WO2006111906A3 - Illumination system comprising a red-emitting ceramic luminescence converter - Google Patents
Illumination system comprising a red-emitting ceramic luminescence converter Download PDFInfo
- Publication number
- WO2006111906A3 WO2006111906A3 PCT/IB2006/051164 IB2006051164W WO2006111906A3 WO 2006111906 A3 WO2006111906 A3 WO 2006111906A3 IB 2006051164 W IB2006051164 W IB 2006051164W WO 2006111906 A3 WO2006111906 A3 WO 2006111906A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- group
- luminescence converter
- light
- red
- radiation source
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7783—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals one of which being europium
- C09K11/7784—Chalcogenides
- C09K11/7787—Oxides
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/50—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on rare-earth compounds
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/50—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on rare-earth compounds
- C04B35/505—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on rare-earth compounds based on yttrium oxide
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3224—Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3224—Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
- C04B2235/3225—Yttrium oxide or oxide-forming salts thereof
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3294—Antimony oxides, antimonates, antimonites or oxide forming salts thereof, indium antimonate
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3298—Bismuth oxides, bismuthates or oxide forming salts thereof, e.g. zinc bismuthate
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
- C04B2235/5445—Particle size related information expressed by the size of the particles or aggregates thereof submicron sized, i.e. from 0,1 to 1 micron
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
- C04B2235/9646—Optical properties
- C04B2235/9653—Translucent or transparent ceramics other than alumina
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Structural Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Luminescent Compositions (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/911,677 US20080191609A1 (en) | 2005-04-19 | 2006-04-13 | Illumination System Comprising a Red-Emitting Ceramic Luminescence Converter |
EP06727932A EP1875780A2 (en) | 2005-04-19 | 2006-04-13 | Illumination system comprising a red-emitting ceramic luminescence converter |
JP2008507235A JP2008537002A (en) | 2005-04-19 | 2006-04-13 | Lighting system consisting of a ceramic luminescence converter that emits red light |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05103125.0 | 2005-04-19 | ||
EP05103125 | 2005-04-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2006111906A2 WO2006111906A2 (en) | 2006-10-26 |
WO2006111906A3 true WO2006111906A3 (en) | 2007-02-15 |
Family
ID=37115532
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2006/051164 WO2006111906A2 (en) | 2005-04-19 | 2006-04-13 | Illumination system comprising a red-emitting ceramic luminescence converter |
Country Status (6)
Country | Link |
---|---|
US (1) | US20080191609A1 (en) |
EP (1) | EP1875780A2 (en) |
JP (1) | JP2008537002A (en) |
CN (1) | CN100486397C (en) |
TW (1) | TW200705716A (en) |
WO (1) | WO2006111906A2 (en) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090000480A1 (en) * | 2005-12-23 | 2009-01-01 | Zissis Dardas | Composite Palladium Membrane Having Long-Term Stability for Hydrogen Separation |
ATE526382T1 (en) * | 2007-02-07 | 2011-10-15 | Koninkl Philips Electronics Nv | LIGHTING SYSTEM WITH A MONOLITHIC CERAMIC COMPOUND LUMINESCENCE CONVERTER |
JP2008231218A (en) * | 2007-03-20 | 2008-10-02 | Nippon Electric Glass Co Ltd | Phosphor material and white light-emitting diode |
KR100900866B1 (en) * | 2007-05-09 | 2009-06-04 | 삼성전자주식회사 | Light emitting diode device using nanocrystal-meal oxide composite and preparation method thereof |
US20100148194A1 (en) * | 2007-06-25 | 2010-06-17 | Jen-Shyan Chen | Light-emitting diode illuminating apparatus |
US7863635B2 (en) | 2007-08-07 | 2011-01-04 | Cree, Inc. | Semiconductor light emitting devices with applied wavelength conversion materials |
EP2203539B1 (en) * | 2007-10-15 | 2011-07-20 | Philips Intellectual Property & Standards GmbH | Light emitting device comprising a multiphase sialon-based ceramic material |
ATE529496T1 (en) * | 2007-12-03 | 2011-11-15 | Koninkl Philips Electronics Nv | CERAMIC MATERIAL FOR LEDS WITH REDUCED SPREADING AND METHOD FOR THE PRODUCTION THEREOF |
US7868340B2 (en) * | 2008-05-30 | 2011-01-11 | Bridgelux, Inc. | Method and apparatus for generating white light from solid state light emitting devices |
US20100033091A1 (en) * | 2008-08-08 | 2010-02-11 | Glory Science Co., Ltd. | Light emitting unit and method of manufacturing the light emitting unit |
DE102008045331A1 (en) * | 2008-09-01 | 2010-03-04 | Osram Opto Semiconductors Gmbh | Optoelectronic component |
US20120092853A1 (en) * | 2009-06-23 | 2012-04-19 | Koito Manufacturing Co., Ltd. | Light emitting module |
CN102449378A (en) * | 2009-11-06 | 2012-05-09 | 松下电器产业株式会社 | Spot light source and bulb-type light source |
US8829777B2 (en) | 2010-09-27 | 2014-09-09 | Osram Sylvania Inc. | Ceramic wavelength converter and LED light source containing same |
BR112013010836A2 (en) | 2010-11-01 | 2019-09-24 | Genoscience Pharma | hcv ns3 protease specific inhibitors |
WO2012176149A1 (en) | 2011-06-23 | 2012-12-27 | Panmed Ltd. | Treatment of hepatitis c virus |
EP2792215A1 (en) * | 2011-12-16 | 2014-10-22 | Marvell World Trade Ltd. | Current balancing circuits for light-emitting-diode-based illumination systems |
US9335531B2 (en) | 2011-12-30 | 2016-05-10 | Cree, Inc. | LED lighting using spectral notching |
WO2013138347A1 (en) * | 2012-03-12 | 2013-09-19 | Nitto Denko Corporation | Emissive compacts and method of making the same |
US8931922B2 (en) * | 2012-03-22 | 2015-01-13 | Osram Sylvania Inc. | Ceramic wavelength-conversion plates and light sources including the same |
US8597545B1 (en) * | 2012-07-18 | 2013-12-03 | Intematix Corporation | Red-emitting nitride-based calcium-stabilized phosphors |
JP6680670B2 (en) * | 2013-04-11 | 2020-04-15 | ルミレッズ ホールディング ベーフェー | Top emission type semiconductor light emitting device |
DE102013106573B4 (en) * | 2013-06-24 | 2021-12-09 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Radiation-emitting optoelectronic component, gas sensor with radiation-emitting optoelectronic component and method for producing a radiation-emitting optoelectronic component |
JP6236999B2 (en) * | 2013-08-29 | 2017-11-29 | 日亜化学工業株式会社 | Light emitting device |
JP6179857B2 (en) * | 2013-09-24 | 2017-08-16 | パナソニックIpマネジメント株式会社 | Light emitting device |
US9960322B2 (en) * | 2014-04-23 | 2018-05-01 | Cree, Inc. | Solid state lighting devices incorporating notch filtering materials |
CN103996693B (en) * | 2014-04-24 | 2016-05-11 | 京东方科技集团股份有限公司 | Oled panel and preparation method thereof, display unit |
US9698315B2 (en) * | 2014-10-31 | 2017-07-04 | Nichia Corporation | Light emitting device |
DE102014117448A1 (en) | 2014-11-27 | 2016-06-02 | Osram Gmbh | Optoelectronic semiconductor chip, method for producing an optoelectronic semiconductor chip, conversion element and phosphor for a conversion element |
DE102015110189A1 (en) * | 2015-06-24 | 2016-12-29 | Seaborough Ip I B.V. | phosphor ceramics |
US11015118B2 (en) | 2015-06-24 | 2021-05-25 | Seaborough Ip I B.V. | Phosphor ceramic |
MX2018011248A (en) * | 2016-03-16 | 2019-03-07 | Ge Lighting Solutions Llc | Led apparatus employing neodymium based materials with variable content of fluorine and oxygen. |
JP6912728B2 (en) * | 2018-03-06 | 2021-08-04 | 日亜化学工業株式会社 | Light emitting device and light source device |
TWI765569B (en) * | 2021-02-08 | 2022-05-21 | 健策精密工業股份有限公司 | Lead frame structure and manufacturing method thereof |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6294800B1 (en) * | 1998-02-06 | 2001-09-25 | General Electric Company | Phosphors for white light generation from UV emitting diodes |
US20020017635A1 (en) * | 2000-07-05 | 2002-02-14 | Shin-Etsu Chemical Co., Ltd. | Rare earth oxide, basic rare earth carbonate, making method, phospor, and ceramic |
US20040145308A1 (en) * | 2002-10-22 | 2004-07-29 | Osram Opto Semiconductors Gmbh | Light source having an LED and a luminescence conversion body and method for producing the luminescence conversion body |
WO2004065324A1 (en) * | 2003-01-20 | 2004-08-05 | Ube Industries, Ltd. | Ceramic composite material for optical conversion and use thereof |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001228809A (en) * | 1999-12-09 | 2001-08-24 | Fuji Photo Film Co Ltd | Display device |
US6497624B2 (en) * | 2001-01-09 | 2002-12-24 | Harmsway, Llc | Golf practice device |
DE10129464A1 (en) * | 2001-06-19 | 2003-01-02 | Philips Corp Intellectual Pty | Low pressure gas discharge lamp with mercury-free gas filling |
CN1879193A (en) * | 2003-11-11 | 2006-12-13 | 皇家飞利浦电子股份有限公司 | Low-pressure vapor discharge lamp with a mercury-free gas filling |
TWI250664B (en) * | 2004-01-30 | 2006-03-01 | South Epitaxy Corp | White light LED |
US8417215B2 (en) * | 2004-07-28 | 2013-04-09 | Koninklijke Philips Electronics N.V. | Method for positioning of wireless medical devices with short-range radio frequency technology |
-
2006
- 2006-04-13 JP JP2008507235A patent/JP2008537002A/en active Pending
- 2006-04-13 WO PCT/IB2006/051164 patent/WO2006111906A2/en not_active Application Discontinuation
- 2006-04-13 US US11/911,677 patent/US20080191609A1/en not_active Abandoned
- 2006-04-13 EP EP06727932A patent/EP1875780A2/en not_active Ceased
- 2006-04-13 CN CNB2006800129707A patent/CN100486397C/en not_active Expired - Fee Related
- 2006-04-14 TW TW095113558A patent/TW200705716A/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6294800B1 (en) * | 1998-02-06 | 2001-09-25 | General Electric Company | Phosphors for white light generation from UV emitting diodes |
US20020017635A1 (en) * | 2000-07-05 | 2002-02-14 | Shin-Etsu Chemical Co., Ltd. | Rare earth oxide, basic rare earth carbonate, making method, phospor, and ceramic |
US20040145308A1 (en) * | 2002-10-22 | 2004-07-29 | Osram Opto Semiconductors Gmbh | Light source having an LED and a luminescence conversion body and method for producing the luminescence conversion body |
WO2004065324A1 (en) * | 2003-01-20 | 2004-08-05 | Ube Industries, Ltd. | Ceramic composite material for optical conversion and use thereof |
Also Published As
Publication number | Publication date |
---|---|
US20080191609A1 (en) | 2008-08-14 |
JP2008537002A (en) | 2008-09-11 |
WO2006111906A2 (en) | 2006-10-26 |
EP1875780A2 (en) | 2008-01-09 |
CN100486397C (en) | 2009-05-06 |
CN101164379A (en) | 2008-04-16 |
TW200705716A (en) | 2007-02-01 |
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