WO2006116249A3 - Device packages having a iii-nitride based power semiconductor device - Google Patents
Device packages having a iii-nitride based power semiconductor device Download PDFInfo
- Publication number
- WO2006116249A3 WO2006116249A3 PCT/US2006/015376 US2006015376W WO2006116249A3 WO 2006116249 A3 WO2006116249 A3 WO 2006116249A3 US 2006015376 W US2006015376 W US 2006015376W WO 2006116249 A3 WO2006116249 A3 WO 2006116249A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- iii
- semiconductor device
- nitride based
- power semiconductor
- based power
- Prior art date
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Abstract
A semiconductor device package includes a die pad, a substrate disposed on the die pad, and a III-nitride based semiconductor device disposed on the substrate. The device package may also include a second semiconductor device disposed on the die pad or the substrate, which device may be electrically connected to the III-nitride based device to form a circuit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2006/015376 WO2006116249A2 (en) | 2005-04-25 | 2006-04-25 | Device packages having a iii-nitride based power semiconductor device |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US67461605P | 2005-04-25 | 2005-04-25 | |
US60/674,616 | 2005-04-25 | ||
PCT/US2006/015376 WO2006116249A2 (en) | 2005-04-25 | 2006-04-25 | Device packages having a iii-nitride based power semiconductor device |
Publications (2)
Publication Number | Publication Date |
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WO2006116249A2 WO2006116249A2 (en) | 2006-11-02 |
WO2006116249A3 true WO2006116249A3 (en) | 2007-10-18 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/US2006/015376 WO2006116249A2 (en) | 2005-04-25 | 2006-04-25 | Device packages having a iii-nitride based power semiconductor device |
Country Status (1)
Country | Link |
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WO (1) | WO2006116249A2 (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6162488A (en) * | 1996-05-14 | 2000-12-19 | Boston University | Method for closed loop control of chemical vapor deposition process |
US6255722B1 (en) * | 1998-06-11 | 2001-07-03 | International Rectifier Corp. | High current capacity semiconductor device housing |
US6380569B1 (en) * | 1999-08-10 | 2002-04-30 | Rockwell Science Center, Llc | High power unipolar FET switch |
US6597063B1 (en) * | 1997-12-08 | 2003-07-22 | Kabushiki Kaisha Toshiba | Package for semiconductor power device and method for assembling the same |
US20050012541A1 (en) * | 2000-02-08 | 2005-01-20 | The Furukawa Electric Co., Ltd. | Apparatus and circuit for power supply, and apparatus for controlling large current load |
-
2006
- 2006-04-25 WO PCT/US2006/015376 patent/WO2006116249A2/en active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6162488A (en) * | 1996-05-14 | 2000-12-19 | Boston University | Method for closed loop control of chemical vapor deposition process |
US6597063B1 (en) * | 1997-12-08 | 2003-07-22 | Kabushiki Kaisha Toshiba | Package for semiconductor power device and method for assembling the same |
US6255722B1 (en) * | 1998-06-11 | 2001-07-03 | International Rectifier Corp. | High current capacity semiconductor device housing |
US6380569B1 (en) * | 1999-08-10 | 2002-04-30 | Rockwell Science Center, Llc | High power unipolar FET switch |
US20050012541A1 (en) * | 2000-02-08 | 2005-01-20 | The Furukawa Electric Co., Ltd. | Apparatus and circuit for power supply, and apparatus for controlling large current load |
Also Published As
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WO2006116249A2 (en) | 2006-11-02 |
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