WO2007077356A2 - Method for producing a microcircuit card, and associated microcircuit card - Google Patents

Method for producing a microcircuit card, and associated microcircuit card Download PDF

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Publication number
WO2007077356A2
WO2007077356A2 PCT/FR2006/002855 FR2006002855W WO2007077356A2 WO 2007077356 A2 WO2007077356 A2 WO 2007077356A2 FR 2006002855 W FR2006002855 W FR 2006002855W WO 2007077356 A2 WO2007077356 A2 WO 2007077356A2
Authority
WO
WIPO (PCT)
Prior art keywords
microcircuit
support film
card
manufacturing
attachment means
Prior art date
Application number
PCT/FR2006/002855
Other languages
French (fr)
Other versions
WO2007077356A3 (en
Inventor
François Launay
Original Assignee
Oberthur Technologies
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oberthur Technologies filed Critical Oberthur Technologies
Publication of WO2007077356A2 publication Critical patent/WO2007077356A2/en
Publication of WO2007077356A3 publication Critical patent/WO2007077356A3/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/70—Completely encapsulating inserts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/183—Connection portion, e.g. seal
    • H01L2924/18301—Connection portion, e.g. seal being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part

Definitions

  • the present invention relates to a microcircuit card manufacturing method and associated microcircuit cards.
  • the invention relates to a microcircuit card but also to memory cards such as a digital data storage memory card ("Secure Digital” card or SD card), a smartmedia card or a mini multimedia card.
  • a digital data storage memory card (“Secure Digital” card or SD card)
  • SD card Secure Digital
  • smartmedia card or a mini multimedia card.
  • Microcircuit cards essentially comprise a card body which is generally made of a plastic material and an electronic module.
  • the electronic module comprises in particular a microcircuit, or chip in which is realized an integrated circuit and a printed circuit element on which is fixed the chip or other and which defines external electrical contact pads.
  • the electronic module is fixed in the body of the card so that the electrical contact pads are flush with one of the main faces of the card body.
  • the specifications of such a microcircuit card are for example defined by the ISO 7816 standard.
  • the thickness of the card can be any. In the case of a microcircuit card according to ISO 7816, the thickness of the card is about 0.76 mm.
  • the card is adapted to be positioned in the card reader so that the contact pads of the card come into electrical contact with the connector of the card reader.
  • the microcircuit may comprise a flash memory, a fingerprint sensor, a screen, a solar sensor.
  • a widely used assembly method consists in producing the plastic support by processes for rolling or injection of thermoplastic materials and then in bonding the electronic module in a cavity of the plastic support made for this purpose. This operation is known as
  • FIG. 1 illustrates the inserting operation.
  • the electronic module 1 comprises external electrical contacts 2 adapted to be connected in a card reader and a microcircuit 3 comprising for example a microprocessor or a memory module.
  • the microcircuit 3 is connected to the external electrical contacts 2 by electrical connection wires 4.
  • a resin 5 is cast so as to protect the microcircuit 3 and the electrical connection wires 4.
  • a card body 6 plastic material is manufactured and comprises a cavity 7 adapted to receive the electronic module 1. The electronic module 1 is then fixed in the cavity 7.
  • This method is based on the use of a mold 21 having the shape of the body of the desired card as illustrated in FIG. 2. It comprises the insertion of an electronic module 22 into the mold 21 and the retention in place of the electronic module 22 so that the access face of the electronic module 22 is disposed against a wall of the mold. Then, a plastic material is introduced into the mold in such a way that the plastic material occupies all of the space limited by the walls of the mold not occupied by the electronic module.
  • the electronic module comprises anchoring means as shown in Figure 3.
  • the anchoring means 31 must be of small size and a particular shape, including trapezoidal type. These means 31 are, for example, made of protective resin module.
  • a support film is also used in this method of making a memory card to act as a mechanical support. Indeed, the outer face of the external contact pads of an electronic module is bonded to the support. The film is positioned in the mold and consequently, the electronic module is also positioned relative to the walls of the mold. After demolding the card, the media is removed from the card.
  • This method has the disadvantage of requiring a high cost of implementation. Indeed, the special shape of the protective resin of the electronic module involves the implementation of an expensive process.
  • this manufacturing method does not ensure that the electronic module can be removed to be fixed on another support.
  • FIG. 4 illustrates a particular electronic module obtained by arching the module.
  • This embodiment requires the use of a metal grid 41 to make the contacts of the module and not photogravure processes or deposition of conductive materials on flexible film as generally used in the production processes of electronic modules for mini-cards.
  • JP 60 189586 entitled "IC Gard carrier” a method for producing electronic memory cards in which electronic modules are fixed on a support sheet. The portion of the sheet comprising an electronic module is introduced into a mold by transfer and after the molding operation the sheet is cut to the dimensions of the card body.
  • This manufacturing method does not ensure that the electronic module can not be removed to be fixed on another support.
  • the invention proposes to remedy these disadvantages.
  • a method for manufacturing microcircuit cards comprising: preparing a support film comprising a microcircuit; providing the support film with hooking means; positioning the support film thus prepared in a mold comprising the imprint of the microcircuit card to be produced, the film being dimensioned so as to protrude beyond the mold to facilitate positioning of the microcircuit; and introducing into the mold a plastic material so that it fills the impression mold and interact with the attachment means so as to secure the support film to the molded card.
  • This method firstly makes it possible to position the microcircuit in the mold containing the imprint of the microcircuit card in an easy manner without requiring an additional cost to keep the microcircuit in position in the mold.
  • the presence of the film makes it easy to position the microcircuit at a given position and to maintain it during the step of introducing the plastic material into the mold.
  • this process makes it possible to increase the adhesion of the support film with the plastic material of the card so as to prevent the separation of the film from the rest of the card.
  • the microcircuit is kept anchored in the plastic material of the card.
  • this process makes delamination difficult.
  • the microcircuit and the attachment means are fixed on one and the same face of the support film, thus making it possible to protect access to the microcircuit.
  • the method also consists in fixing external contacts on the opposite face of the support film and establishing interconnections between terminals of the microcircuit and at least some of the external contacts.
  • the contacts are positioned on the opposite side of the microcircuit on the support film giving access to the electrical connection points of the microcircuit while keeping the microcircuit protected.
  • the face of the support film provided with the microcircuit comprises at least part of an antenna.
  • attachment means comprise mechanical anchoring means, these anchoring means being in particular tapered in the form of nails or in the form of hooks.
  • At least some of the mechanical anchoring means are produced by the deposition of tapered resin drops.
  • the drops of resin are cured.
  • at least some of the mechanical anchoring means are made by welding of metal excess thicknesses.
  • the attachment means are composed of adhesive blocks or adhesive.
  • the support film is provided with external contacts and the support film is a strip whose width is only slightly greater than the width of the pattern of the external contacts.
  • the support film is a strip whose width is barely greater than to the width of the pattern of the external contacts.
  • At least some of the attachment means are holes in the support film.
  • At least some of the holes are through. According to another particularity, at least some of the holes have variations of sections.
  • the latter is made of epoxy glass.
  • the latter is a material chosen from the group comprising polyethylene terephthalate and polyimide.
  • this is carried out according to a photogravure process.
  • this is carried out according to a conductive ink deposition method.
  • This feature makes it possible to optimize the costs of implementing such a support film.
  • the interconnections between terminals of the microcircuit and at least some of the external contacts are made by a wire soldering process.
  • the interconnections between terminals of the microcircuit and at least some of the external contacts are made by a flip-mounted chip process and comprise through vias through the support film.
  • the support film extends over 20 to 60% of the length of the microcircuit card.
  • the attachment means are distributed on either side of the microcircuit.
  • the protection of the microcircuit is increased.
  • the face of the support film provided with the microcircuit comprises at least part of an antenna
  • the method consists in fixing the attachment means at the outer periphery of the antenna
  • the attachment means are located on the support film near the periphery of the mold.
  • the attachment means are located on the entire periphery of the support film near the entire periphery of the mold.
  • the attachment means extend between the microcircuit and the periphery of the mold.
  • the molding is performed by a plastic injection method.
  • the support film constitutes a face of the microcircuit card.
  • the method further comprises fixing on both sides of the support film hooking means.
  • the molding is carried out on both sides of the support film.
  • the invention also provides a microcircuit card comprising:
  • a support film extending from one edge to the other of the card and comprising a microcircuit
  • the support film being provided with fastening means adapted to secure the support film to the body of the molded card.
  • FIG. 1 is a card made according to a method of embedding according to the state of the art
  • Figure 2 is a card manufactured by injection according to the state of the art
  • FIG. 3 is an electronic module comprising anchoring means according to the state of the art
  • Figure 4 is an electronic module whose contacts are arched according to the state of the art
  • FIG. 5a is a support film illustrating the module contacts according to the invention.
  • Figure 5b is an example of a map;
  • FIG. 6 is the second face of the support film illustrating the microcircuits associated with the contacts according to the invention.
  • Figure 7 is the support film comprising hooking means according to the invention
  • Figure 8 is a card mold into which the support film is inserted
  • FIG. 9a illustrates the front face of the cards according to the invention.
  • Figure 9b shows the back side of these cards
  • Figure 10 illustrates a series of cards after demolding card bodies
  • Figure 11 is a schematic representation of a microcircuit fixed on a support film and connected to the external contacts by wire soldering;
  • FIG. 12 is a diagrammatic representation of a microcircuit fixed on an up-and-reeded chip support film;
  • Figure 13a illustrates a first embodiment of the attachment means;
  • Figure 13b is a schematic representation of a card comprising a support film according to a first embodiment;
  • Figure 14a illustrates a second embodiment of the attachment means
  • Fig. 14b is a schematic representation of a card comprising a support film according to a second embodiment
  • FIG. 15a illustrates a third embodiment of the hooking means
  • Fig. 15b is a schematic representation of a card comprising a support film according to a third embodiment
  • Fig. 16 illustrates a closed cavity mold containing the support film
  • Fig. 17 illustrates an open cavity mold containing the support film
  • Fig. 18 is a schematic representation of a card in which the support film is flush with the card body
  • Fig. 19 is a schematic representation of a card in which the support film is covered with a plastic material
  • Figure 20a illustrates an implementation of the invention in a contactless card
  • Fig. 20b is a schematic representation of an embodiment of the support film for a contactless card
  • Fig. 21a is a schematic representation illustrating one embodiment of hole-based fastening means
  • Fig. 21b is a schematic representation illustrating a variation of the embodiment of hole-based fastening means
  • Figure 21c is a schematic representation illustrating a second variant of the embodiment of hooking means based on holes; and Fig. 21d is a schematic representation illustrating a third variation of the embodiment of hole-based fastening means.
  • the support film 50 is, in particular, of flexible material comprising a plurality of patterns 52, that is to say the configuration of the external contacts 53 corresponding to the desired microcircuits. These patterns are fixed on one side of the film 50 called external face 51.
  • the patterns 52 defining the contacts of the microcircuit are positioned at a distance from each other greater than or equal to d, the distance d being for example greater than the width I of a card
  • Microcircuits 62 comprising for example a microprocessor or a memory, are fixed on the face opposite to the external contacts and on the second face of the support film 50, also called internal face 61 of the support film 50 as illustrated in FIG. In this way, a microcircuit is adhered to the inner face of the film at each location of a pattern such that each external contact pattern comprises a microcircuit.
  • the microcircuit may be present in the thickness of the support film or in a cavity of the support film provided for this purpose.
  • the thickness of the support film is variable depending on the materials used. It is on average between 50 microns and 200 microns. Then, electrical connections 63 are made between the connection terminals of the microcircuit and at least one contact of an external contact pattern carried by the outer face 51 of the support film.
  • a strip formed by the support film 51 has on one of its faces a plurality of patterns, each pattern further comprising a microcircuit associated therewith on the opposite side of the film.
  • hooking means 71 are deposited as illustrated in FIG. These attachment means 71 are deposited, for example, in the gap between two microcircuits 62 on the inner face 61 of the support film 50.
  • the attachment means are, in particular, anchoring elements or bonding elements. . They make it possible to secure the support film and the body of the card, constituted for example by a molded plastic material.
  • the support film 50 thus prepared comprises, on the external face, external contact patterns 52, and on the internal face 61, microcircuits 62 connected to the external contacts 53, contact patterns, and hooking means 71.
  • This support film 50 is introduced into a mold 81 as illustrated in FIG.
  • the mold parts define an imprint that gives the external shape of the body of the desired card.
  • the backing film 50 is then positioned relative to the footprint so that the pattern of the contacts is positioned at the desired location in the card body.
  • the film is of such size that it overflows the mold to facilitate the positioning of the microcircuit.
  • the position is defined by the international ISO standard, notably in the ISO 7816 standard.
  • the film is positioned so that the attachment means are present in the volume defined by the cavity of the mold 81.
  • the location between two patterns is used to apply adhesion promoter elements.
  • the plastic material is then introduced into the mold to form the card body by the selected molding process.
  • the method can be injection of material into the impression, transfer molding or casting.
  • the material surrounds the microcircuit 62 with the exception of the contacts of the outer face of the film which is pressed onto a wall of the mold and interacts with the attachment means so as to reinforce the adhesion of the film with the body of the card.
  • the support film plays a dual role, it allows to anchor the microcircuit in such a way that the microcircuit can not be removed by taking off the film, and it ensures the precise positioning of the microcircuit with respect to the imprint of the mold and therefore with respect to the card body.
  • Figures 9a and 9b illustrate the band comprising the cards not yet cut, at the end of the demolding.
  • Figure 9a shows the front face of the cards on which the contacts are flush with the card body and the support film is attached to the front face of the card, while Figure 9b shows the back side of the cards.
  • the support film may in particular be a film made of epoxy glass, PET (polyethylene terephthalate) or polyimide.
  • the external contacts may be deposited on the outer face 51 of the support film 50, for example by photogravure, by deposition of conductive inks or by deposition of metal by catalytic or electrolytic processes.
  • the support film is a strip whose width is only slightly greater than the width of the pattern of the external contacts. In this way, the costs are optimized.
  • the support film can in particular extend over 20 to 60% of the length of the microcircuit card However, it is also possible to have a film of greater width as illustrated in Figure 10.
  • connection of the external contacts 53 and the microcircuit 62 through the support film 50 can be obtained by a wire soldering process as shown in FIG. 11.
  • the microcircuit 62 comprises in particular a printed circuit element on which there are connection terminals, a microprocessor or a memory module fixed on the printed circuit.
  • the microcircuit 62 is connected to external contacts 53 by conductive wires 111 which connect the connection terminals of the microcircuit to contact pads.
  • a coating material 112, for example, protective resin may be cast so as to surround the microcircuit and the son.
  • connection can also be made by a chip-up process ("Flip-chip" in English terminology) as shown in Figure 12.
  • the external contacts are positioned on the outer face 51 of the support film 50.
  • the microcircuit 62 On the inner face 61 of the support film 50, there is the microcircuit 62 which is positioned and which is connected to the conductive tracks 121.
  • conductive tracks 121 connect the microcircuit 62 and the external contacts 53.
  • the microcircuit 62 is fixed by an element such as glue 122.
  • the connection between the microcircuit and the conductive tracks is achieved by a conductive excess thickness 123 also called " bump "in English terminology.
  • attachment means in particular in the form of anchoring elements or gluing elements, ensure the adhesion of the microcircuit in the plastic support of the card.
  • attachment means can extend on either side of the microcircuit 62 and conductive tracks 121 over a length h less than or equal to the width of the card 54.
  • tapered resin drops in the form of "nails” or “hooks” 131 are deposited in such a way as to mechanically anchor the film with the body of the card as illustrated in FIG. 13a.
  • viscous resins can be used.
  • An embodiment of the hooked forms hooks is to subject the nozzle depositing the resin a lateral movement. Then the resin can be cured, in particular by a heating method.
  • FIG. 13b illustrates the presence on both sides of the microcircuit of the drops of resins serving to anchor the film with the body of the card.
  • the drops of resin are present, for example, over the entire support film which is fixed on the card 133 so as to increase the solidarity of the support film and the microcircuit with the body of the card.
  • the drops of resins are located on the support film near the periphery of the mold, and may comprise the entire periphery of the card support present at the periphery of the mold. This limits the risk of creating separation primers of the card support with the rest of the card body.
  • metal excess thicknesses 141 are welded to the inner face of the support film 50 as illustrated in FIGS. 14a and 14b.
  • the extra thicknesses of metal make it possible to mechanically anchor the film with the body of the card.
  • the metallic excess thicknesses are formed by the annealing of the end of a wire which is welded to the support by the unwinding of the wire in a capillary to a certain length.
  • oversize 141 are called “bumps” or “stud bumps” in English terminology.
  • a hook-shaped appearance of the extra thicknesses can also be obtained by a lateral movement of the capillary or by a tool that flattens the wire after welding.
  • This technique may require the prior deposition of weld material pads 142 on the inner face of the support film 50 in the gap between two consecutive microcircuits.
  • FIG. 14b illustrates the position of the hooking means on the card 54.
  • the attachment means are present for example on the contour of the film which is fixed on the card 54, and in particular on the proximity of the periphery of the mold.
  • the attachment means may also be located on the entire periphery of the card holder present at the periphery of the mold. This limits the risk of creating separation primers of the card support with the rest of the card body.
  • This adhesive deposit is made on the inner face 61 of the support film 50 between two microcircuits 62 connected to the conductive tracks 121.
  • Such a method makes it possible, either to ensure a purely mechanical connection between the fastening means and the body of the card, but to have a chemical bond, particularly intermolecular.
  • FIG. 15b illustrates the presence of glue or adhesive blocks 151 on a large part of the film which is connected to the body of the card 54.
  • the mold 161 includes the imprint of the desired card. It is illustrated in Figure 16 a closed cavity mold for injection molding or transfer.
  • the mold is composed of a fixed part and a movable part. These two parts define an imprint that gives the external shape of the desired card body.
  • the film is introduced in such a way that the microcircuit and the fastening elements are included in the cavity according to the imprint.
  • the pattern of the external contacts is positioned at the exact position defined by the specifications of the considered card. The position is in particular made by holding the support film at a given position.
  • the position is defined by the international standard ISO 7816.
  • the mold 161 is closed.
  • the plastic material is then injected into the cavity by an injection nozzle.
  • the plastic material fills the imprint surrounding the microcircuit with the exception of the external contacts positioned on the wall of the mold.
  • the attachment means will thus hang and interact with the body of the card.
  • the cavity defined by the cavity of the mold 171 is an open cavity as illustrated in FIG. 17.
  • the mold is opened and the body is demolded.
  • the product obtained appears as a succession of interconnected cards as illustrated in FIG.
  • the support film 50 can be flush with the surface of the body of the card 54.
  • the support film 50 on the surface of the body of the card 54 may be slightly set back and to be covered with a thin layer of plastic material 191. This configuration further promotes the adhesion of the film in the card.
  • each of the cards is separated by cutting from the support film, either immediately after the demolding operation or after having electrically tested the cards and / or having performed a graphic marking operation.
  • FIG 20a illustrates an embodiment in the case of a contactless card.
  • a contactless card 201 comprises in its body a microcircuit 202 and an antenna 203.
  • the manufacture of such a card according to the invention consists first of all in fixing on the inner face of the support film 200, the microcircuit 202, 203 antenna connected to the microcircuit and attachment means 204 as shown in Figure 20b.
  • the attachment means are in particular positioned at the periphery of the support film 200 to be embedded in the body of the card.
  • the attachment means may be at the outer periphery of the antenna.
  • fastening means 204 may be deposited on the outer face of the support film so as to increase the anchoring of the support film with the body of the card on both sides of the film.
  • the attachment means may be anchoring means and adhesive and adhesive elements as previously described.
  • the film is positioned in a mold. Then, a plastic material is introduced into the mold. This plastic material will be positioned on either side of the film so as to position the film and these components in the heart of the body of the card.
  • the attachment means may be holes in the support film as shown in Figures 21a, 21b, 21c and 21d. Indeed, as illustrated in 210 and 211, the attachment means may be holes going on either side of the thickness of the support film 210, or be blind 211.
  • the plastic material will fill these holes so as to secure the support film with the body of the card.
  • holes may also have sectional variations as illustrated in 212 and 213 of Figures 21c and 21d.
  • the holes may have a T-shape.
  • Other shapes can of course be imagined.
  • the hooking means in the form of holes of variable sections have the advantage of strengthening the adhesion of the support film with the card body.
  • attachment means can be combined during the manufacture of an integrated circuit card.

Abstract

The invention relates to a method for producing a microcircuit card. According to said method, a carrier film comprising a microcircuit is prepared; the film is provided with fixing means; the carrier film prepared in this way is positioned in a mould comprising the impression of the microcircuit card to be produced, the film being dimensioned in such a way as to hang out of the mould in order to facilitate the positioning of the microcircuit; and a plastic material is introduced into the mould such that it fills the impression of the mould and interacts with the fixing means in such a way as to fix the carrier film to the moulded card.

Description

PROCEDE DE FABRICATION D'UNE CARTE A MICROCIRCUIT, ET CARTE A MICROCIRCUIT ASSOCIEE METHOD FOR MANUFACTURING A MICROCIRCUIT CARD, AND ASSOCIATED MICROCIRCUIT CARD
La présente invention concerne un procédé de fabrication de carte à microcircuit et des cartes à microcircuit associées.The present invention relates to a microcircuit card manufacturing method and associated microcircuit cards.
L'invention se rapporte à une carte à microcircuit mais également aux cartes à mémoire telle qu'une carte mémoire de stockage de données numérique (carte « Secure Digital » ou carte SD), une carte smartmedia ou une mini carte multimédia.The invention relates to a microcircuit card but also to memory cards such as a digital data storage memory card ("Secure Digital" card or SD card), a smartmedia card or a mini multimedia card.
Les cartes à microcircuit comprennent essentiellement un corps de carte qui est réalisé en général en un matériau plastique et un module électronique.Microcircuit cards essentially comprise a card body which is generally made of a plastic material and an electronic module.
Le module électronique comprend notamment un microcircuit, ou puce dans lequel est réalisé un circuit intégré et un élément de circuit imprimé sur lequel est fixé le chip ou autre et qui définit des plages externes de contact électrique. Le module électronique est fixé dans le corps de la carte de telle manière que les plages de contact électrique affleurent une des faces principales du corps de carte. Les spécifications d'une telle carte à microcircuit sont par exemple définies par la norme ISO 7816.The electronic module comprises in particular a microcircuit, or chip in which is realized an integrated circuit and a printed circuit element on which is fixed the chip or other and which defines external electrical contact pads. The electronic module is fixed in the body of the card so that the electrical contact pads are flush with one of the main faces of the card body. The specifications of such a microcircuit card are for example defined by the ISO 7816 standard.
L'épaisseur de la carte peut être quelconque. Dans le cas d'une carte à microcircuit selon la norme ISO 7816, l'épaisseur de la carte est d'environ 0,76 mm. La carte est apte à être positionnée dans le lecteur de carte de telle manière que les plages de contact de la carte viennent en contact électrique avec le connecteur du lecteur de carte. Selon un autre exemple de réalisation, le microcircuit peut comprendre une mémoire flash, un capteur d'empreinte, un écran, un capteur solaire.The thickness of the card can be any. In the case of a microcircuit card according to ISO 7816, the thickness of the card is about 0.76 mm. The card is adapted to be positioned in the card reader so that the contact pads of the card come into electrical contact with the connector of the card reader. According to another exemplary embodiment, the microcircuit may comprise a flash memory, a fingerprint sensor, a screen, a solar sensor.
Une méthode d'assemblage très utilisée consiste à réaliser le support plastique par des procédés de laminage ou d'injection de matières thermoplastiques et ensuite à coller le module électronique dans une cavité du support plastique réalisée à cet effet. Cette opération est connue sous le termeA widely used assembly method consists in producing the plastic support by processes for rolling or injection of thermoplastic materials and then in bonding the electronic module in a cavity of the plastic support made for this purpose. This operation is known as
« encartage »."Inserting".
Ainsi la figure 1 illustre l'opération d'encartage. Le module électronique 1 comprend des contacts électriques externes 2 aptes à être mis en connexion dans un lecteur de carte et un microcircuit 3 comprenant par exemple un microprocesseur ou un module mémoire. Le microcircuit 3 est relié aux contacts électriques externes 2 par des fils de connexion électrique 4. Afin de protéger le module électronique, une résine 5 est coulée de sorte à protéger le microcircuit 3 et les fils de connexion électrique 4. Un corps de carte 6 en matière plastique est fabriqué et comprend une cavité 7 apte à accueillir le module électronique 1. Le module électronique 1 est ensuite fixé dans la cavité 7.Thus Figure 1 illustrates the inserting operation. The electronic module 1 comprises external electrical contacts 2 adapted to be connected in a card reader and a microcircuit 3 comprising for example a microprocessor or a memory module. The microcircuit 3 is connected to the external electrical contacts 2 by electrical connection wires 4. In order to protect the electronic module, a resin 5 is cast so as to protect the microcircuit 3 and the electrical connection wires 4. A card body 6 plastic material is manufactured and comprises a cavity 7 adapted to receive the electronic module 1. The electronic module 1 is then fixed in the cavity 7.
Afin de supprimer cette étape d'encartage, on connaît du document EP0277854 intitulé « Procédé de réalisation de cartes à mémoire et cartes obtenues par la mise en œuvre dudit procédé », un procédé de moulage par injection.In order to eliminate this step of inserting, document EP0277854 entitled "Process for producing memory cards and cards obtained by the implementation of said method" is known, an injection molding process.
Ce procédé est basé sur l'utilisation d'un moule 21 ayant la forme du corps de la carte souhaitée tel qu'illustré en figure 2. Il comprend l'insertion d'un module électronique 22 dans le moule 21 et le maintien en place du module électronique 22 de telle manière que la face d'accès du module électronique 22 soit disposée contre une paroi du moule. Ensuite, on introduit dans le moule un matériau plastique de telle manière que le matériau plastique occupe la totalité de l'espace limité par les parois du moule non occupé par le module électronique.This method is based on the use of a mold 21 having the shape of the body of the desired card as illustrated in FIG. 2. It comprises the insertion of an electronic module 22 into the mold 21 and the retention in place of the electronic module 22 so that the access face of the electronic module 22 is disposed against a wall of the mold. Then, a plastic material is introduced into the mold in such a way that the plastic material occupies all of the space limited by the walls of the mold not occupied by the electronic module.
Cependant, un tel système présente l'inconvénient de nécessiter des systèmes complexes de positionnement du module électronique dans le moule. De même, le maintien du module électronique en position dans le moule nécessite des méthodes particulières, notamment réalisées à partir de picots ou de pistons, ce qui a pour conséquence d'augmenter le coût des moules. Enfin, ce procédé ne permet pas d'assurer que le module électronique ne puisse pas être enlevé pour être fixé sur un autre support avec des informations frauduleuses concernant, par exemple, le porteur.However, such a system has the disadvantage of requiring complex positioning systems of the electronic module in the mold. Similarly, maintaining the electronic module in position in the mold requires special methods, in particular made from pins or pistons, which has the effect of increasing the cost of the molds. Finally, this method does not ensure that the electronic module can not be removed to be fixed on another medium with fraudulent information concerning, for example, the carrier.
Il est aussi connu un procédé de fabrication d'une carte à mémoire par surmoulage du corps de carte sur le module mémoire dans le document EP 0 340 100 intitulé « Procédé de réalisation de cartes à mémoire et cartes obtenues par ledit procédé ».There is also known a method of manufacturing a memory card by overmolding the card body on the memory module in the document EP 0 340 100 entitled "Process for producing memory cards and cards obtained by said method".
Pour ce faire, le module électronique comprend des moyens d'ancrage tel qu'illustré en figure 3. Les moyens d'ancrage 31 doivent être de faibles dimensions et d'une forme particulière, notamment de type trapézoïdale. Ces moyens 31 sont, par exemple, réalisés en résine de protection du module. Un film de support est également utilisé dans ce procédé de réalisation de carte à mémoire pour jouer le rôle de support mécanique. En effet, la face externe des plages externes de contact d'un module électronique est collée sur le support. Le film est positionné dans le moule et par voie de conséquence, le module électronique est également positionné par rapport aux parois du moule. Après démoulage de la carte, le support est retiré de la carte.To do this, the electronic module comprises anchoring means as shown in Figure 3. The anchoring means 31 must be of small size and a particular shape, including trapezoidal type. These means 31 are, for example, made of protective resin module. A support film is also used in this method of making a memory card to act as a mechanical support. Indeed, the outer face of the external contact pads of an electronic module is bonded to the support. The film is positioned in the mold and consequently, the electronic module is also positioned relative to the walls of the mold. After demolding the card, the media is removed from the card.
Ce procédé présente l'inconvénient de nécessiter un coût élevé de mis en œuvre. En effet, la forme spéciale de la résine de protection du module électronique implique la mise en œuvre d'un procédé onéreux.This method has the disadvantage of requiring a high cost of implementation. Indeed, the special shape of the protective resin of the electronic module involves the implementation of an expensive process.
De plus, ce procédé de fabrication ne permet pas d'assurer que le module électronique ne puisse être enlevé pour être fixé sur un autre support.In addition, this manufacturing method does not ensure that the electronic module can be removed to be fixed on another support.
Selon un autre mode de réalisation connu, la figure 4 illustre un module électronique particulier obtenu par cambrage du module. Ce mode de réalisation nécessite d'utiliser une grille métallique 41 pour réaliser les contacts du module et non des procédés de photogravure ou de dépôt de matériaux conducteurs sur film flexible comme généralement utilisé dans les procédés de réalisation de modules électroniques pour mini-cartes. Enfin, il est connu du document JP 60 189586 intitulé « IC Gard carrier », un procédé de réalisation de cartes à mémoire électronique dans lesquels des modules électroniques sont fixés sur une feuille support. La portion de la feuille comportant un module électronique est introduite dans un moule par transfert et après l'opération de moulage la feuille est découpée aux dimensions du corps de carte.According to another known embodiment, FIG. 4 illustrates a particular electronic module obtained by arching the module. This embodiment requires the use of a metal grid 41 to make the contacts of the module and not photogravure processes or deposition of conductive materials on flexible film as generally used in the production processes of electronic modules for mini-cards. Finally, it is known from JP 60 189586 entitled "IC Gard carrier", a method for producing electronic memory cards in which electronic modules are fixed on a support sheet. The portion of the sheet comprising an electronic module is introduced into a mold by transfer and after the molding operation the sheet is cut to the dimensions of the card body.
Ce procédé de fabrication ne permet pas d'assurer que le module électronique ne puisse être enlevé pour être fixé sur un autre support.This manufacturing method does not ensure that the electronic module can not be removed to be fixed on another support.
En effet, il suffit d'amorcer un décollement du film pour ensuite être en mesure de décoller l'ensemble du film même dans le cas où le module électronique serait bien ancré.Indeed, it suffices to initiate a detachment of the film and then be able to take off the entire film even if the electronic module is well anchored.
Ainsi, lorsqu'il est fabriqué une carte par moulage à partir d'un film, il faut s'assurer qu'une fois livrée au porteur, on ne peut séparer le film du reste de la carte, afin de garantir la sécurité requise par les cartes et d'offrir une certaine fiabilité de celle-ci.Thus, when a card is made by molding from a film, it must be ensured that once delivered to the wearer, the film can not be separated from the rest of the card, in order to guarantee the security required by the film. cards and offer some reliability of it.
L'invention propose de remédier à ces inconvénients. Pour cela, il propose un procédé de fabrication de cartes à microcircuit consistant à : préparer un film de support comprenant un microcircuit ; munir le film de support de moyens d'accrochage ; - positionner le film de support ainsi préparé dans un moule comportant l'empreinte de la carte à microcircuit à réaliser, le film étant dimensionné de manière à déborder du moule pour faciliter le positionnement du microcircuit ; et introduire dans le moule un matériau plastique pour que celui-ci remplisse l'empreinte du moule et interagisse avec les moyens d'accrochage de manière à solidariser le film de support à la carte moulé.The invention proposes to remedy these disadvantages. For this purpose, it proposes a method for manufacturing microcircuit cards, comprising: preparing a support film comprising a microcircuit; providing the support film with hooking means; positioning the support film thus prepared in a mold comprising the imprint of the microcircuit card to be produced, the film being dimensioned so as to protrude beyond the mold to facilitate positioning of the microcircuit; and introducing into the mold a plastic material so that it fills the impression mold and interact with the attachment means so as to secure the support film to the molded card.
Ce procédé permet tout d'abord de positionner le microcircuit dans le moule contenant l'empreinte de la carte à microcircuit de manière aisée sans nécessiter un surcoût pour maintenir le microcircuit en position dans le moule. En effet, la présence du film permet de positionner aisément le microcircuit à une position donnée et de le maintenir durant l'étape d'introduction du matériau plastique dans le moule. Ensuite, ce procédé permet d'accroître l'adhésion du film de support avec le matériau plastique de la carte de manière à empêcher la séparation du film du reste de la carte. Ainsi, le microcircuit est maintenu ancré dans le matériau plastique de la carte. Enfin, ce procédé rend difficile le délaminage.This method firstly makes it possible to position the microcircuit in the mold containing the imprint of the microcircuit card in an easy manner without requiring an additional cost to keep the microcircuit in position in the mold. Indeed, the presence of the film makes it easy to position the microcircuit at a given position and to maintain it during the step of introducing the plastic material into the mold. Then, this process makes it possible to increase the adhesion of the support film with the plastic material of the card so as to prevent the separation of the film from the rest of the card. Thus, the microcircuit is kept anchored in the plastic material of the card. Finally, this process makes delamination difficult.
Selon une caractéristique, le microcircuit et les moyens d'accrochage sont fixés sur une même face du film de support, permettant ainsi de protéger l'accès au microcircuit.According to one characteristic, the microcircuit and the attachment means are fixed on one and the same face of the support film, thus making it possible to protect access to the microcircuit.
Selon une autre caractéristique particulière, le procédé consiste en outre à fixer des contacts externes sur la face opposée du film de support et établir des interconnexions entre des bornes du microcircuit et au moins certains des contacts externes.According to another particular characteristic, the method also consists in fixing external contacts on the opposite face of the support film and establishing interconnections between terminals of the microcircuit and at least some of the external contacts.
Selon cette caractéristique, les contacts sont positionnés sur la face opposée du microcircuit sur le film de support donnant accès aux points de connexions électriques du microcircuit tout en maintenant protégé le microcircuit.According to this characteristic, the contacts are positioned on the opposite side of the microcircuit on the support film giving access to the electrical connection points of the microcircuit while keeping the microcircuit protected.
Selon une caractéristique, la face du film de support munie du microcircuit comprend au moins une partie d'une antenne.According to one characteristic, the face of the support film provided with the microcircuit comprises at least part of an antenna.
Selon une caractéristique, certains au moins des moyens d'accrochage comprennent des moyens d'ancrage mécanique, ces moyens d'ancrage étant notamment effilés en forme de clous ou en forme de crochets.According to one feature, at least some of the attachment means comprise mechanical anchoring means, these anchoring means being in particular tapered in the form of nails or in the form of hooks.
Selon une caractéristique, certains au moins des moyens d'ancrage mécanique sont réalisés par le dépôt de gouttes de résine effilées.According to one characteristic, at least some of the mechanical anchoring means are produced by the deposition of tapered resin drops.
De manière particulière, on fait durcir les gouttes de résine. Selon une autre caractéristique, certains au moins des moyens d'ancrage mécanique sont réalisés par soudure de surépaisseurs métalliques.In particular, the drops of resin are cured. According to another characteristic, at least some of the mechanical anchoring means are made by welding of metal excess thicknesses.
De manière particulière, préalablement à la soudure de surépaisseurs métalliques, on dépose des plages de matériau de soudure sur le film de support. Selon un mode d'accrochage chimique, les moyens d'accrochage sont composés de pavés de colle ou d'adhésif. Selon une caractéristique, le film de support est muni de contacts externes et le film de support est une bande dont la largeur est à peine supérieure à la largeur du motif des contacts externes le film de support est une bande dont la largeur est à peine supérieure à la largeur du motif des contacts externes.In a particular manner, prior to the welding of metal excess thicknesses, strips of solder material are deposited on the support film. According to a chemical mode of attachment, the attachment means are composed of adhesive blocks or adhesive. According to one characteristic, the support film is provided with external contacts and the support film is a strip whose width is only slightly greater than the width of the pattern of the external contacts. The support film is a strip whose width is barely greater than to the width of the pattern of the external contacts.
Selon encore une autre caractéristique particulière, certains au moins des moyens d'accrochage sont des trous dans le film de support.According to yet another particular characteristic, at least some of the attachment means are holes in the support film.
Selon une particularité, certains au moins des trous sont traversant. Selon une autre particularité, certains au moins des trous présentent des variations de sections.According to a feature, at least some of the holes are through. According to another particularity, at least some of the holes have variations of sections.
Selon un mode de réalisation du film de support, celui-ci est en verre époxy.According to one embodiment of the support film, the latter is made of epoxy glass.
Selon un second mode de réalisation du film de support, celui-ci est un matériau choisi dans le groupe comprenant le polyéthylène térephtalate et le polyimide.According to a second embodiment of the support film, the latter is a material chosen from the group comprising polyethylene terephthalate and polyimide.
Selon une première variante de fixation des contacts externes, celle-ci est réalisée selon un procédé de photogravure.According to a first variant for fixing the external contacts, this is carried out according to a photogravure process.
Selon une seconde variante de fixation des contacts externes, celle-ci est réalisée selon un procédé de dépôt d'encre conductrice.According to a second variant for fixing the external contacts, this is carried out according to a conductive ink deposition method.
Selon une troisième variante de fixation des contacts externes, celle-ci est réalisée par dépôt de métal par un procédé catalytique ou électrolytique.According to a third variant for fixing the external contacts, this is achieved by metal deposition by a catalytic or electrolytic process.
Cette caractéristique permet d'optimiser les coûts de la mise en œuvre d'un tel film de support.This feature makes it possible to optimize the costs of implementing such a support film.
Selon un mode de réalisation particulier, les interconnexions entre des bornes du microcircuit et au moins certains des contacts externes sont réalisés par un procédé de soudure filaire.According to a particular embodiment, the interconnections between terminals of the microcircuit and at least some of the external contacts are made by a wire soldering process.
Selon un autre mode de réalisation, les interconnexions entre des bornes du microcircuit et au moins certains des contacts externes sont réalisées par un procédé de puce montée retournée et comprennent des traversées métallisées au travers du film de support. Selon une caractéristique particulière, le film de support s'étend sur 20 à 60 % de la longueur de la carte à microcircuit.According to another embodiment, the interconnections between terminals of the microcircuit and at least some of the external contacts are made by a flip-mounted chip process and comprise through vias through the support film. According to one particular characteristic, the support film extends over 20 to 60% of the length of the microcircuit card.
Selon une autre caractéristique particulière, les moyens d'accrochage sont répartis de part et d'autre du microcircuit. Ainsi, on accroît la protection du microcircuit.According to another particular characteristic, the attachment means are distributed on either side of the microcircuit. Thus, the protection of the microcircuit is increased.
Selon une caractéristique, la face du film de support munie du microcircuit comprend au moins une partie d'une antenne, le procédé consiste à fixer les moyens d'accrochage en périphérie extérieure de l'antenneAccording to one characteristic, the face of the support film provided with the microcircuit comprises at least part of an antenna, the method consists in fixing the attachment means at the outer periphery of the antenna
Selon un mode de réalisation particulier, les moyens d'accrochage sont situés sur le film de support à proximité de la périphérie du moule.According to a particular embodiment, the attachment means are located on the support film near the periphery of the mold.
Selon une caractéristique particulière, les moyens d'accrochage sont situés sur toute la périphérie du film de support à proximité de toute la périphérie du moule.According to a particular characteristic, the attachment means are located on the entire periphery of the support film near the entire periphery of the mold.
Selon un autre mode de réalisation particulier, les moyens d'accrochage s'étendent entre le microcircuit et la périphérie du moule.According to another particular embodiment, the attachment means extend between the microcircuit and the periphery of the mold.
Préférentiellement, le moulage est réalisé par un procédé d'injection de matière plastique.Preferably, the molding is performed by a plastic injection method.
Dans un mode de réalisation particulier de l'invention, le film de support constitue une face de la carte à microcircuit. Selon un mode de réalisation particulier, le procédé consiste en outre à fixer sur les deux faces du film de support des moyens d'accrochage.In a particular embodiment of the invention, the support film constitutes a face of the microcircuit card. According to a particular embodiment, the method further comprises fixing on both sides of the support film hooking means.
Selon une caractéristique particulière, le moulage est réalisé sur les deux côtés du film de support.According to a particular characteristic, the molding is carried out on both sides of the support film.
Corrélativement, l'invention fournit également une carte à microcircuit comportant :Correlatively, the invention also provides a microcircuit card comprising:
- un corps de carte moulé,- a molded card body,
- un film de support s'étendant d'un bord à l'autre de la carte et comprenant un microcircuit,a support film extending from one edge to the other of the card and comprising a microcircuit,
- le film de support étant muni de moyens d'accrochage propres à solidariser le film de support au corps de la carte moulé.- The support film being provided with fastening means adapted to secure the support film to the body of the molded card.
Ce dispositif présente les mêmes avantages que le procédé de fabrication brièvement décrit ci-dessus. L'invention et les avantages qui en découlent apparaîtront plus clairement à la lecture de la description qui décrit des modes de réalisation donnés purement à titre d'exemples non-limitatifs, par référence aux dessins annexés dans lesquels : La figure 1 est une carte fabriquée selon un procédé d'encartage selon l'état de la technique ;This device has the same advantages as the manufacturing method briefly described above. The invention and the advantages thereof will appear more clearly on reading the description which describes embodiments given purely by way of non-limiting examples, with reference to the appended drawings in which: FIG. 1 is a card made according to a method of embedding according to the state of the art;
La figure 2 est une carte fabriquée par injection selon l'état de la technique ;Figure 2 is a card manufactured by injection according to the state of the art;
La figure 3 est un module électronique comprenant des moyens d'ancrage selon l'état de la technique ;FIG. 3 is an electronic module comprising anchoring means according to the state of the art;
La figure 4 est un module électronique dont les contacts sont cambrés selon l'état de la technique ;Figure 4 is an electronic module whose contacts are arched according to the state of the art;
La figure 5a est un film de support illustrant les contacts de modules selon l'invention ; La figure 5b est un exemple de carte ;FIG. 5a is a support film illustrating the module contacts according to the invention; Figure 5b is an example of a map;
La figure 6 est la seconde face du film de support illustrant les microcircuits associés aux contacts selon l'invention ;FIG. 6 is the second face of the support film illustrating the microcircuits associated with the contacts according to the invention;
La figure 7 est le film de support comprenant des moyens d'accrochage selon l'invention ; La figure 8 est un moule de carte dans lequel est introduit le film de support ;Figure 7 is the support film comprising hooking means according to the invention; Figure 8 is a card mold into which the support film is inserted;
La figure 9a illustre la face avant des cartes selon l'invention ;FIG. 9a illustrates the front face of the cards according to the invention;
La figure 9b illustre la face arrière de ces cartes ;Figure 9b shows the back side of these cards;
La figure 10 illustre une série de cartes après démoulage des corps de carte ;Figure 10 illustrates a series of cards after demolding card bodies;
La figure 11 est une représentation schématique d'un microcircuit fixé sur un film de support et relié aux contacts externes par soudure filaire ;Figure 11 is a schematic representation of a microcircuit fixed on a support film and connected to the external contacts by wire soldering;
La figure 12 est une représentation schématique d'un microcircuit fixé sur un film de support de type puce montée-retoumée ; La figure 13a illustre un premier mode de réalisation des moyens d'accrochage ; La figure 13b est une représentation schématique d'une carte comprenant un film de support selon un premier mode de réalisation ;FIG. 12 is a diagrammatic representation of a microcircuit fixed on an up-and-reeded chip support film; Figure 13a illustrates a first embodiment of the attachment means; Figure 13b is a schematic representation of a card comprising a support film according to a first embodiment;
La figure 14a illustre un second mode de réalisation des moyens d'accrochage ; La figure 14b est une représentation schématique d'une carte comprenant un film de support selon un second mode de réalisation ;Figure 14a illustrates a second embodiment of the attachment means; Fig. 14b is a schematic representation of a card comprising a support film according to a second embodiment;
La figure 15a illustre un troisième mode de réalisation des moyens d'accrochage ;FIG. 15a illustrates a third embodiment of the hooking means;
La figure 15b est une représentation schématique d'une carte comprenant un film de support selon un troisième mode de réalisation ;Fig. 15b is a schematic representation of a card comprising a support film according to a third embodiment;
La figure 16 illustre un moule à cavité fermée contenant le film de support ;Fig. 16 illustrates a closed cavity mold containing the support film;
La figure 17 illustre un moule à cavité ouverte contenant le film de support ; La figure 18 est une représentation schématique d'une carte dans laquelle le film de support affleure le corps de carte ;Fig. 17 illustrates an open cavity mold containing the support film; Fig. 18 is a schematic representation of a card in which the support film is flush with the card body;
La figure 19 est une représentation schématique d'une carte dans laquelle le film de support est recouvert d'un matériau plastique ;Fig. 19 is a schematic representation of a card in which the support film is covered with a plastic material;
La figure 20a illustre une mise en œuvre de l'invention dans une carte sans contact ;Figure 20a illustrates an implementation of the invention in a contactless card;
La figure 20b est une représentation schématique d'un mode de réalisation du film de support pour une carte sans contact ;Fig. 20b is a schematic representation of an embodiment of the support film for a contactless card;
La figure 21a est une représentation schématique illustrant un mode de réalisation de moyens d'accrochage à base de trous ; La figure 21 b est une représentation schématique illustrant une variante du mode de réalisation de moyens d'accrochage à base de trous ;Fig. 21a is a schematic representation illustrating one embodiment of hole-based fastening means; Fig. 21b is a schematic representation illustrating a variation of the embodiment of hole-based fastening means;
La figure 21c est une représentation schématique illustrant une seconde variante du mode de réalisation de moyens d'accrochage à base de trous ; et La figure 21 d est une représentation schématique illustrant une troisième variante du mode de réalisation de moyens d'accrochage à base de trous. Selon l'invention, on fabrique dans un premier temps, un film de support où les contacts et les microcircuits sont positionnés tel qu'illustré en figure 5a. Le film de support 50 est, notamment, en matériau flexible comprenant une pluralité de motifs 52, c'est-à-dire la configuration des contacts externes 53 correspondant aux microcircuits souhaités. Ces motifs sont fixés sur une face du film 50 appelée face externe 51.Figure 21c is a schematic representation illustrating a second variant of the embodiment of hooking means based on holes; and Fig. 21d is a schematic representation illustrating a third variation of the embodiment of hole-based fastening means. According to the invention, a support film is first produced in which the contacts and the microcircuits are positioned as illustrated in FIG. 5a. The support film 50 is, in particular, of flexible material comprising a plurality of patterns 52, that is to say the configuration of the external contacts 53 corresponding to the desired microcircuits. These patterns are fixed on one side of the film 50 called external face 51.
Sur le film de support, les motifs 52 définissant les contacts du microcircuit sont positionnés à une distance les uns des autres supérieure ou égale à d, la distance d étant par exemple supérieure à la largeur I d'une carteOn the support film, the patterns 52 defining the contacts of the microcircuit are positioned at a distance from each other greater than or equal to d, the distance d being for example greater than the width I of a card
54 dans laquelle les contacts du microcircuit doivent être insérés, tel qu'illustré en figures 5a et 5b.54 in which the contacts of the microcircuit must be inserted, as shown in Figures 5a and 5b.
Des microcircuits 62, comprenant par exemple un microprocesseur ou une mémoire, sont fixés sur la face opposée aux contacts externes et sur la seconde face du film de support 50 aussi appelée face interne 61 du film de support 50 tel qu'illustré en figure 6. De cette manière, un microcircuit est collé sur la face interne du film à chaque emplacement d'un motif de telle manière que, chaque motif de contacts externes comporte un microcircuit. Selon une variante de réalisation, le microcircuit peut être présent dans l'épaisseur du film de support ou dans une cavité du film de support prévue à cet effet.Microcircuits 62, comprising for example a microprocessor or a memory, are fixed on the face opposite to the external contacts and on the second face of the support film 50, also called internal face 61 of the support film 50 as illustrated in FIG. In this way, a microcircuit is adhered to the inner face of the film at each location of a pattern such that each external contact pattern comprises a microcircuit. According to an alternative embodiment, the microcircuit may be present in the thickness of the support film or in a cavity of the support film provided for this purpose.
L'épaisseur du film de support est variable selon les matériaux utilisés. Elle se situe en moyenne entre 50 μm et 200 μn. Ensuite, des connexions électriques 63 sont réalisées entre les bornes de connexion du microcircuit et au moins un contact d'un motif de contacts externes porté par la face externe 51 du film de support.The thickness of the support film is variable depending on the materials used. It is on average between 50 microns and 200 microns. Then, electrical connections 63 are made between the connection terminals of the microcircuit and at least one contact of an external contact pattern carried by the outer face 51 of the support film.
On obtient ainsi une bande formée par le film de support 51 qui comporte sur une de ses faces une pluralité de motifs, chaque motif comportant de plus un microcircuit qui lui est associé sur la face opposée du film.Thus, a strip formed by the support film 51 has on one of its faces a plurality of patterns, each pattern further comprising a microcircuit associated therewith on the opposite side of the film.
Sur la face interne du film de support 61 , des moyens d'accrochage 71 sont déposés tel qu'illustré en figure 7. Ces moyens d'accrochage 71 sont déposés, par exemple, dans l'intervalle séparant deux microcircuits 62 sur la face interne 61 du film de support 50. Les moyens d'accrochages sont, notamment, des éléments d'ancrage ou des éléments de collage. Ils permettent de solidariser le film de support et le corps de la carte, constituée par exemple, d'une matière plastique moulée.On the inner face of the support film 61, hooking means 71 are deposited as illustrated in FIG. These attachment means 71 are deposited, for example, in the gap between two microcircuits 62 on the inner face 61 of the support film 50. The attachment means are, in particular, anchoring elements or bonding elements. . They make it possible to secure the support film and the body of the card, constituted for example by a molded plastic material.
Le film de support 50 ainsi préparé comprend sur la face externe des motifs de contacts externes 52, et sur la face interne 61 , des microcircuits 62 connectés aux contacts externes 53, des motifs de contacts, et des moyens d'accrochage 71.The support film 50 thus prepared comprises, on the external face, external contact patterns 52, and on the internal face 61, microcircuits 62 connected to the external contacts 53, contact patterns, and hooking means 71.
Ce film de support 50 est introduit dans un moule 81 tel qu'illustré en figure 8.This support film 50 is introduced into a mold 81 as illustrated in FIG.
Les parties du moule définissent une empreinte qui donne la forme externe du corps de la carte souhaitée. Le film de support 50 est ensuite positionné par rapport à l'empreinte de manière à ce que le motif des contacts soit positionné à l'emplacement désiré dans le corps de carte.The mold parts define an imprint that gives the external shape of the body of the desired card. The backing film 50 is then positioned relative to the footprint so that the pattern of the contacts is positioned at the desired location in the card body.
Pour cela, le film est de dimension telle qu'il déborde du moule pour faciliter le positionnement du microcircuit.For this, the film is of such size that it overflows the mold to facilitate the positioning of the microcircuit.
Dans le cas des cartes à puce, la position est définie par la norme internationale ISO, notamment dans la norme ISO 7816.In the case of smart cards, the position is defined by the international ISO standard, notably in the ISO 7816 standard.
De même, le film est positionné de façon à ce que les moyens d'accrochage soient présents dans le volume défini par la cavité du moule 81.Similarly, the film is positioned so that the attachment means are present in the volume defined by the cavity of the mold 81.
On utilise ainsi l'emplacement entre deux motifs pour appliquer des éléments promoteurs d'adhésion. La matière plastique est ensuite introduite dans le moule afin de constituer le corps de carte par le procédé de moulage retenu. Le procédé peut être l'injection de matière dans l'empreinte, le moulage par transfert ou le coulage.The location between two patterns is used to apply adhesion promoter elements. The plastic material is then introduced into the mold to form the card body by the selected molding process. The method can be injection of material into the impression, transfer molding or casting.
Le matériau entoure le microcircuit 62 à l'exception des contacts de la face externe du film qui est plaqué sur une paroi du moule et interagit avec les moyens d'accrochage de manière à renforcer l'adhésion du film avec le corps de la carte. Après avoir ouvert le moule 81 , on démoule le corps de carte dans lequel est inséré le microcircuit et le film, les contacts externes présents sur le film affleurant le corps de la carte.The material surrounds the microcircuit 62 with the exception of the contacts of the outer face of the film which is pressed onto a wall of the mold and interacts with the attachment means so as to reinforce the adhesion of the film with the body of the card. After opening the mold 81, the card body is demolded in which the microcircuit and the film are inserted, the external contacts present on the film flush with the body of the card.
On comprend que le film de support joue un double rôle, il permet d'ancrer le microcircuit de telle manière que le microcircuit ne peut pas être enlevée par décollage du film, et il assure le positionnement précis du microcircuit par rapport à l'empreinte du moule et donc par rapport au corps de carte.It is understood that the support film plays a dual role, it allows to anchor the microcircuit in such a way that the microcircuit can not be removed by taking off the film, and it ensures the precise positioning of the microcircuit with respect to the imprint of the mold and therefore with respect to the card body.
Après démoulage des différentes cartes fabriquées, on obtient une bande de cartes. Il ne reste qu'à tester électriquement chaque carte, à découper chacune d'elles à partir du film de support et, notamment, à les personnaliser.After demolding the various cards made, we obtain a strip of cards. It remains only to electrically test each card, to cut each of them from the support film and, in particular, to customize them.
Ces étapes peuvent être inversées ; en effet, on peut tester les cartes et les personnaliser alors qu'elles sont encore reliées les unes aux autres par le film ou tester et personnaliser les cartes après leur séparation.These steps can be reversed; indeed, we can test the cards and customize them while they are still connected to each other by the film or test and customize the cards after their separation.
Les figures 9a et 9b illustrent la bande comprenant les cartes non encore découpées, à l'issue du démoulage. La figure 9a montre la face avant des cartes sur lesquelles les contacts affleurent le corps de carte et le film de support est accroché à la face avant de la carte, alors que la figure 9b montre la face arrière des cartes.Figures 9a and 9b illustrate the band comprising the cards not yet cut, at the end of the demolding. Figure 9a shows the front face of the cards on which the contacts are flush with the card body and the support film is attached to the front face of the card, while Figure 9b shows the back side of the cards.
Le film de support peut notamment être un film en verre époxy, en PET (poly éthylène térephtalate) ou en polyimide.The support film may in particular be a film made of epoxy glass, PET (polyethylene terephthalate) or polyimide.
Les contacts externes peuvent être déposés sur la face externe 51 du film de support 50, par exemple, par photogravure, par dépôt d'encres conductrices ou par dépôt de métal par des procédés catalytiques ou électrolytiques.The external contacts may be deposited on the outer face 51 of the support film 50, for example by photogravure, by deposition of conductive inks or by deposition of metal by catalytic or electrolytic processes.
Selon un mode de réalisation, le film de support est une bande dont la largeur est à peine supérieure à la largeur du motif des contacts externes. De cette manière, les coûts sont optimisés. Le film de support peut notamment s'étendre sur 20 à 60 % de la longueur de la carte à microcircuit Cependant, il est également possible d'avoir un film de plus grande largeur tel qu'illustré en figure 10.According to one embodiment, the support film is a strip whose width is only slightly greater than the width of the pattern of the external contacts. In this way, the costs are optimized. The support film can in particular extend over 20 to 60% of the length of the microcircuit card However, it is also possible to have a film of greater width as illustrated in Figure 10.
La connexion des contacts externes 53 et du microcircuit 62 au travers du film de support 50 peut être obtenue par un procédé de soudure filaire tel que présenté sur la figure 11.The connection of the external contacts 53 and the microcircuit 62 through the support film 50 can be obtained by a wire soldering process as shown in FIG. 11.
Le microcircuit 62 comprend notamment un élément de circuit imprimé sur lequel sont présents des bornes de connexion, un microprocesseur ou un module mémoire fixé sur le circuit imprimé.The microcircuit 62 comprises in particular a printed circuit element on which there are connection terminals, a microprocessor or a memory module fixed on the printed circuit.
Le microcircuit 62 est relié à des contacts externes 53 par des fils conducteurs 111 qui relient les bornes de connexion du microcircuit à des plages de contact. Un matériau d'enrobage 112, par exemple, de la résine de protection peut être coulé de manière à entourer le microcircuit et les fils.The microcircuit 62 is connected to external contacts 53 by conductive wires 111 which connect the connection terminals of the microcircuit to contact pads. A coating material 112, for example, protective resin may be cast so as to surround the microcircuit and the son.
La connexion peut également être réalisée par un procédé de puce montée-retoumée (« Flip-chip » en terminologie anglo-saxonne) tel qu'illustré en figure 12.The connection can also be made by a chip-up process ("Flip-chip" in English terminology) as shown in Figure 12.
Selon ce procédé, les contacts externes sont positionnés sur la face externe 51 du film de support 50. Sur la face interne 61 du film de support 50, on a le microcircuit 62 qui est positionné et qui est connecté à des pistes conductrices 121. Les pistes conductrices 121 relient le microcircuit 62 et les contacts externes 53. Le microcircuit 62 est fixé par un élément tel que de la colle 122. De même, la connexion entre le microcircuit et les pistes conductrices est réalisée par une surépaisseur conductrice 123 aussi appelée « bump » en terminologie anglo-saxonne.According to this method, the external contacts are positioned on the outer face 51 of the support film 50. On the inner face 61 of the support film 50, there is the microcircuit 62 which is positioned and which is connected to the conductive tracks 121. conductive tracks 121 connect the microcircuit 62 and the external contacts 53. The microcircuit 62 is fixed by an element such as glue 122. Similarly, the connection between the microcircuit and the conductive tracks is achieved by a conductive excess thickness 123 also called " bump "in English terminology.
Ce procédé est préféré car plus robuste. En effet, l'injection ou le coulage de la résine peuvent endommager les fils de connexion dans le cas d'une soudure filaire.This process is preferred because it is more robust. Indeed, the injection or casting of the resin may damage the connection son in the case of a wire solder.
Selon une alternative de réalisation, on dépose sur le microprocesseur et les fils de connexion une résine de protection avant l'introduction dans le moule. Cette étape supplémentaire n'est pas nécessaire lors de l'utilisation du procédé de Flip-chip.According to an alternative embodiment, is deposited on the microprocessor and the connection son a protective resin before introduction into the mold. This extra step is not necessary when using the Flip-chip process.
Tel qu'illustrés en figure 13a et 13b, l'espace libre sur la face interne 61 du film de support 50 entre deux microcircuits 62 est utilisé pour le dépôt de moyens d'accrochage. Ces moyens d'accrochage, notamment sous forme d'éléments d'ancrage ou d'éléments de collage, assurent l'adhésion du microcircuit dans le support plastique de la carte.As illustrated in FIGS. 13a and 13b, the free space on the inner face 61 of the support film 50 between two microcircuits 62 is used for the deposit of attachment means. These attachment means, in particular in the form of anchoring elements or gluing elements, ensure the adhesion of the microcircuit in the plastic support of the card.
Ces moyens d'accrochage peuvent s'étendre de part et d'autre du microcircuit 62 et des pistes conductrices 121 sur une longueur h inférieur ou égale à la largeur de la carte 54.These attachment means can extend on either side of the microcircuit 62 and conductive tracks 121 over a length h less than or equal to the width of the card 54.
Ces moyens d'accrochage peuvent prendre plusieurs formes.These attachment means can take several forms.
Selon un premier mode de réalisation, on dépose des gouttes de résine effilées en forme de « clous » ou de « crochets » 131 de manière à réaliser un ancrage mécanique du film avec le corps de la carte tel qu'illustré en figure 13a.According to a first embodiment, tapered resin drops in the form of "nails" or "hooks" 131 are deposited in such a way as to mechanically anchor the film with the body of the card as illustrated in FIG. 13a.
Pour ce faire, on peut utiliser des résines visqueuses. Un exemple de réalisation des formes recourbées des crochets consiste à faire subir à la buse déposant la résine un mouvement latéral. Ensuite la résine peut être durcie, notamment par un procédé de chauffage.To do this, viscous resins can be used. An embodiment of the hooked forms hooks is to subject the nozzle depositing the resin a lateral movement. Then the resin can be cured, in particular by a heating method.
La figure 13b illustre la présence de part et d'autre du microcircuit des gouttes de résines servant d'ancrage du film avec le corps de la carte. Les gouttes de résine sont présentes, par exemple, sur l'ensemble du film de support qui est fixé sur la carte 133 de manière à augmenter la solidarité du film de support et du microcircuit avec le corps de la carte.FIG. 13b illustrates the presence on both sides of the microcircuit of the drops of resins serving to anchor the film with the body of the card. The drops of resin are present, for example, over the entire support film which is fixed on the card 133 so as to increase the solidarity of the support film and the microcircuit with the body of the card.
Selon une variante de réalisation, les gouttes de résines sont situées sur le film de support à proximité de la périphérie du moule, et peuvent comprendre toute la périphérie du support de carte présent en périphérie du moule. On limite ainsi les risques de création d'amorces de séparation du support de carte avec le reste du corps de carte.According to an alternative embodiment, the drops of resins are located on the support film near the periphery of the mold, and may comprise the entire periphery of the card support present at the periphery of the mold. This limits the risk of creating separation primers of the card support with the rest of the card body.
L'arrachage du film de support est rendu de la sorte très difficile.The tearing of the support film is rendered in this way very difficult.
Selon un autre mode de réalisation, on soude des surépaisseurs métalliques 141 sur la face interne du film de support 50 tel qu'illustré en figures 14a et 14b. Les surépaisseurs métalliques permettent de réaliser un ancrage mécanique du film avec le corps de la carte. Les surépaisseurs métalliques sont formées par le recuit de l'extrémité d'un fil métallique qui est soudé sur le support par le dévidement du fil dans un capillaire jusqu'à une certaine longueur.According to another embodiment, metal excess thicknesses 141 are welded to the inner face of the support film 50 as illustrated in FIGS. 14a and 14b. The extra thicknesses of metal make it possible to mechanically anchor the film with the body of the card. The metallic excess thicknesses are formed by the annealing of the end of a wire which is welded to the support by the unwinding of the wire in a capillary to a certain length.
Ces surépaisseurs sont positionnées de part et d'autre du microcircuit 62 et des pistes conductrices 121.These extra thicknesses are positioned on either side of the microcircuit 62 and the conductive tracks 121.
Ces surépaisseurs 141 sont appelées « bumps » ou « stud bumps » en terminologie anglo-saxonne.These oversize 141 are called "bumps" or "stud bumps" in English terminology.
Un aspect en forme de crochet des surépaisseurs peut également être obtenu par un mouvement latéral du capillaire ou par un outil qui aplatit le fil après soudure.A hook-shaped appearance of the extra thicknesses can also be obtained by a lateral movement of the capillary or by a tool that flattens the wire after welding.
Cette technique peut nécessiter le dépôt préalable de plages de matériau de soudure 142 sur la face interne du film support 50 dans l'intervalle séparant deux microcircuits consécutifs.This technique may require the prior deposition of weld material pads 142 on the inner face of the support film 50 in the gap between two consecutive microcircuits.
La figure 14b illustre la position des moyens d'accrochage sur la carte 54. Les moyens d'accrochage sont présents par exemple sur le contour du film qui est fixé sur la carte 54, et notamment sur la proximité de la périphérie du moule. Les moyens d'accrochage peuvent également être situés sur toute la périphérie du support de carte présent en périphérie du moule. On limite ainsi les risques de création d'amorces de séparation du support de carte avec le reste du corps de carte.FIG. 14b illustrates the position of the hooking means on the card 54. The attachment means are present for example on the contour of the film which is fixed on the card 54, and in particular on the proximity of the periphery of the mold. The attachment means may also be located on the entire periphery of the card holder present at the periphery of the mold. This limits the risk of creating separation primers of the card support with the rest of the card body.
Selon encore un autre mode de réalisation, on procède au dépôt de pavés de colle ou d'adhésif 151 activables par exemple à chaud tel qu'illustré en figures 15a et 15b.According to yet another embodiment, it proceeds to the deposit of glue or adhesive blocks 151 activatable for example hot as illustrated in Figures 15a and 15b.
Ce dépôt de colle est réalisé sur la face interne 61 du film de support 50 entre deux microcircuits 62 connectés aux pistes conductrices 121.This adhesive deposit is made on the inner face 61 of the support film 50 between two microcircuits 62 connected to the conductive tracks 121.
Un tel procédé permet, non plus d'assurer une liaison purement d'origine mécanique entre les moyens d'accrochage et le corps de la carte, mais d'avoir une liaison de nature chimique, notamment intermoléculaire.Such a method makes it possible, either to ensure a purely mechanical connection between the fastening means and the body of the card, but to have a chemical bond, particularly intermolecular.
La figure 15b illustre la présence de pavés de colle ou d'adhésif 151 sur une grande partie du film qui est relié au corps de la carte 54. Une fois que le film est prêt c'est-à-dire qu'il est muni des contacts externes, de microcircuit et des moyens d'accrochage, celui-ci est introduit dans une cavité de moulage tel qu'illustré en figure 16.FIG. 15b illustrates the presence of glue or adhesive blocks 151 on a large part of the film which is connected to the body of the card 54. Once the film is ready that is to say it is provided with external contacts, microcircuit and attachment means, it is introduced into a molding cavity as shown in Figure 16.
Le moule 161 comprend l'empreinte de la carte souhaitée. Il est illustré en figure 16 un moule à cavité fermée permettant un moulage par injection ou par transfert. Le moule est composé d'une partie fixe et d'une partie mobile. Ces deux parties définissent une empreinte qui donne la forme externe du corps de carte souhaitée.The mold 161 includes the imprint of the desired card. It is illustrated in Figure 16 a closed cavity mold for injection molding or transfer. The mold is composed of a fixed part and a movable part. These two parts define an imprint that gives the external shape of the desired card body.
Le moule étant ouvert, le film est introduit de manière à ce que le microcircuit et les éléments d'accrochage soient inclus dans la cavité selon l'empreinte. Le motif des contacts externes est positionné à la position exacte définie par les spécifications de la carte considérée. La position est notamment réalisée par maintien du film de support à une position donnée.With the mold open, the film is introduced in such a way that the microcircuit and the fastening elements are included in the cavity according to the imprint. The pattern of the external contacts is positioned at the exact position defined by the specifications of the considered card. The position is in particular made by holding the support film at a given position.
Concernant les cartes à puce, la position est définie par la norme internationale ISO 7816.For smart cards, the position is defined by the international standard ISO 7816.
Puis le moule 161 est fermé. On procède ensuite à l'injection du matériau plastique dans l'empreinte par une buse d'injection. Le matériau plastique remplit l'empreinte entourant le microcircuit à l'exception des contacts externes positionnés sur la paroi du moule. Les moyens d'accrochage vont ainsi s'accrocher et interagir avec le corps de la carte.Then the mold 161 is closed. The plastic material is then injected into the cavity by an injection nozzle. The plastic material fills the imprint surrounding the microcircuit with the exception of the external contacts positioned on the wall of the mold. The attachment means will thus hang and interact with the body of the card.
Dans le cas d'un procédé de fabrication par coulage, la cavité définie par l'empreinte du moule 171 est une cavité ouverte tel qu'illustré en figure 17. Lorsque le matériau plastique est durci, on ouvre le moule et on démoule le corps de carte dans lequel est inséré le microcircuit et le film de support. Le produit obtenu apparaît comme une succession de cartes reliées entre elles comme illustré en figure 9.In the case of a casting manufacturing method, the cavity defined by the cavity of the mold 171 is an open cavity as illustrated in FIG. 17. When the plastic material is hardened, the mold is opened and the body is demolded. card in which is inserted the microcircuit and the support film. The product obtained appears as a succession of interconnected cards as illustrated in FIG.
Comme montré en figure 18, le film de support 50 peut affleurer à la surface du corps de la carte 54.As shown in FIG. 18, the support film 50 can be flush with the surface of the body of the card 54.
Selon un autre mode de réalisation illustré en figure 19, le film de support 50 en surface du corps de la carte 54 peut être légèrement en retrait et être recouvert d'une fine couche de matériau plastique 191. Cette configuration favorise encore l'adhésion du film dans la carte.According to another embodiment illustrated in FIG. 19, the support film 50 on the surface of the body of the card 54 may be slightly set back and to be covered with a thin layer of plastic material 191. This configuration further promotes the adhesion of the film in the card.
Après le démoulage, on sépare chacune des cartes par découpage à partir du film de support, soit immédiatement après l'opération de démoulage soit après avoir testé électriquement les cartes et / ou avoir effectué une opération de marquage graphique.After demolding, each of the cards is separated by cutting from the support film, either immediately after the demolding operation or after having electrically tested the cards and / or having performed a graphic marking operation.
La figure 20a illustre un mode de réalisation dans le cas d'une carte sans contact. Une carte sans contact 201 comprend dans son corps un microcircuit 202 et une antenne 203. La fabrication d'une telle carte selon l'invention consiste dans un premier temps à fixer sur la face interne du film de support 200, le microcircuit 202, l'antenne 203 reliée au microcircuit et des moyens d'accrochage 204 tel qu'illustré en figure 20b.Figure 20a illustrates an embodiment in the case of a contactless card. A contactless card 201 comprises in its body a microcircuit 202 and an antenna 203. The manufacture of such a card according to the invention consists first of all in fixing on the inner face of the support film 200, the microcircuit 202, 203 antenna connected to the microcircuit and attachment means 204 as shown in Figure 20b.
Les moyens d'accrochage sont notamment positionnés en périphérie du film de support 200 devant être noyé dans le corps de la carte.The attachment means are in particular positioned at the periphery of the support film 200 to be embedded in the body of the card.
En particulier, les moyens d'accrochage peuvent être en périphérie extérieure de l'antenne.In particular, the attachment means may be at the outer periphery of the antenna.
Ils peuvent aussi être présents à l'intérieur du périmètre de l'antenne de manière à accentuer l'adhésion du film au corps de la carte. Selon une variante de réalisation, des moyens d'accrochage 204 peuvent être déposés sur la face externe du film de support de manière à augmenter l'ancrage du film de support avec le corps de la carte sur les deux côtés du film.They can also be present inside the perimeter of the antenna so as to accentuate the adhesion of the film to the body of the card. According to an alternative embodiment, fastening means 204 may be deposited on the outer face of the support film so as to increase the anchoring of the support film with the body of the card on both sides of the film.
Les moyens d'accrochage peuvent être des moyens d'ancrage et des éléments de collage et d'adhésif tel que précédemment décrits.The attachment means may be anchoring means and adhesive and adhesive elements as previously described.
Une fois préparé, le film est positionné dans un moule. Puis, on introduit dans le moule un matériau plastique. Ce matériau plastique va être positionné de part et d'autre du film de manière à positionner le film et ces composants au cœur du corps de la carte. Selon d'autres variantes de réalisation, les moyens d'accrochage peuvent être des trous dans le film de support tel qu'illustrés en figures 21a, 21 b, 21c et 21d. En effet, tel qu'illustré en 210 et 211 , les moyens d'accrochage peuvent être des trous allant de part et d'autre de l'épaisseur du film de support 210, ou être borgnes 211.Once prepared, the film is positioned in a mold. Then, a plastic material is introduced into the mold. This plastic material will be positioned on either side of the film so as to position the film and these components in the heart of the body of the card. According to other embodiments, the attachment means may be holes in the support film as shown in Figures 21a, 21b, 21c and 21d. Indeed, as illustrated in 210 and 211, the attachment means may be holes going on either side of the thickness of the support film 210, or be blind 211.
Ainsi, au moment du moulage de la carte à microcircuit, le matériau plastique va venir remplir ces trous de manière à solidariser le film de support avec le corps de la carte.Thus, at the time of molding the microcircuit card, the plastic material will fill these holes so as to secure the support film with the body of the card.
Ces trous peuvent également avoir des variations de sections tel qu'illustré en 212 et 213 des figures 21c et 21 d.These holes may also have sectional variations as illustrated in 212 and 213 of Figures 21c and 21d.
Notamment, les trous peuvent avoir une forme en T. D'autres formes peuvent bien entendu être imaginées.In particular, the holes may have a T-shape. Other shapes can of course be imagined.
Les moyens d'accrochages sous forme de trous de sections variables présentent l'avantage de renforcer l'adhésion du film de support avec le corps de carte.The hooking means in the form of holes of variable sections have the advantage of strengthening the adhesion of the support film with the card body.
Il est à noter que les différentes variantes de réalisation des moyens d'accrochage peuvent être combinés lors de la fabrication d'une carte à circuit intégré. It should be noted that the various embodiments of the attachment means can be combined during the manufacture of an integrated circuit card.

Claims

REVENDICATIONS
1. Procédé de fabrication d'une carte à microcircuit, consistant à : préparer un film de support comprenant un microcircuit ; - munir le film de support de moyens d'accrochage ; positionner le film de support ainsi préparé dans un moule comportant l'empreinte de la carte à microcircuit à réaliser, le film étant dimensionné de manière à déborder du moule pour faciliter le positionnement du microcircuit ; et introduire dans le moule un matériau plastique pour que celui-ci remplisse l'empreinte du moule et interagisse avec les moyens d'accrochage de manière à solidariser le film de support à la carte moulé.A method of manufacturing a microcircuit card, comprising: preparing a support film comprising a microcircuit; - Provide the support film with hooking means; positioning the support film thus prepared in a mold having the imprint of the microcircuit card to be produced, the film being dimensioned so as to protrude from the mold to facilitate positioning of the microcircuit; and introducing into the mold a plastic material so that it fills the impression mold and interact with the attachment means so as to secure the support film to the molded card.
2. Procédé de fabrication selon la revendication 1 , dans lequel le microcircuit et les moyens d'accrochage sont fixés sur une même face du film de support.2. The manufacturing method according to claim 1, wherein the microcircuit and the attachment means are fixed on the same side of the support film.
3. Procédé de fabrication selon la revendication 2, consistant en outre à fixer des contacts externes sur la face opposée du film de support et établir des interconnexions entre des bornes du microcircuit et au moins certains des contacts externes.3. The manufacturing method according to claim 2, further comprising fixing external contacts on the opposite side of the support film and establishing interconnections between terminals of the microcircuit and at least some of the external contacts.
4. Procédé de fabrication selon la revendication 2 ou 3, selon lequel la face du film de support munie du microcircuit comprend au moins une partie d'une antenne.4. The manufacturing method according to claim 2 or 3, wherein the face of the support film provided with the microcircuit comprises at least a portion of an antenna.
5. Procédé de fabrication selon l'une quelconque des revendications précédentes, dans lequel certains au moins des moyens d'accrochage comprennent des moyens d'ancrage mécanique.5. Manufacturing process according to any one of the preceding claims, wherein at least some attachment means comprise mechanical anchoring means.
6. Procédé de fabrication selon la revendication 5, dans lequel les moyens d'ancrage mécanique sont effilés en forme de clous. 6. Manufacturing process according to claim 5, wherein the mechanical anchoring means are tapered nails.
7. Procédé de fabrication selon la revendication 5, dans lequel les moyens d'ancrage mécanique sont effilés en forme de crochets.7. The manufacturing method according to claim 5, wherein the mechanical anchoring means are tapered in the form of hooks.
8. Procédé de fabrication selon l'une quelconque des revendications 5 à 7, dans lequel certains au moins des moyens d'ancrage mécanique sont réalisés par le dépôt de gouttes de résine effilées.8. Manufacturing process according to any one of claims 5 to 7, wherein at least some mechanical anchoring means are formed by the deposition of tapered resin drops.
9. Procédé de fabrication selon la revendication 8, consistant à faire durcir les gouttes de résine.9. The manufacturing method according to claim 8, comprising curing the drops of resin.
10. Procédé de fabrication selon l'une quelconque des revendications 5 à 7, dans lequel certains au moins des moyens d'ancrage mécanique sont réalisés par soudage de surépaisseurs métalliques.10. The manufacturing method according to any one of claims 5 to 7, wherein at least some mechanical anchoring means are made by welding of metal thicknesses.
11. Procédé de fabrication selon la revendication 10, dans lequel, préalablement à la soudure de surépaisseurs métalliques, on dépose des plages de matériau de soudure sur le film de support.11. The manufacturing method according to claim 10, wherein, prior to the welding of metal thicknesses, is deposited strips of solder material on the support film.
12. Procédé de fabrication selon l'une quelconque des revendications 1 à 4, dans lequel certains au moins des moyens d'accrochage sont composés de pavés de colle ou d'adhésif.12. The manufacturing method according to any one of claims 1 to 4, wherein at least some attachment means are composed of adhesive blocks or adhesive.
13. Procédé de fabrication selon l'une quelconque des revendications précédentes, dans lequel le film de support est muni de contacts externes et le film de support est une bande dont la largeur est à peine supérieure à la largeur du motif des contacts externes.13. The manufacturing method as claimed in any one of the preceding claims, wherein the support film is provided with external contacts and the support film is a strip whose width is only slightly greater than the width of the pattern of the external contacts.
14. Procédé de fabrication selon l'une quelconque des revendications 1 à 4, dans lequel certains au moins des moyens d'accrochage sont des trous dans le film de support. 14. The manufacturing method according to any one of claims 1 to 4, wherein at least some attachment means are holes in the support film.
15. Procédé de fabrication selon la revendication 14, dans lequel certains au moins des trous sont traversant.15. The manufacturing method according to claim 14, wherein at least some of the holes are through.
16. Procédé de fabrication selon la revendication 14 ou 15, dans lequel certains au moins des trous présentent des variations de sections.16. The manufacturing method according to claim 14 or 15, wherein at least some of the holes have sectional variations.
17. Procédé de fabrication selon l'une quelconque des revendications précédentes, dans lequel le film de support s'étend sur 20 à 60 % de la longueur de la carte à microcircuit.17. The manufacturing method according to any one of the preceding claims, wherein the support film extends over 20 to 60% of the length of the microcircuit card.
18. Procédé de fabrication selon l'une quelconque des revendications précédentes, dans lequel les moyens d'accrochage sont répartis de part et d'autre du microcircuit.18. Manufacturing method according to any one of the preceding claims, wherein the attachment means are distributed on either side of the microcircuit.
19. Procédé de fabrication selon l'une quelconque des revendications précédentes, dans lequel la face du film de support munie du microcircuit comprend au moins une partie d'une antenne, le procédé consiste à fixer les moyens d'accrochage en périphérie extérieure de l'antenne.19. Manufacturing method according to any one of the preceding claims, wherein the face of the support film provided with the microcircuit comprises at least a portion of an antenna, the method consists in fixing the attachment means at the outer periphery of the antenna. 'antenna.
20. Procédé de fabrication selon la revendication 18 ou 19, dans lequel les moyens d'accrochage sont situés sur le film de support à proximité de la périphérie du moule.20. Manufacturing process according to claim 18 or 19, wherein the attachment means are located on the support film near the periphery of the mold.
21. Procédé de fabrication selon la revendication 18 ou 19, dans lequel les moyens d'accrochage sont situés sur toute le périphérie du film de support à proximité de toute la périphérie du moule.21. The manufacturing method according to claim 18 or 19, wherein the attachment means are located on the entire periphery of the support film near the entire periphery of the mold.
22. Procédé de fabrication selon la revendication 18, dans lequel les moyens d'accrochage s'étendent entre le microcircuit et la périphérie du moule. 22. The manufacturing method according to claim 18, wherein the attachment means extend between the microcircuit and the periphery of the mold.
23. Procédé de fabrication selon l'une quelconque des revendications précédentes, dans lequel le moulage est réalisé par un procédé d'injection de matière plastique.23. The manufacturing method according to any one of the preceding claims, wherein the molding is carried out by a plastic injection method.
24. Procédé de fabrication selon l'une quelconque des revendications précédentes, dans lequel le film de support constitue une face de la carte à microcircuit.24. Manufacturing method according to any one of the preceding claims, wherein the support film constitutes a face of the microcircuit card.
25. Procédé de fabrication selon l'une quelconque des revendications précédentes, consistant en outre à fixer sur les deux faces du film de support des moyens d'accrochage.25. The manufacturing method according to any one of the preceding claims, further comprising fixing on both sides of the support film attachment means.
26. Procédé de fabrication selon la revendication 25, dans lequel le moulage est réalisé sur les deux côtés du film de support.26. The manufacturing method according to claim 25, wherein the molding is performed on both sides of the support film.
27. Carte à microcircuit comportant :27. Microcircuit card comprising:
- un corps de carte moulé,- a molded card body,
- un film de support s'étendant d'un bord à l'autre de la carte et comprenant un microcircuit, - le film de support étant muni de moyens d'accrochage propres à solidariser le film de support au corps de carte moulé.a support film extending from one edge to the other of the card and comprising a microcircuit, the support film being provided with attachment means capable of securing the support film to the molded card body.
28. Carte à microcircuit selon la revendication 29, dans laquelle les moyens d'accrochage et le microcircuit sont sur une même face du film de support.28. Microcircuit card according to claim 29, wherein the attachment means and the microcircuit are on the same side of the support film.
29. Carte à microcircuit selon la revendication 28, dans laquelle des contacts externes sont situés sur la face opposée du film de support et des moyens d'interconnexion connectent des bornes du microcircuit à au moins certains des contacts externes. The microcircuit card according to claim 28, wherein external contacts are located on the opposite side of the support film and interconnecting means connect terminals of the microcircuit to at least some of the external contacts.
30. Carte à microcircuit selon la revendication 28 ou 29, dans laquelle au moins une partie d'une antenne est située sur la face du film de support munie du microcircuit.30. Microcircuit card according to claim 28 or 29, wherein at least a portion of an antenna is located on the face of the support film provided with the microcircuit.
31. Carte à microcircuit selon l'une quelconque des revendications31. Microcircuit card according to any one of the claims
27 à 30, dans laquelle certains au moins des moyens d'accrochage comprennent des moyens d'ancrage mécanique.27 to 30, wherein at least some of the attachment means comprise mechanical anchoring means.
32. Carte à microcircuit selon la revendication 31 , dans laquelle les moyens d'ancrage mécanique sont effilés en forme de clous.32. Microcircuit card according to claim 31, wherein the mechanical anchoring means are tapered nails.
33. Carte à microcircuit selon la revendication 31 , dans laquelle les moyens d'ancrage mécanique sont effilés en forme de crochets.33. Microcircuit card according to claim 31, wherein the mechanical anchoring means are tapered in the form of hooks.
34. Carte à microcircuit selon l'une quelconque des revendications34. Microcircuit card according to any one of the claims
31 à 33, dans laquelle certains au moins des moyens d'ancrage mécanique sont en résine.31 to 33, in which at least some of the mechanical anchoring means are made of resin.
35. Carte à microcircuit selon l'une quelconque des revendications 31 à 33, dans laquelle certains au moins des moyens d'ancrage mécanique sont des surépaisseurs métalliques.35. Microcircuit card according to any one of claims 31 to 33, wherein at least some of the mechanical anchoring means are metal excess thicknesses.
36. Carte à microcircuit selon la revendication 35, dans laquelle le film de support comporte des plages de matériau de soudure.36. A microcircuit card according to claim 35, wherein the support film comprises ranges of solder material.
37. Carte à microcircuit selon l'une quelconque des revendications 27 à 30, dans laquelle certains au moins des moyens d'accrochage sont des pavés de colle ou d'adhésif.37. A microcircuit card according to any one of claims 27 to 30, wherein at least some of the attachment means are pavers of glue or adhesive.
38. Carte à microcircuit selon l'une quelconque des revendications38. Microcircuit card according to any one of the claims
27 à 37, dans laquelle des contacts externes sont situés sur le film de support et le film de support est une bande dont la largeur est à peine supérieure à la largeur du motif des contacts externes.27 to 37, wherein external contacts are located on the support film and the support film is a strip whose width is only slightly greater than the width of the pattern of the external contacts.
39. Carte à microcircuit selon l'une quelconque des revendications 27 à 30, dans laquelle certains au moins des moyens d'accrochage sont des trous dans le film de support.39. A microcircuit card according to any one of claims 27 to 30, wherein at least some of the attachment means are holes in the support film.
40. Carte à microcircuit selon la revendication 39, dans laquelle certains au moins des trous sont traversant.40. A microcircuit card according to claim 39, wherein at least some of the holes are through.
41. Carte à microcircuit selon la revendication 39 ou 40, dans laquelle certains au moins des trous présentent des variations de sections.41. A microcircuit card according to claim 39 or 40, wherein at least some of the holes have sectional variations.
42. Carte à microcircuit selon l'une quelconque des revendications 27 à 41 , dans laquelle le film de support s'étend sur 20 à 60 % de la longueur de la carte à microcircuit.42. A microcircuit card according to any one of claims 27 to 41, wherein the support film extends over 20 to 60% of the length of the microcircuit card.
43. Carte à microcircuit selon l'une quelconque des revendications 27 à 42, dans laquelle les moyens d'accrochage sont répartis de part et d'autre du microcircuit.43. A microcircuit card according to any one of claims 27 to 42, wherein the attachment means are distributed on either side of the microcircuit.
44. Carte à microcircuit selon l'une quelconque des revendications 27 à 43, dans laquelle au moins une partie d'une antenne est située sur la face du film de support munie du microcircuit et les moyens d'accrochage sont situés en périphérie extérieure de l'antenne.44. A microcircuit card according to any one of claims 27 to 43, wherein at least a portion of an antenna is located on the face of the support film provided with the microcircuit and the attachment means are located at the outer periphery of the the antenna.
45. Carte à microcircuit selon la revendication 43 ou 44, dans laquelle les moyens d'accrochage sont situés à proximité de la périphérie de la carte. 45. A microcircuit card according to claim 43 or 44, wherein the attachment means are located near the periphery of the card.
46. Carte à microcircuit selon la revendication 43 ou 44, dans laquelle les moyens d'accrochage sont situés à proximité de toute la périphérie de la carte.46. A microcircuit card according to claim 43 or 44, wherein the attachment means are located near the entire periphery of the card.
47. Carte à microcircuit selon la revendication 43, dans laquelle les moyens d'accrochage s'étendent entre le microcircuit et la périphérie de la carte.47. A microcircuit card according to claim 43, wherein the attachment means extend between the microcircuit and the periphery of the card.
48. Carte à microcircuit selon l'une quelconque des revendications 27 à 47, dans laquelle le film de support constitue une face de la carte à microcircuit.48. A microcircuit card according to any one of claims 27 to 47, wherein the support film constitutes a face of the microcircuit card.
49. Carte à microcircuit selon l'une quelconque des revendications 27 à 48, dans laquelle les deux faces le film de support comportent des moyens d'accrochage.49. A microcircuit card according to any one of claims 27 to 48, wherein the two faces of the support film comprise hooking means.
50. Carte à microcircuit selon la revendication 49, dans laquelle le film de support est compris entre deux couches moulées de matériau de corps de carte. 50. A microcircuit card according to claim 49, wherein the support film is between two molded layers of card body material.
PCT/FR2006/002855 2005-12-26 2006-12-22 Method for producing a microcircuit card, and associated microcircuit card WO2007077356A2 (en)

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FR0513320A FR2895548B1 (en) 2005-12-26 2005-12-26 METHOD FOR MANUFACTURING A MICROCIRCUIT CARD, AND ASSOCIATED MICROCIRCUIT CARD

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US9583455B2 (en) 2013-05-31 2017-02-28 Renesas Electronics Corporation Semiconductor device

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FR2895548A1 (en) 2007-06-29
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