WO2007044710A3 - Mm-wave antenna using conventional ic packaging - Google Patents

Mm-wave antenna using conventional ic packaging Download PDF

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Publication number
WO2007044710A3
WO2007044710A3 PCT/US2006/039528 US2006039528W WO2007044710A3 WO 2007044710 A3 WO2007044710 A3 WO 2007044710A3 US 2006039528 W US2006039528 W US 2006039528W WO 2007044710 A3 WO2007044710 A3 WO 2007044710A3
Authority
WO
WIPO (PCT)
Prior art keywords
integrated circuit
intended
antenna
antenna connection
pad
Prior art date
Application number
PCT/US2006/039528
Other languages
French (fr)
Other versions
WO2007044710A2 (en
Inventor
Neil H E Weste
Original Assignee
Nhew R & D Pty Ltd
Neil H E Weste
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nhew R & D Pty Ltd, Neil H E Weste filed Critical Nhew R & D Pty Ltd
Priority to EP06825688A priority Critical patent/EP1941578A4/en
Publication of WO2007044710A2 publication Critical patent/WO2007044710A2/en
Publication of WO2007044710A3 publication Critical patent/WO2007044710A3/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
    • H01Q21/0093—Monolithic arrays
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
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    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
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    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
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    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
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    • H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
    • H01Q9/18—Vertical disposition of the antenna
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    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T29/49155—Manufacturing circuit on or in base

Abstract

An integrated circuit with an antenna and a method of forming the integrated circuit. The method includes, in an integrated circuit package, forming each bond to or from an integrated circuit pad that is intended to be an antenna connection to be elongated compared to other bonds, and arranged in an approximately perpendicular direction to the plane of the integrated circuit; encapsulating the top of the integrated circuit package with a dielectric material at a height grater than a desired antenna length; and milling the dielectric encapsulation down to a pre-selected and calibrated height, such that the elongated bond wire to/from the integrated circuit pad that is intended to be an antenna connection is severed, such that the approximately vertical bond wire to/from the integrated circuit pad that is intended to be an antenna connection forms a quarter wave monopole.
PCT/US2006/039528 2005-10-07 2006-10-06 Mm-wave antenna using conventional ic packaging WO2007044710A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP06825688A EP1941578A4 (en) 2005-10-07 2006-10-06 Mm-wave antenna using conventional ic packaging

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US72445705P 2005-10-07 2005-10-07
US60/724,457 2005-10-07
US11/539,112 US7586193B2 (en) 2005-10-07 2006-10-05 Mm-wave antenna using conventional IC packaging
US11/539,112 2006-10-05

Publications (2)

Publication Number Publication Date
WO2007044710A2 WO2007044710A2 (en) 2007-04-19
WO2007044710A3 true WO2007044710A3 (en) 2009-04-30

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/039528 WO2007044710A2 (en) 2005-10-07 2006-10-06 Mm-wave antenna using conventional ic packaging

Country Status (3)

Country Link
US (2) US7586193B2 (en)
EP (1) EP1941578A4 (en)
WO (1) WO2007044710A2 (en)

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US20090272714A1 (en) 2009-11-05
US20070103380A1 (en) 2007-05-10

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