,628 | 2006-01-04 |
Publications (2)
Publication Number | Publication Date |
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WO2006105514A2 WO2006105514A2 (en) | 2006-10-05 |
WO2006105514A3 true WO2006105514A3 (en) | 2007-09-20 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/US2006/012394 WO2006105514A2 (en) | 2005-03-31 | 2006-03-31 | Semiconductor stacked package assembly having exposed substrate surfaces on upper and lower sides |
Country Status (5)
Country | Link |
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US (1) | US7372141B2 (en) |
JP (1) | JP2008535273A (en) |
KR (1) | KR101172527B1 (en) |
TW (1) | TWI423401B (en) |
WO (1) | WO2006105514A2 (en) |
Families Citing this family (93)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6297548B1 (en) | 1998-06-30 | 2001-10-02 | Micron Technology, Inc. | Stackable ceramic FBGA for high thermal applications |
US6906416B2 (en) * | 2002-10-08 | 2005-06-14 | Chippac, Inc. | Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package |
WO2006118720A2 (en) * | 2005-03-31 | 2006-11-09 | Stats Chippac Ltd. | Semiconductor assembly including chip scale package and second substrate and having exposed substrate surfaces on upper and lower sides |
US7364945B2 (en) | 2005-03-31 | 2008-04-29 | Stats Chippac Ltd. | Method of mounting an integrated circuit package in an encapsulant cavity |
US7582960B2 (en) * | 2005-05-05 | 2009-09-01 | Stats Chippac Ltd. | Multiple chip package module including die stacked over encapsulated package |
US7394148B2 (en) | 2005-06-20 | 2008-07-01 | Stats Chippac Ltd. | Module having stacked chip scale semiconductor packages |
TWI268628B (en) * | 2005-08-04 | 2006-12-11 | Advanced Semiconductor Eng | Package structure having a stacking platform |
US7768125B2 (en) | 2006-01-04 | 2010-08-03 | Stats Chippac Ltd. | Multi-chip package system |
US7723146B2 (en) * | 2006-01-04 | 2010-05-25 | Stats Chippac Ltd. | Integrated circuit package system with image sensor system |
US8012867B2 (en) * | 2006-01-31 | 2011-09-06 | Stats Chippac Ltd | Wafer level chip scale package system |
US20070187836A1 (en) * | 2006-02-15 | 2007-08-16 | Texas Instruments Incorporated | Package on package design a combination of laminate and tape substrate, with back-to-back die combination |
US7981702B2 (en) * | 2006-03-08 | 2011-07-19 | Stats Chippac Ltd. | Integrated circuit package in package system |
US7986043B2 (en) * | 2006-03-08 | 2011-07-26 | Stats Chippac Ltd. | Integrated circuit package on package system |
US7501697B2 (en) * | 2006-03-17 | 2009-03-10 | Stats Chippac Ltd. | Integrated circuit package system |
TWI296148B (en) * | 2006-04-28 | 2008-04-21 | Advanced Semiconductor Eng | Stackable semiconductor package and the method for making the same |
TWI339436B (en) * | 2006-05-30 | 2011-03-21 | Advanced Semiconductor Eng | Stackable semiconductor package |
TWI298198B (en) * | 2006-05-30 | 2008-06-21 | Advanced Semiconductor Eng | Stackable semiconductor package |
TWI317993B (en) * | 2006-08-18 | 2009-12-01 | Advanced Semiconductor Eng | Stackable semiconductor package |
US20080093723A1 (en) * | 2006-10-19 | 2008-04-24 | Myers Todd B | Passive placement in wire-bonded microelectronics |
US7807508B2 (en) * | 2006-10-31 | 2010-10-05 | Tessera Technologies Hungary Kft. | Wafer-level fabrication of lidded chips with electrodeposited dielectric coating |
US7935568B2 (en) * | 2006-10-31 | 2011-05-03 | Tessera Technologies Ireland Limited | Wafer-level fabrication of lidded chips with electrodeposited dielectric coating |
US7687897B2 (en) * | 2006-12-28 | 2010-03-30 | Stats Chippac Ltd. | Mountable integrated circuit package-in-package system with adhesive spacing structures |
US8685792B2 (en) * | 2007-03-03 | 2014-04-01 | Stats Chippac Ltd. | Integrated circuit package system with interposer |
TWI335070B (en) * | 2007-03-23 | 2010-12-21 | Advanced Semiconductor Eng | Semiconductor package and the method of making the same |
US8409920B2 (en) * | 2007-04-23 | 2013-04-02 | Stats Chippac Ltd. | Integrated circuit package system for package stacking and method of manufacture therefor |
US8445325B2 (en) | 2007-05-04 | 2013-05-21 | Stats Chippac, Ltd. | Package-in-package using through-hole via die on saw streets |
US7829998B2 (en) | 2007-05-04 | 2010-11-09 | Stats Chippac, Ltd. | Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer |
US7723159B2 (en) * | 2007-05-04 | 2010-05-25 | Stats Chippac, Ltd. | Package-on-package using through-hole via die on saw streets |
US7777354B2 (en) * | 2007-06-05 | 2010-08-17 | Stats Chippac Ltd. | Integrated circuit package system with leaded package |
KR100874926B1 (en) * | 2007-06-07 | 2008-12-19 | 삼성전자주식회사 | Stack modules, cards containing them and systems containing them |
US20110024890A1 (en) | 2007-06-29 | 2011-02-03 | Stats Chippac, Ltd. | Stackable Package By Using Internal Stacking Modules |
SG148901A1 (en) * | 2007-07-09 | 2009-01-29 | Micron Technology Inc | Packaged semiconductor assemblies and methods for manufacturing such assemblies |
US7944047B2 (en) * | 2007-09-25 | 2011-05-17 | Qimonda Ag | Method and structure of expanding, upgrading, or fixing multi-chip package |
TW200917431A (en) * | 2007-10-05 | 2009-04-16 | Advanced Semiconductor Eng | Stacked-type chip package structure and method of fabricating the same |
US8110905B2 (en) * | 2007-12-17 | 2012-02-07 | Stats Chippac Ltd. | Integrated circuit packaging system with leadframe interposer and method of manufacture thereof |
US9236319B2 (en) * | 2008-02-29 | 2016-01-12 | Stats Chippac Ltd. | Stacked integrated circuit package system |
TWI358816B (en) * | 2008-03-19 | 2012-02-21 | Chipmos Technologies Inc | Chip package structure |
US8247894B2 (en) * | 2008-03-24 | 2012-08-21 | Stats Chippac Ltd. | Integrated circuit package system with step mold recess |
US7750454B2 (en) * | 2008-03-27 | 2010-07-06 | Stats Chippac Ltd. | Stacked integrated circuit package system |
SG142321A1 (en) | 2008-04-24 | 2009-11-26 | Micron Technology Inc | Pre-encapsulated cavity interposer |
US8310051B2 (en) | 2008-05-27 | 2012-11-13 | Mediatek Inc. | Package-on-package with fan-out WLCSP |
US7838975B2 (en) | 2008-05-27 | 2010-11-23 | Mediatek Inc. | Flip-chip package with fan-out WLCSP |
US8093722B2 (en) * | 2008-05-27 | 2012-01-10 | Mediatek Inc. | System-in-package with fan-out WLCSP |
US7683469B2 (en) * | 2008-05-30 | 2010-03-23 | Stats Chippac Ltd. | Package-on-package system with heat spreader |
TWI473553B (en) * | 2008-07-03 | 2015-02-11 | Advanced Semiconductor Eng | Chip package structure |
US8270176B2 (en) * | 2008-08-08 | 2012-09-18 | Stats Chippac Ltd. | Exposed interconnect for a package on package system |
US8063475B2 (en) * | 2008-09-26 | 2011-11-22 | Stats Chippac Ltd. | Semiconductor package system with through silicon via interposer |
US8803330B2 (en) * | 2008-09-27 | 2014-08-12 | Stats Chippac Ltd. | Integrated circuit package system with mounting structure |
US8723302B2 (en) * | 2008-12-11 | 2014-05-13 | Stats Chippac Ltd. | Integrated circuit package system with input/output expansion |
TWI499024B (en) * | 2009-01-07 | 2015-09-01 | Advanced Semiconductor Eng | Package-on-package device, semiconductor package and method for manufacturing the same |
US8012797B2 (en) * | 2009-01-07 | 2011-09-06 | Advanced Semiconductor Engineering, Inc. | Method for forming stackable semiconductor device packages including openings with conductive bumps of specified geometries |
US20100171206A1 (en) * | 2009-01-07 | 2010-07-08 | Chi-Chih Chu | Package-on-Package Device, Semiconductor Package, and Method for Manufacturing The Same |
US20100213589A1 (en) * | 2009-02-20 | 2010-08-26 | Tung-Hsien Hsieh | Multi-chip package |
US20100213588A1 (en) * | 2009-02-20 | 2010-08-26 | Tung-Hsien Hsieh | Wire bond chip package |
US8743561B2 (en) | 2009-08-26 | 2014-06-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer-level molded structure for package assembly |
TWI469283B (en) * | 2009-08-31 | 2015-01-11 | Advanced Semiconductor Eng | Package structure and package process |
US8222722B2 (en) * | 2009-09-11 | 2012-07-17 | St-Ericsson Sa | Integrated circuit package and device |
US8198131B2 (en) * | 2009-11-18 | 2012-06-12 | Advanced Semiconductor Engineering, Inc. | Stackable semiconductor device packages |
KR101038316B1 (en) * | 2009-11-25 | 2011-06-01 | 주식회사 하이닉스반도체 | Stacked semiconductor package and method of thereof |
TWI408785B (en) * | 2009-12-31 | 2013-09-11 | Advanced Semiconductor Eng | Semiconductor package |
US8569894B2 (en) | 2010-01-13 | 2013-10-29 | Advanced Semiconductor Engineering, Inc. | Semiconductor package with single sided substrate design and manufacturing methods thereof |
TWI419283B (en) * | 2010-02-10 | 2013-12-11 | Advanced Semiconductor Eng | Package structure |
CN102153045B (en) * | 2010-02-12 | 2015-03-11 | 矽品精密工业股份有限公司 | Packaging structure with micro-electromechanical element and manufacturing method thereof |
TWI411075B (en) | 2010-03-22 | 2013-10-01 | Advanced Semiconductor Eng | Semiconductor package and manufacturing method thereof |
US8278746B2 (en) | 2010-04-02 | 2012-10-02 | Advanced Semiconductor Engineering, Inc. | Semiconductor device packages including connecting elements |
US8624374B2 (en) | 2010-04-02 | 2014-01-07 | Advanced Semiconductor Engineering, Inc. | Semiconductor device packages with fan-out and with connecting elements for stacking and manufacturing methods thereof |
DE102010040370B4 (en) * | 2010-09-08 | 2016-10-06 | Robert Bosch Gmbh | MEMS microphone package |
TWI559480B (en) * | 2010-09-15 | 2016-11-21 | 史達晶片有限公司 | Stackable package by using internal stacking modules |
TWI451546B (en) | 2010-10-29 | 2014-09-01 | Advanced Semiconductor Eng | Stacked semiconductor package, semiconductor package thereof and method for making a semiconductor package |
TWI455265B (en) * | 2010-11-01 | 2014-10-01 | 矽品精密工業股份有限公司 | A package structure having a micro-electromechanical element and a manufacturing method thereof |
TWI445155B (en) | 2011-01-06 | 2014-07-11 | Advanced Semiconductor Eng | Stacked semiconductor package and method for making the same |
KR101828386B1 (en) * | 2011-02-15 | 2018-02-13 | 삼성전자주식회사 | Stacked package and method of manufacturing the same |
US9171792B2 (en) | 2011-02-28 | 2015-10-27 | Advanced Semiconductor Engineering, Inc. | Semiconductor device packages having a side-by-side device arrangement and stacking functionality |
US8481420B2 (en) * | 2011-03-15 | 2013-07-09 | Stats Chippac Ltd. | Integrated circuit packaging system with lead frame stacking module and method of manufacture thereof |
TWI419270B (en) * | 2011-03-24 | 2013-12-11 | Chipmos Technologies Inc | Package on package structure |
KR20130105175A (en) * | 2012-03-16 | 2013-09-25 | 삼성전자주식회사 | Semiconductor package having protective layer and method of forming the same |
JP6128993B2 (en) * | 2013-06-28 | 2017-05-17 | キヤノン株式会社 | Multilayer semiconductor device, printed circuit board, electronic device, and method of manufacturing multilayer semiconductor device |
KR101546575B1 (en) | 2013-08-12 | 2015-08-21 | 앰코 테크놀로지 코리아 주식회사 | Semiconductor Package And Fabricating Method Thereof |
CN104760920B (en) | 2014-01-02 | 2017-01-04 | 意法半导体研发(深圳)有限公司 | There is compact electronics packaging body and the correlation technique of MEMS IC |
US9527723B2 (en) * | 2014-03-13 | 2016-12-27 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming microelectromechanical systems (MEMS) package |
US20150282367A1 (en) * | 2014-03-27 | 2015-10-01 | Hans-Joachim Barth | Electronic assembly that includes stacked electronic components |
MY178559A (en) | 2014-07-07 | 2020-10-16 | Intel Corp | Package-on-package stacked microelectronic structures |
KR102307490B1 (en) | 2014-10-27 | 2021-10-05 | 삼성전자주식회사 | Semiconductor package |
US9802813B2 (en) * | 2014-12-24 | 2017-10-31 | Stmicroelectronics (Malta) Ltd | Wafer level package for a MEMS sensor device and corresponding manufacturing process |
DE102015008503A1 (en) * | 2015-07-03 | 2017-01-05 | TE Connectivity Sensors Germany GmbH | Electrical component and manufacturing method for producing such an electrical component |
KR101712837B1 (en) * | 2015-11-09 | 2017-03-07 | 주식회사 에스에프에이반도체 | method for manufacturing semiconductor package with package in package structure |
US9666539B1 (en) | 2015-12-03 | 2017-05-30 | International Business Machines Corporation | Packaging for high speed chip to chip communication |
FR3060851B1 (en) * | 2016-12-20 | 2018-12-07 | 3D Plus | OPTOELECTRONIC 3D IMAGING MODULE |
US10553542B2 (en) * | 2017-01-12 | 2020-02-04 | Amkor Technology, Inc. | Semiconductor package with EMI shield and fabricating method thereof |
US10381301B2 (en) * | 2017-02-08 | 2019-08-13 | Micro Technology, Inc. | Semiconductor package and method for fabricating the same |
KR102448238B1 (en) | 2018-07-10 | 2022-09-27 | 삼성전자주식회사 | Semiconductor package |
US11282778B2 (en) * | 2019-12-04 | 2022-03-22 | Advanced Semiconductor Engineering, Inc. | Interposer between a conductive substrate and plurality of semiconductor components |
US20210320085A1 (en) * | 2020-04-09 | 2021-10-14 | Nanya Technology Corporation | Semiconductor package |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6555917B1 (en) * | 2001-10-09 | 2003-04-29 | Amkor Technology, Inc. | Semiconductor package having stacked semiconductor chips and method of making the same |
US20040119153A1 (en) * | 2002-10-08 | 2004-06-24 | Chippac, Inc. | Semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package |
US20040201087A1 (en) * | 2003-01-03 | 2004-10-14 | Dong-Ho Lee | Stack package made of chip scale packages |
US6861288B2 (en) * | 2003-01-23 | 2005-03-01 | St Assembly Test Services, Ltd. | Stacked semiconductor packages and method for the fabrication thereof |
Family Cites Families (109)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5446620A (en) | 1990-08-01 | 1995-08-29 | Staktek Corporation | Ultra high density integrated circuit packages |
FR2670322B1 (en) | 1990-12-05 | 1997-07-04 | Matra Espace | SOLID STATE MEMORY MODULES AND MEMORY DEVICES CONTAINING SUCH MODULES |
US5222014A (en) | 1992-03-02 | 1993-06-22 | Motorola, Inc. | Three-dimensional multi-chip pad array carrier |
US5422435A (en) | 1992-05-22 | 1995-06-06 | National Semiconductor Corporation | Stacked multi-chip modules and method of manufacturing |
FR2694840B1 (en) | 1992-08-13 | 1994-09-09 | Commissariat Energie Atomique | Three-dimensional multi-chip module. |
US5340771A (en) | 1993-03-18 | 1994-08-23 | Lsi Logic Corporation | Techniques for providing high I/O count connections to semiconductor dies |
US5291061A (en) * | 1993-04-06 | 1994-03-01 | Micron Semiconductor, Inc. | Multi-chip stacked devices |
US5444296A (en) | 1993-11-22 | 1995-08-22 | Sun Microsystems, Inc. | Ball grid array packages for high speed applications |
US5436203A (en) | 1994-07-05 | 1995-07-25 | Motorola, Inc. | Shielded liquid encapsulated semiconductor device and method for making the same |
MY112145A (en) | 1994-07-11 | 2001-04-30 | Ibm | Direct attachment of heat sink attached directly to flip chip using flexible epoxy |
US5652185A (en) | 1995-04-07 | 1997-07-29 | National Semiconductor Corporation | Maximized substrate design for grid array based assemblies |
US5719440A (en) | 1995-12-19 | 1998-02-17 | Micron Technology, Inc. | Flip chip adaptor package for bare die |
US7166495B2 (en) | 1996-02-20 | 2007-01-23 | Micron Technology, Inc. | Method of fabricating a multi-die semiconductor package assembly |
US5952725A (en) | 1996-02-20 | 1999-09-14 | Micron Technology, Inc. | Stacked semiconductor devices |
US6075289A (en) | 1996-10-24 | 2000-06-13 | Tessera, Inc. | Thermally enhanced packaged semiconductor assemblies |
US5994166A (en) | 1997-03-10 | 1999-11-30 | Micron Technology, Inc. | Method of constructing stacked packages |
US5898219A (en) | 1997-04-02 | 1999-04-27 | Intel Corporation | Custom corner attach heat sink design for a plastic ball grid array integrated circuit package |
JPH10294423A (en) | 1997-04-17 | 1998-11-04 | Nec Corp | Semiconductor device |
US5982633A (en) | 1997-08-20 | 1999-11-09 | Compaq Computer Corporation | Opposed ball grid array mounting |
JP3834426B2 (en) | 1997-09-02 | 2006-10-18 | 沖電気工業株式会社 | Semiconductor device |
CA2218307C (en) | 1997-10-10 | 2006-01-03 | Gennum Corporation | Three dimensional packaging configuration for multi-chip module assembly |
JP3644662B2 (en) | 1997-10-29 | 2005-05-11 | 株式会社ルネサステクノロジ | Semiconductor module |
JPH11219984A (en) | 1997-11-06 | 1999-08-10 | Sharp Corp | Semiconductor device package, its manufacture and circuit board therefor |
US5899705A (en) | 1997-11-20 | 1999-05-04 | Akram; Salman | Stacked leads-over chip multi-chip module |
JP2000208698A (en) | 1999-01-18 | 2000-07-28 | Toshiba Corp | Semiconductor device |
TW432550B (en) | 1998-02-07 | 2001-05-01 | Siliconware Precision Industries Co Ltd | Method of encapsulating a chip |
SG75958A1 (en) * | 1998-06-01 | 2000-10-24 | Hitachi Ulsi Sys Co Ltd | Semiconductor device and a method of producing semiconductor device |
US6451624B1 (en) | 1998-06-05 | 2002-09-17 | Micron Technology, Inc. | Stackable semiconductor package having conductive layer and insulating layers and method of fabrication |
US6034875A (en) | 1998-06-17 | 2000-03-07 | International Business Machines Corporation | Cooling structure for electronic components |
US5977640A (en) | 1998-06-26 | 1999-11-02 | International Business Machines Corporation | Highly integrated chip-on-chip packaging |
JP2000058691A (en) | 1998-08-07 | 2000-02-25 | Sharp Corp | Millimeter wave semiconductor device |
US6201302B1 (en) | 1998-12-31 | 2001-03-13 | Sampo Semiconductor Corporation | Semiconductor package having multi-dies |
JP3685947B2 (en) | 1999-03-15 | 2005-08-24 | 新光電気工業株式会社 | Semiconductor device and manufacturing method thereof |
US6118176A (en) | 1999-04-26 | 2000-09-12 | Advanced Semiconductor Engineering, Inc. | Stacked chip assembly utilizing a lead frame |
US6890798B2 (en) | 1999-06-08 | 2005-05-10 | Intel Corporation | Stacked chip packaging |
US6238949B1 (en) | 1999-06-18 | 2001-05-29 | National Semiconductor Corporation | Method and apparatus for forming a plastic chip on chip package module |
JP3526788B2 (en) | 1999-07-01 | 2004-05-17 | 沖電気工業株式会社 | Method for manufacturing semiconductor device |
SG87046A1 (en) | 1999-08-17 | 2002-03-19 | Micron Technology Inc | Multi-chip module with stacked dice |
US6424033B1 (en) | 1999-08-31 | 2002-07-23 | Micron Technology, Inc. | Chip package with grease heat sink and method of making |
KR100533673B1 (en) | 1999-09-03 | 2005-12-05 | 세이코 엡슨 가부시키가이샤 | Semiconductor device, method of manufacture thereof, circuit board, and electronic device |
JP2001156212A (en) | 1999-09-16 | 2001-06-08 | Nec Corp | Resin sealed semiconductor device and producing method therefor |
JP2001094045A (en) | 1999-09-22 | 2001-04-06 | Seiko Epson Corp | Semiconductor device |
JP3485507B2 (en) | 1999-10-25 | 2004-01-13 | 沖電気工業株式会社 | Semiconductor device |
JP2001127246A (en) | 1999-10-29 | 2001-05-11 | Fujitsu Ltd | Semiconductor device |
US6376904B1 (en) | 1999-12-23 | 2002-04-23 | Rambus Inc. | Redistributed bond pads in stacked integrated circuit die package |
KR100335717B1 (en) | 2000-02-18 | 2002-05-08 | 윤종용 | High Density Memory Card |
US6462421B1 (en) | 2000-04-10 | 2002-10-08 | Advanced Semicondcutor Engineering, Inc. | Multichip module |
JP2001308262A (en) | 2000-04-26 | 2001-11-02 | Mitsubishi Electric Corp | Resin-sealed bga type semiconductor device |
JP3701542B2 (en) | 2000-05-10 | 2005-09-28 | シャープ株式会社 | Semiconductor device and manufacturing method thereof |
TW445610B (en) | 2000-06-16 | 2001-07-11 | Siliconware Precision Industries Co Ltd | Stacked-die packaging structure |
TW459361B (en) | 2000-07-17 | 2001-10-11 | Siliconware Precision Industries Co Ltd | Three-dimensional multiple stacked-die packaging structure |
US6472758B1 (en) | 2000-07-20 | 2002-10-29 | Amkor Technology, Inc. | Semiconductor package including stacked semiconductor dies and bond wires |
JP2002040095A (en) | 2000-07-26 | 2002-02-06 | Nec Corp | Semiconductor device and mounting method thereof |
US6607937B1 (en) | 2000-08-23 | 2003-08-19 | Micron Technology, Inc. | Stacked microelectronic dies and methods for stacking microelectronic dies |
US6593648B2 (en) | 2000-08-31 | 2003-07-15 | Seiko Epson Corporation | Semiconductor device and method of making the same, circuit board and electronic equipment |
JP4570809B2 (en) | 2000-09-04 | 2010-10-27 | 富士通セミコンダクター株式会社 | Multilayer semiconductor device and manufacturing method thereof |
US6492726B1 (en) | 2000-09-22 | 2002-12-10 | Chartered Semiconductor Manufacturing Ltd. | Chip scale packaging with multi-layer flip chip arrangement and ball grid array interconnection |
JP2002118201A (en) | 2000-10-05 | 2002-04-19 | Hitachi Ltd | Semiconductor device and method for manufacturing the same |
TW459363B (en) | 2000-11-22 | 2001-10-11 | Kingpak Tech Inc | Integrated circuit stacking structure and the manufacturing method thereof |
JP3798620B2 (en) | 2000-12-04 | 2006-07-19 | 富士通株式会社 | Manufacturing method of semiconductor device |
US6340846B1 (en) | 2000-12-06 | 2002-01-22 | Amkor Technology, Inc. | Making semiconductor packages with stacked dies and reinforced wire bonds |
US6777819B2 (en) | 2000-12-20 | 2004-08-17 | Siliconware Precision Industries Co., Ltd. | Semiconductor package with flash-proof device |
US6734539B2 (en) | 2000-12-27 | 2004-05-11 | Lucent Technologies Inc. | Stacked module package |
JP2002208656A (en) | 2001-01-11 | 2002-07-26 | Mitsubishi Electric Corp | Semiconductor device |
US6388313B1 (en) | 2001-01-30 | 2002-05-14 | Siliconware Precision Industries Co., Ltd. | Multi-chip module |
JP2002231885A (en) | 2001-02-06 | 2002-08-16 | Mitsubishi Electric Corp | Semiconductor device |
JP2002261232A (en) * | 2001-03-01 | 2002-09-13 | Hitachi Ltd | Semiconductor device |
JP4780844B2 (en) | 2001-03-05 | 2011-09-28 | Okiセミコンダクタ株式会社 | Semiconductor device |
TW502408B (en) | 2001-03-09 | 2002-09-11 | Advanced Semiconductor Eng | Chip with chamfer |
JP2002280516A (en) * | 2001-03-19 | 2002-09-27 | Toshiba Corp | Semiconductor module |
SG108245A1 (en) | 2001-03-30 | 2005-01-28 | Micron Technology Inc | Ball grid array interposer, packages and methods |
US6400007B1 (en) | 2001-04-16 | 2002-06-04 | Kingpak Technology Inc. | Stacked structure of semiconductor means and method for manufacturing the same |
US6528408B2 (en) * | 2001-05-21 | 2003-03-04 | Micron Technology, Inc. | Method for bumped die and wire bonded board-on-chip package |
JP2002373969A (en) | 2001-06-15 | 2002-12-26 | Oki Electric Ind Co Ltd | Semiconductor device and method of manufacturing semiconductor device |
US6900528B2 (en) | 2001-06-21 | 2005-05-31 | Micron Technology, Inc. | Stacked mass storage flash memory package |
US6734552B2 (en) | 2001-07-11 | 2004-05-11 | Asat Limited | Enhanced thermal dissipation integrated circuit package |
US6451626B1 (en) | 2001-07-27 | 2002-09-17 | Charles W.C. Lin | Three-dimensional stacked semiconductor package |
KR100445073B1 (en) | 2001-08-21 | 2004-08-21 | 삼성전자주식회사 | Dual die package |
US6787916B2 (en) | 2001-09-13 | 2004-09-07 | Tru-Si Technologies, Inc. | Structures having a substrate with a cavity and having an integrated circuit bonded to a contact pad located in the cavity |
US6847105B2 (en) | 2001-09-21 | 2005-01-25 | Micron Technology, Inc. | Bumping technology in stacked die configurations |
US6599779B2 (en) | 2001-09-24 | 2003-07-29 | St Assembly Test Service Ltd. | PBGA substrate for anchoring heat sink |
TW523887B (en) | 2001-11-15 | 2003-03-11 | Siliconware Precision Industries Co Ltd | Semiconductor packaged device and its manufacturing method |
US6737750B1 (en) | 2001-12-07 | 2004-05-18 | Amkor Technology, Inc. | Structures for improving heat dissipation in stacked semiconductor packages |
US20030113952A1 (en) * | 2001-12-19 | 2003-06-19 | Mahesh Sambasivam | Underfill materials dispensed in a flip chip package by way of a through hole |
TW523894B (en) | 2001-12-24 | 2003-03-11 | Siliconware Precision Industries Co Ltd | Semiconductor device and its manufacturing method |
US6891276B1 (en) | 2002-01-09 | 2005-05-10 | Bridge Semiconductor Corporation | Semiconductor package device |
US7034388B2 (en) * | 2002-01-25 | 2006-04-25 | Advanced Semiconductor Engineering, Inc. | Stack type flip-chip package |
JP2003273317A (en) | 2002-03-19 | 2003-09-26 | Nec Electronics Corp | Semiconductor device and its manufacturing method |
JP3688249B2 (en) | 2002-04-05 | 2005-08-24 | Necエレクトロニクス株式会社 | Manufacturing method of semiconductor device |
JP3550391B2 (en) | 2002-05-15 | 2004-08-04 | 沖電気工業株式会社 | Semiconductor device and manufacturing method thereof |
US6906415B2 (en) | 2002-06-27 | 2005-06-14 | Micron Technology, Inc. | Semiconductor device assemblies and packages including multiple semiconductor devices and methods |
KR100442880B1 (en) | 2002-07-24 | 2004-08-02 | 삼성전자주식회사 | Stacked semiconductor module and manufacturing method thereof |
US7109574B2 (en) * | 2002-07-26 | 2006-09-19 | Stmicroelectronics, Inc. | Integrated circuit package with exposed die surfaces and auxiliary attachment |
US7132311B2 (en) * | 2002-07-26 | 2006-11-07 | Intel Corporation | Encapsulation of a stack of semiconductor dice |
US6838761B2 (en) | 2002-09-17 | 2005-01-04 | Chippac, Inc. | Semiconductor multi-package module having wire bond interconnect between stacked packages and having electrical shield |
US20040061213A1 (en) * | 2002-09-17 | 2004-04-01 | Chippac, Inc. | Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages |
US7053476B2 (en) * | 2002-09-17 | 2006-05-30 | Chippac, Inc. | Semiconductor multi-package module having package stacked over die-down flip chip ball grid array package and having wire bond interconnect between stacked packages |
US7064426B2 (en) * | 2002-09-17 | 2006-06-20 | Chippac, Inc. | Semiconductor multi-package module having wire bond interconnect between stacked packages |
US7034387B2 (en) * | 2003-04-04 | 2006-04-25 | Chippac, Inc. | Semiconductor multipackage module including processor and memory package assemblies |
JP2004134591A (en) * | 2002-10-10 | 2004-04-30 | Renesas Technology Corp | Method for manufacturing semiconductor integrated circuit device |
TW567601B (en) | 2002-10-18 | 2003-12-21 | Siliconware Precision Industries Co Ltd | Module device of stacked semiconductor package and method for fabricating the same |
SG114585A1 (en) * | 2002-11-22 | 2005-09-28 | Micron Technology Inc | Packaged microelectronic component assemblies |
TW576549U (en) * | 2003-04-04 | 2004-02-11 | Advanced Semiconductor Eng | Multi-chip package combining wire-bonding and flip-chip configuration |
US6818980B1 (en) | 2003-05-07 | 2004-11-16 | Asat Ltd. | Stacked semiconductor package and method of manufacturing the same |
TWI299551B (en) | 2003-06-25 | 2008-08-01 | Via Tech Inc | Quad flat no-lead type chip carrier |
US6930378B1 (en) * | 2003-11-10 | 2005-08-16 | Amkor Technology, Inc. | Stacked semiconductor die assembly having at least one support |
KR100564585B1 (en) * | 2003-11-13 | 2006-03-28 | 삼성전자주식회사 | Double stacked BGA package and multi-stacked BGA package |
US20060138631A1 (en) * | 2003-12-31 | 2006-06-29 | Advanced Semiconductor Engineering, Inc. | Multi-chip package structure |
US20060065958A1 (en) * | 2004-09-29 | 2006-03-30 | Pei-Haw Tsao | Three dimensional package and packaging method for integrated circuits |
-
2006
- 2006-03-31 US US11/395,529 patent/US7372141B2/en active Active
- 2006-03-31 TW TW095111573A patent/TWI423401B/en active
- 2006-03-31 KR KR1020077025326A patent/KR101172527B1/en active IP Right Grant
- 2006-03-31 JP JP2008504521A patent/JP2008535273A/en active Pending
- 2006-03-31 WO PCT/US2006/012394 patent/WO2006105514A2/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6555917B1 (en) * | 2001-10-09 | 2003-04-29 | Amkor Technology, Inc. | Semiconductor package having stacked semiconductor chips and method of making the same |
US20040119153A1 (en) * | 2002-10-08 | 2004-06-24 | Chippac, Inc. | Semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) package |
US20040201087A1 (en) * | 2003-01-03 | 2004-10-14 | Dong-Ho Lee | Stack package made of chip scale packages |
US6861288B2 (en) * | 2003-01-23 | 2005-03-01 | St Assembly Test Services, Ltd. | Stacked semiconductor packages and method for the fabrication thereof |
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KR101172527B1 (en) | 2012-08-10 |
US7372141B2 (en) | 2008-05-13 |
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TWI423401B (en) | 2014-01-11 |
US20060220209A1 (en) | 2006-10-05 |
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WO2006105514A2 (en) | 2006-10-05 |
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