WO2007077356A3 - Method for producing a microcircuit card, and associated microcircuit card - Google Patents
Method for producing a microcircuit card, and associated microcircuit card Download PDFInfo
- Publication number
- WO2007077356A3 WO2007077356A3 PCT/FR2006/002855 FR2006002855W WO2007077356A3 WO 2007077356 A3 WO2007077356 A3 WO 2007077356A3 FR 2006002855 W FR2006002855 W FR 2006002855W WO 2007077356 A3 WO2007077356 A3 WO 2007077356A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- microcircuit card
- microcircuit
- mould
- producing
- card
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/70—Completely encapsulating inserts
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/183—Connection portion, e.g. seal
- H01L2924/18301—Connection portion, e.g. seal being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part
Abstract
The invention relates to a method for producing a microcircuit card. According to said method, a carrier film comprising a microcircuit is prepared; the film is provided with fixing means; the carrier film prepared in this way is positioned in a mould comprising the impression of the microcircuit card to be produced, the film being dimensioned in such a way as to hang out of the mould in order to facilitate the positioning of the microcircuit; and a plastic material is introduced into the mould such that it fills the impression of the mould and interacts with the fixing means in such a way as to fix the carrier film to the moulded card.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0513320 | 2005-12-26 | ||
FR0513320A FR2895548B1 (en) | 2005-12-26 | 2005-12-26 | METHOD FOR MANUFACTURING A MICROCIRCUIT CARD, AND ASSOCIATED MICROCIRCUIT CARD |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2007077356A2 WO2007077356A2 (en) | 2007-07-12 |
WO2007077356A3 true WO2007077356A3 (en) | 2007-09-07 |
Family
ID=36917263
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR2006/002855 WO2007077356A2 (en) | 2005-12-26 | 2006-12-22 | Method for producing a microcircuit card, and associated microcircuit card |
Country Status (2)
Country | Link |
---|---|
FR (1) | FR2895548B1 (en) |
WO (1) | WO2007077356A2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6125332B2 (en) | 2013-05-31 | 2017-05-10 | ルネサスエレクトロニクス株式会社 | Semiconductor device |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5244840A (en) * | 1989-05-23 | 1993-09-14 | Mitsubishi Denki Kabushiki Kaisha | Method for manufacturing an encapsulated IC card having a molded frame and a circuit board |
EP0664524A2 (en) * | 1994-01-20 | 1995-07-26 | ODS, R. OLDENBOURG DATENSYSTEME GmbH | Method of encapsulating a chipcard module |
US5498388A (en) * | 1990-07-25 | 1996-03-12 | Mitsubishi Denki Kabushiki Kaisha | Production method for an IC card |
US5682673A (en) * | 1995-04-17 | 1997-11-04 | Ipac, Inc. | Method for forming encapsulated IC packages |
WO1999035611A1 (en) * | 1998-01-09 | 1999-07-15 | Siemens Aktiengesellschaft | Support element for a semiconductor chip |
DE19922473A1 (en) * | 1999-05-19 | 2000-11-30 | Giesecke & Devrient Gmbh | Chip carrier module has cut-outs forming large-area setting material holders with boundary forming setting material flow barrier, bridges mechanically connecting adjacent contact areas |
US6614100B1 (en) * | 1996-06-24 | 2003-09-02 | Infineon Technologies Ag | Lead frame for the installation of an integrated circuit in an injection-molded package |
DE10235770A1 (en) * | 2002-08-05 | 2004-02-19 | Giesecke & Devrient Gmbh | To produce a chip card, the chip module is fixed in place within the injection mold, to be encapsulated accurately within the molded card-shaped body in an efficient injection molding operation |
-
2005
- 2005-12-26 FR FR0513320A patent/FR2895548B1/en not_active Expired - Fee Related
-
2006
- 2006-12-22 WO PCT/FR2006/002855 patent/WO2007077356A2/en active Application Filing
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5244840A (en) * | 1989-05-23 | 1993-09-14 | Mitsubishi Denki Kabushiki Kaisha | Method for manufacturing an encapsulated IC card having a molded frame and a circuit board |
US5498388A (en) * | 1990-07-25 | 1996-03-12 | Mitsubishi Denki Kabushiki Kaisha | Production method for an IC card |
EP0664524A2 (en) * | 1994-01-20 | 1995-07-26 | ODS, R. OLDENBOURG DATENSYSTEME GmbH | Method of encapsulating a chipcard module |
US5682673A (en) * | 1995-04-17 | 1997-11-04 | Ipac, Inc. | Method for forming encapsulated IC packages |
US6614100B1 (en) * | 1996-06-24 | 2003-09-02 | Infineon Technologies Ag | Lead frame for the installation of an integrated circuit in an injection-molded package |
WO1999035611A1 (en) * | 1998-01-09 | 1999-07-15 | Siemens Aktiengesellschaft | Support element for a semiconductor chip |
DE19922473A1 (en) * | 1999-05-19 | 2000-11-30 | Giesecke & Devrient Gmbh | Chip carrier module has cut-outs forming large-area setting material holders with boundary forming setting material flow barrier, bridges mechanically connecting adjacent contact areas |
DE10235770A1 (en) * | 2002-08-05 | 2004-02-19 | Giesecke & Devrient Gmbh | To produce a chip card, the chip module is fixed in place within the injection mold, to be encapsulated accurately within the molded card-shaped body in an efficient injection molding operation |
Also Published As
Publication number | Publication date |
---|---|
FR2895548A1 (en) | 2007-06-29 |
WO2007077356A2 (en) | 2007-07-12 |
FR2895548B1 (en) | 2008-03-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1938968A4 (en) | Resin film and method for producing same, printed matter, label and resin molded article | |
EP1862491A4 (en) | Thermoplastic resin, method for producing same and molding material | |
EP1958968A4 (en) | Ultraviolet-curable polymer composition, resin molded article and method for producing same | |
EP2053091A4 (en) | Resin composition, method for producing the same and molded article | |
EP1778785A4 (en) | Transparent thermoplastic resin compositions and process for preparing the same | |
EP2017306A4 (en) | Thermoplastic resin composition, process for producing the same and molding | |
EP1640406A4 (en) | Aliphatic polyester resin composition, method for production thereof, molded article and foamed article comprising the resin composition | |
EP1938918A4 (en) | Mold, method for manufacture of the mold, and molded article using the mold | |
TWI366575B (en) | Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin | |
EP2003158A4 (en) | Dendritic polyester, method for producing the same, and thermoplastic resin composition | |
EP2133200A4 (en) | Conductive-substance-adsorbing resin film, process for producing conductive-substance-adsorbing resin film, metal-layer-coated resin film made from the same, and process for producing metal-layer-coated resin film | |
EP1690899A4 (en) | Resin composition, molding thereof and process for producing the resin composition | |
EP2020283A4 (en) | Mold for thermoplastic resin molding, cavity mold, and process for producing the cavity mold | |
EP1932884A4 (en) | Biodegradable resin composition, process for production of the same, and molded article using the same | |
EP1872969A4 (en) | Transfer film, and synthetic resin molded product having decoration formed by transfer film | |
EP1826226A4 (en) | Aqueous polyurethane resin, method for producing aqueous polyurethane resin and film | |
DE602004004398D1 (en) | MOLDING DEVICE FOR PRODUCING CONTAINERS FROM THERMOPLASTIC MATERIAL | |
EP1693403A4 (en) | Thermoplastic resin composition for masterbatch, process for producing molding material comprising the same, thermoplastic resin composition obtained with the same, and process for producing the composition | |
EP1818153A4 (en) | Decorated molded article and method for producing the same | |
EP1793695A4 (en) | Novel vamp, and injection moulding process for forming a vamp | |
EP1721923A4 (en) | Aromatic polycarbonate resin composition and process for producing the same | |
EP1760104A4 (en) | Liquid-crystalline resin, process for producing the same, composition of liquid-crystalline resin, and molded article | |
GB2417461B (en) | Anti-reflective moulded plastic components and methods for making the same | |
EP1852719A4 (en) | Method of designing diffusion film, process for producing the same, and diffusion film obtained thereby | |
EP1591487A4 (en) | Resin composition and process for producing resin molding |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 06847125 Country of ref document: EP Kind code of ref document: A2 |