WO2007078496A3 - Configurable on-die termination - Google Patents

Configurable on-die termination Download PDF

Info

Publication number
WO2007078496A3
WO2007078496A3 PCT/US2006/045966 US2006045966W WO2007078496A3 WO 2007078496 A3 WO2007078496 A3 WO 2007078496A3 US 2006045966 W US2006045966 W US 2006045966W WO 2007078496 A3 WO2007078496 A3 WO 2007078496A3
Authority
WO
WIPO (PCT)
Prior art keywords
termination
configurable
die termination
topology
rail
Prior art date
Application number
PCT/US2006/045966
Other languages
French (fr)
Other versions
WO2007078496A2 (en
Inventor
Huy Nguyen
Original Assignee
Rambus Inc
Huy Nguyen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rambus Inc, Huy Nguyen filed Critical Rambus Inc
Priority to JP2008547256A priority Critical patent/JP4990910B2/en
Priority to DE112006003478T priority patent/DE112006003478B4/en
Publication of WO2007078496A2 publication Critical patent/WO2007078496A2/en
Publication of WO2007078496A3 publication Critical patent/WO2007078496A3/en

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
    • H03K19/0005—Modifications of input or output impedance
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/02—Transmitters
    • H04B1/04—Circuits
    • H04B1/0458—Arrangements for matching and coupling between power amplifier and antenna or between amplifying stages
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L25/00—Baseband systems
    • H04L25/02—Details ; arrangements for supplying electrical power along data transmission lines
    • H04L25/0264—Arrangements for coupling to transmission lines
    • H04L25/0278—Arrangements for impedance matching
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L25/00—Baseband systems
    • H04L25/02—Details ; arrangements for supplying electrical power along data transmission lines
    • H04L25/0264—Arrangements for coupling to transmission lines
    • H04L25/0298—Arrangement for terminating transmission lines

Abstract

Described are systems that employ configurable on-die termination elements that allow users to select from two or more termination topologies. One topology is programmable to support rail-to-rail or half-supply termination. Another topology selectively includes fixed or variable filter elements, thereby allowing the termination characteristics to be tuned for different levels of speed performance and power consumption. Termination voltages and impedances might also be adjusted.
PCT/US2006/045966 2005-12-19 2006-11-30 Configurable on-die termination WO2007078496A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008547256A JP4990910B2 (en) 2005-12-19 2006-11-30 Configurable on-die termination
DE112006003478T DE112006003478B4 (en) 2005-12-19 2006-11-30 Configurable on-chip termination

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/313,054 2005-12-19
US11/313,054 US7439760B2 (en) 2005-12-19 2005-12-19 Configurable on-die termination

Publications (2)

Publication Number Publication Date
WO2007078496A2 WO2007078496A2 (en) 2007-07-12
WO2007078496A3 true WO2007078496A3 (en) 2007-08-30

Family

ID=37983601

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/045966 WO2007078496A2 (en) 2005-12-19 2006-11-30 Configurable on-die termination

Country Status (4)

Country Link
US (12) US7439760B2 (en)
JP (1) JP4990910B2 (en)
DE (1) DE112006003478B4 (en)
WO (1) WO2007078496A2 (en)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100585128B1 (en) * 2004-02-16 2006-05-30 삼성전자주식회사 Semiconductor memory device with different types of termination devices according to frequency of input signals and semiconductor memory system having the semiconductor memory device
US7439760B2 (en) * 2005-12-19 2008-10-21 Rambus Inc. Configurable on-die termination
US7486104B2 (en) 2006-06-02 2009-02-03 Rambus Inc. Integrated circuit with graduated on-die termination
KR100790821B1 (en) * 2006-11-15 2008-01-03 삼성전자주식회사 On die termination circuit in semiconductor memory device
KR101304456B1 (en) * 2007-01-19 2013-09-04 삼성전자주식회사 Apparatus and method for interfacing data of a printing head chip
US10608634B2 (en) * 2007-06-08 2020-03-31 Conversant Intellectual Property Management Inc. Dynamic impedance control for input/output buffers
WO2009014796A1 (en) * 2007-07-19 2009-01-29 Rambus Inc. Reference voltage and impedance calibration in a multi-mode interface
DE102007039616B4 (en) * 2007-08-22 2009-04-09 Continental Automotive Gmbh Transceiver circuits
US20090080266A1 (en) * 2007-09-25 2009-03-26 Zumkehr John F Double data rate (ddr) low power idle mode through reference offset
US7649409B1 (en) * 2007-10-23 2010-01-19 National Semiconductor Corporation All-pass termination network with equalization and wide common-mode range
US7936180B2 (en) * 2008-02-01 2011-05-03 Mediatek Inc. Serial link transmitter
JP4544326B2 (en) * 2008-03-26 2010-09-15 セイコーエプソン株式会社 Integrated circuit device, electro-optical device and electronic apparatus
JP2009252322A (en) * 2008-04-09 2009-10-29 Nec Electronics Corp Semiconductor memory device
US7741867B2 (en) * 2008-10-30 2010-06-22 Hewlett-Packard Development Company, L.P. Differential on-line termination
US9608630B2 (en) * 2009-05-06 2017-03-28 Micron Technology, Inc. Reference voltage circuits and on-die termination circuits, methods for updating the same, and methods for tracking supply, temperature, and/or process variation
KR20110003725A (en) * 2009-07-06 2011-01-13 삼성전자주식회사 Transceiver for controlling the swing width of output voltage, method for controlling the swing width of output voltage
US8188615B2 (en) 2009-09-18 2012-05-29 Ati Technologies Ulc Integrated circuit adapted to be selectively AC or DC coupled
US20110133773A1 (en) * 2009-12-04 2011-06-09 Uniram Technology Inc. High Performance Output Drivers and Anti-Reflection Circuits
US8188764B2 (en) * 2010-03-18 2012-05-29 Sandisk Technologies Inc. Efficient electrical hibernate entry and recovery
US8588012B2 (en) 2010-06-17 2013-11-19 Rambus, Inc. Balanced on-die termination
GB2486274A (en) * 2010-12-10 2012-06-13 Microsemi Semiconductor Corp A programmable bias circuit for the centre node of a balanced receiver termination circuit
JP5421300B2 (en) * 2011-01-19 2014-02-19 日本電信電話株式会社 Clock input interface circuit
US8487650B2 (en) 2011-01-25 2013-07-16 Rambus Inc. Methods and circuits for calibrating multi-modal termination schemes
TWI445301B (en) * 2011-03-03 2014-07-11 Realtek Semiconductor Corp Transceiving circuit and transceiving circuit resistance calibration method
US9224430B2 (en) 2011-07-27 2015-12-29 Micron Technology, Inc. Devices, methods, and systems supporting on unit termination
US9281816B2 (en) * 2012-01-31 2016-03-08 Rambus Inc. Modulated on-die termination
US9373384B2 (en) * 2012-04-02 2016-06-21 Rambus Inc. Integrated circuit device having programmable input capacitance
US8611385B2 (en) 2012-05-17 2013-12-17 Lsi Corporation Optical source driver circuit with controllable termination
TWI493890B (en) * 2012-07-24 2015-07-21 Novatek Microelectronics Corp Reception circuit
US8836383B2 (en) * 2012-09-07 2014-09-16 Richtek Technology Corporation Multipurpose half bridge signal output circuit
TWI469510B (en) * 2012-10-09 2015-01-11 Novatek Microelectronics Corp Interface circuit
US9525571B2 (en) * 2013-03-05 2016-12-20 Lattice Semiconductor Corporation Calibration of single-ended high-speed interfaces
US8912819B2 (en) * 2013-03-18 2014-12-16 Mediatek Inc. Termination circuits capable of receiving data signals in different formats for performing impedance matching
US8994399B2 (en) * 2013-04-29 2015-03-31 Broadcom Corporation Transmission line driver with output swing control
US9444455B2 (en) * 2013-12-10 2016-09-13 Sandisk Technologies Llc Load impedance adjustment for an interface of a data storage device
KR20150113587A (en) * 2014-03-31 2015-10-08 에스케이하이닉스 주식회사 Semiconductor device
WO2016164019A1 (en) * 2015-04-09 2016-10-13 Hewlett Packard Enterprise Development Lp Termination voltage circuits
US9910482B2 (en) * 2015-09-24 2018-03-06 Qualcomm Incorporated Memory interface with adjustable voltage and termination and methods of use
US9871518B2 (en) * 2016-02-02 2018-01-16 Mediatek Inc. Memory interface circuit capable of controlling driving ability and associated control method
US20170243628A1 (en) * 2016-02-22 2017-08-24 Mediatek Inc. Termination topology of memory system and associated memory module and control method
CN105931593B (en) * 2016-06-30 2019-03-19 深圳市华星光电技术有限公司 The display device of circuit structure with the more receiving ends VBO
US11450613B2 (en) * 2018-03-23 2022-09-20 Intel Corporation Integrated circuit package with test circuitry for testing a channel between dies
US10484044B1 (en) * 2018-05-01 2019-11-19 Huawei Technologies Co., Ltd. Differential termination modulation for back-channel communication
US10411703B1 (en) * 2018-06-05 2019-09-10 Samsung Electronics Co., Ltd. Impedance matched clock driver with amplitude control
US10592458B1 (en) * 2018-09-18 2020-03-17 Apple Inc. Bimodal impedance matching terminators
KR20200115805A (en) 2019-03-26 2020-10-08 삼성전자주식회사 Receiver for compensating common mode offset
US11409354B2 (en) 2019-04-22 2022-08-09 Micron Technology, Inc. Multi-voltage operation for driving a multi-mode channel
KR20220034561A (en) 2020-09-11 2022-03-18 삼성전자주식회사 Transmitter for generating multi-level signal and memory system including the same
US11196247B1 (en) * 2020-10-19 2021-12-07 Dyna Image Corporation Digital device using three states

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0817441A2 (en) * 1996-06-26 1998-01-07 Lucent Technologies Inc. Integrated circuit chip with adaptive input-output port
US20030112751A1 (en) * 2001-12-17 2003-06-19 Marcelo Yuffe Method and apparatus for driving a signal using switchable on-die termination
US20050225353A1 (en) * 2004-04-08 2005-10-13 Hynix Semiconductor Inc. On die termination circuit

Family Cites Families (120)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5919436A (en) * 1982-07-26 1984-01-31 Toshiba Corp Transfer circuit
US4584695A (en) 1983-11-09 1986-04-22 National Semiconductor Corporation Digital PLL decoder
JP2911038B2 (en) 1988-11-21 1999-06-23 株式会社アドバンテスト Multi-value drive circuit
US5544067A (en) 1990-04-06 1996-08-06 Lsi Logic Corporation Method and system for creating, deriving and validating structural description of electronic system from higher level, behavior-oriented description, including interactive schematic design and simulation
US5243229A (en) 1991-06-28 1993-09-07 At&T Bell Laboratories Digitally controlled element sizing
US5194765A (en) 1991-06-28 1993-03-16 At&T Bell Laboratories Digitally controlled element sizing
US5254883A (en) 1992-04-22 1993-10-19 Rambus, Inc. Electrical current source circuitry for a bus
US5396028A (en) 1993-05-05 1995-03-07 Texas Instruments Incorporated Method and apparatus for transmission line termination
US5406147A (en) * 1993-06-18 1995-04-11 Digital Equipment Corporation Propagation speedup by use of complementary resolver outputs in a system bus receiver
JPH07135513A (en) * 1993-09-17 1995-05-23 Fujitsu Ltd Method and device for termination control for current drive circuit
US5467455A (en) 1993-11-03 1995-11-14 Motorola, Inc. Data processing system and method for performing dynamic bus termination
SE9400657D0 (en) 1994-02-25 1994-02-25 Ellemtel Utvecklings Ab One, a control voltage generating, circuit
US7135584B2 (en) * 1995-08-07 2006-11-14 Wake Forest University Lipid analogs for treating viral infections
DE4445846A1 (en) 1994-12-22 1996-06-27 Sel Alcatel Ag Method and circuit arrangement for the termination of a line leading to an integrated CMOS circuit
US5528168A (en) * 1995-03-29 1996-06-18 Intel Corporation Power saving terminated bus
US5578940A (en) 1995-04-04 1996-11-26 Rambus, Inc. Modular bus with single or double parallel termination
US5546016A (en) 1995-07-03 1996-08-13 Intel Corporation MOS termination for low power signaling
US5666078A (en) 1996-02-07 1997-09-09 International Business Machines Corporation Programmable impedance output driver
US5781028A (en) * 1996-06-21 1998-07-14 Microsoft Corporation System and method for a switched data bus termination
US5726583A (en) 1996-07-19 1998-03-10 Kaplinsky; Cecil H. Programmable dynamic line-termination circuit
JP3698828B2 (en) 1996-08-29 2005-09-21 富士通株式会社 Signal transmission system, semiconductor device module, input buffer circuit, and semiconductor device
US5939986A (en) * 1996-10-18 1999-08-17 The United States Of America As Represented By The United States Department Of Energy Mobile machine hazardous working zone warning system
US5926031A (en) 1996-10-29 1999-07-20 Linfinitymicroelectronics, Inc. High speed digital bus termination
US5995894A (en) 1997-05-27 1999-11-30 Case Corporation System for analyzing spatially-variable harvest data by pass
US5982191A (en) 1997-06-25 1999-11-09 Sun Microsystems, Inc. Broadly distributed termination for buses using switched terminator logic
US6232792B1 (en) 1997-06-25 2001-05-15 Sun Microsystems, Inc. Terminating transmission lines using on-chip terminator circuitry
US6060907A (en) 1997-06-25 2000-05-09 Sun Microsystems, Inc. Impedance control circuit
US6323672B1 (en) 1997-06-25 2001-11-27 Sun Microsystems, Inc. Apparatus for reducing reflections when using dynamic termination logic signaling
DE19735982C2 (en) 1997-08-19 2000-04-27 Ericsson Telefon Ab L M Line receiver circuit with line termination impedance
US6094075A (en) 1997-08-29 2000-07-25 Rambus Incorporated Current control technique
US5969658A (en) 1997-11-18 1999-10-19 Burr-Brown Corporation R/2R ladder circuit and method for digital-to-analog converter
US6040714A (en) * 1997-12-12 2000-03-21 Micron Electronics, Inc. Method for providing two modes of I/O pad termination
US6147520A (en) * 1997-12-18 2000-11-14 Lucent Technologies, Inc. Integrated circuit having controlled impedance
US6072943A (en) * 1997-12-30 2000-06-06 Lsi Logic Corporation Integrated bus controller and terminating chip
US6028484A (en) 1998-02-10 2000-02-22 Acuson Corporation Ultrasound apparatus and method for amplifying transmit signals
US6510503B2 (en) 1998-07-27 2003-01-21 Mosaid Technologies Incorporated High bandwidth memory interface
US6064224A (en) 1998-07-31 2000-05-16 Hewlett--Packard Company Calibration sharing for CMOS output driver
US6198307B1 (en) 1998-10-26 2001-03-06 Rambus Inc. Output driver circuit with well-controlled output impedance
US6157206A (en) 1998-12-31 2000-12-05 Intel Corporation On-chip termination
US6418500B1 (en) 1999-02-12 2002-07-09 Fujitsu Limited Feedback control for termination adjustment
US6266001B1 (en) 1999-05-05 2001-07-24 Maxim Integrated Products, Inc. Method and apparatus for switching low voltage CMOS switches in high voltage digital to analog converters
US6308232B1 (en) 1999-09-01 2001-10-23 Rambus Inc. Electronically moveable terminator and method for using same in a memory system
US6353334B1 (en) 2000-01-27 2002-03-05 Xilinx, Inc. Circuit for converting a logic signal on an output node to a pair of low-voltage differential signals
US6530062B1 (en) 2000-03-10 2003-03-04 Rambus Inc. Active impedance compensation
US6509756B1 (en) 2000-03-31 2003-01-21 Rambus Inc. Method and apparatus for low capacitance, high output impedance driver
US6462588B2 (en) 2000-04-03 2002-10-08 Rambus, Inc. Asymmetry control for an output driver
US6356105B1 (en) 2000-06-28 2002-03-12 Intel Corporation Impedance control system for a center tapped termination bus
US6366128B1 (en) 2000-09-05 2002-04-02 Xilinx, Inc. Circuit for producing low-voltage differential signals
US6356106B1 (en) 2000-09-12 2002-03-12 Micron Technology, Inc. Active termination in a multidrop memory system
US6411122B1 (en) 2000-10-27 2002-06-25 Intel Corporation Apparatus and method for dynamic on-die termination in an open-drain bus architecture system
KR100375986B1 (en) 2000-11-27 2003-03-15 삼성전자주식회사 Programmable impedance control circuit
KR100394586B1 (en) 2000-11-30 2003-08-14 삼성전자주식회사 Impedance control circuit
EP1358737A4 (en) 2001-02-06 2009-12-02 2Wire Inc Loop extender with selectable line termination and equalization
US6495997B2 (en) 2001-02-15 2002-12-17 Intel Corporation High impedance current mode voltage scalable driver
TW536066U (en) 2001-03-13 2003-06-01 Realtek Semiconductor Corp Impedance matching circuit
US20020130680A1 (en) * 2001-03-15 2002-09-19 Meyer Bruce Alan Method and apparatus for terminating emitter coupled logic (ECL) transceivers
US7120390B2 (en) * 2001-03-21 2006-10-10 Agere Systems Inc. BLUETOOTH smart offset compensation
US6675272B2 (en) 2001-04-24 2004-01-06 Rambus Inc. Method and apparatus for coordinating memory operations among diversely-located memory components
US8391039B2 (en) 2001-04-24 2013-03-05 Rambus Inc. Memory module with termination component
US6545522B2 (en) 2001-05-17 2003-04-08 Intel Corporation Apparatus and method to provide a single reference component for multiple circuit compensation using digital impedance code shifting
US6535047B2 (en) * 2001-05-17 2003-03-18 Intel Corporation Apparatus and method to use a single reference component in a master-slave configuration for multiple circuit compensation
US6424170B1 (en) 2001-05-18 2002-07-23 Intel Corporation Apparatus and method for linear on-die termination in an open drain bus architecture system
US6806728B2 (en) 2001-08-15 2004-10-19 Rambus, Inc. Circuit and method for interfacing to a bus channel
US7102200B2 (en) 2001-09-04 2006-09-05 Intel Corporation On-die termination resistor with analog compensation
US6573747B2 (en) 2001-09-28 2003-06-03 Intel Corporation Digital update scheme for adaptive impedance control of on-die input/output circuits
JP3721117B2 (en) * 2001-10-29 2005-11-30 エルピーダメモリ株式会社 I / O circuit, reference voltage generation circuit, and semiconductor integrated circuit
US6657906B2 (en) 2001-11-28 2003-12-02 Micron Technology, Inc. Active termination circuit and method for controlling the impedance of external integrated circuit terminals
US7109744B1 (en) * 2001-12-11 2006-09-19 Altera Corporation Programmable termination with DC voltage level control
US6981089B2 (en) * 2001-12-31 2005-12-27 Intel Corporation Memory bus termination with memory unit having termination control
US6744275B2 (en) * 2002-02-01 2004-06-01 Intel Corporation Termination pair for a differential driver-differential receiver input output circuit
US6683472B2 (en) * 2002-02-19 2004-01-27 Rambus Inc. Method and apparatus for selectably providing single-ended and differential signaling with controllable impedance and transition time
US6781405B2 (en) 2002-04-29 2004-08-24 Rambus Inc. Adaptive signal termination
US6894691B2 (en) 2002-05-01 2005-05-17 Dell Products L.P. Dynamic switching of parallel termination for power management with DDR memory
KR100422451B1 (en) 2002-05-24 2004-03-11 삼성전자주식회사 method for controlling on-die termination and control circuit therefore
US6965529B2 (en) 2002-06-21 2005-11-15 Intel Coproration Memory bus termination
US6968413B2 (en) * 2002-10-07 2005-11-22 International Business Machines Corporation Method and system for configuring terminators in a serial communication system
KR100860523B1 (en) * 2002-10-11 2008-09-26 엘지디스플레이 주식회사 In plane switching mode liquid crystal display device and fabrication method thereof
US6700823B1 (en) * 2002-10-30 2004-03-02 Lattice Semiconductor Corporation Programmable common mode termination for input/output circuits
US6734702B1 (en) 2002-11-12 2004-05-11 Texas Instruments Incorporated Impedance calibration circuit
US6768352B1 (en) 2002-11-13 2004-07-27 Cypress Semiconductor Corp. Low voltage receiver circuit and method for shifting the differential input signals of the receiver depending on a common mode voltage of the input signals
US6940303B2 (en) * 2002-11-29 2005-09-06 Roy L. Vargas System and method to establish an adjustable on-chip impedance
US20040124850A1 (en) 2002-12-31 2004-07-01 Koneru Surya N. Calibration circuit for current source and on-die terminations
US6842035B2 (en) 2002-12-31 2005-01-11 Intel Corporation Apparatus and method for bus signal termination compensation during detected quiet cycle
KR100532426B1 (en) * 2003-03-25 2005-11-30 삼성전자주식회사 Semiconductor device for compensating for on-chip termination mismatch
US6856169B2 (en) * 2003-05-09 2005-02-15 Rambus, Inc. Method and apparatus for signal reception using ground termination and/or non-ground termination
US7068064B1 (en) * 2003-05-12 2006-06-27 Pericom Semiconductor Corp. Memory module with dynamic termination using bus switches timed by memory clock and chip select
JP4492920B2 (en) * 2003-05-27 2010-06-30 ルネサスエレクトロニクス株式会社 Differential signal transmission system
US7061273B2 (en) 2003-06-06 2006-06-13 Rambus Inc. Method and apparatus for multi-mode driver
KR100583636B1 (en) 2003-08-19 2006-05-26 삼성전자주식회사 Device of controlling impedance of termination circuit and off-chip driver circuit using one reference resistor
US6888370B1 (en) * 2003-08-20 2005-05-03 Altera Corporation Dynamically adjustable termination impedance control techniques
US6924660B2 (en) * 2003-09-08 2005-08-02 Rambus Inc. Calibration methods and circuits for optimized on-die termination
US7088127B2 (en) 2003-09-12 2006-08-08 Rambus, Inc. Adaptive impedance output driver circuit
US6980020B2 (en) 2003-12-19 2005-12-27 Rambus Inc. Calibration methods and circuits for optimized on-die termination
US7173450B2 (en) 2004-06-01 2007-02-06 Hewlett-Packard Development Company, L.P. Bus controller
KR100539267B1 (en) * 2004-06-14 2005-12-27 삼성전자주식회사 Memory system having scheme for stably terminating a pair of differential signals on a pair of transmission lines
US7123047B2 (en) 2004-08-18 2006-10-17 Intel Corporation Dynamic on-die termination management
JP4562175B2 (en) * 2004-08-31 2010-10-13 ルネサスエレクトロニクス株式会社 Termination resistance adjustment circuit
KR100555571B1 (en) * 2004-09-07 2006-03-03 삼성전자주식회사 Transmitter of semiconductor device
KR100670702B1 (en) * 2004-10-30 2007-01-17 주식회사 하이닉스반도체 Semiconductor memory device with on die termination circuit
US7196567B2 (en) 2004-12-20 2007-03-27 Rambus Inc. Systems and methods for controlling termination resistance values for a plurality of communication channels
US7135884B1 (en) * 2005-01-13 2006-11-14 Advanced Micro Devices, Inc. Voltage mode transceiver having programmable voltage swing and external reference-based calibration
US7245154B1 (en) * 2005-03-03 2007-07-17 Lattice Semiconductor Corporation Differential input receiver with programmable failsafe
US7432731B2 (en) 2005-06-30 2008-10-07 Intel Corporation Method and apparatus to calibrate DRAM on resistance (Ron) and on-die termination (ODT) values over process, voltage and temperature (PVT) variations
KR100640158B1 (en) 2005-09-27 2006-11-01 주식회사 하이닉스반도체 Semiconductor memory device with ability to mediate impedance of data output-driver
US7342411B2 (en) 2005-12-07 2008-03-11 Intel Corporation Dynamic on-die termination launch latency reduction
US7439760B2 (en) * 2005-12-19 2008-10-21 Rambus Inc. Configurable on-die termination
US7268712B1 (en) * 2006-04-18 2007-09-11 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for calibrating on-die components
US7486104B2 (en) * 2006-06-02 2009-02-03 Rambus Inc. Integrated circuit with graduated on-die termination
JP4876987B2 (en) * 2007-03-12 2012-02-15 住友電気工業株式会社 Receiver circuit
WO2009001760A1 (en) * 2007-06-22 2008-12-31 Nec Corporation Data transmission system and method, and electronic device having that data transmission system
US7750666B2 (en) * 2008-09-15 2010-07-06 Integrated Device Technology, Inc. Reduced power differential type termination circuit
US20110019760A1 (en) * 2009-07-21 2011-01-27 Rambus Inc. Methods and Systems for Reducing Supply and Termination Noise
US8487650B2 (en) * 2011-01-25 2013-07-16 Rambus Inc. Methods and circuits for calibrating multi-modal termination schemes
US8798204B2 (en) * 2011-09-09 2014-08-05 International Business Machines Corporation Serial link receiver for handling high speed transmissions
US9281816B2 (en) * 2012-01-31 2016-03-08 Rambus Inc. Modulated on-die termination
US9871516B2 (en) * 2014-06-04 2018-01-16 Lattice Semiconductor Corporation Transmitting apparatus with source termination
KR102529187B1 (en) * 2016-03-31 2023-05-04 삼성전자주식회사 Reception interface circuit supporting multiple communication standards and memory system including the same
KR20180003938A (en) * 2016-07-01 2018-01-10 삼성전자주식회사 Reception interface circuit and memory system including the same
CN107888180B (en) * 2016-09-30 2021-06-01 扬智科技股份有限公司 System chip and method for correcting terminal impedance element thereof
US11184196B1 (en) * 2020-12-17 2021-11-23 Omnivision Technologies, Inc. Impedance matching system for high speed digital receivers

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0817441A2 (en) * 1996-06-26 1998-01-07 Lucent Technologies Inc. Integrated circuit chip with adaptive input-output port
US20030112751A1 (en) * 2001-12-17 2003-06-19 Marcelo Yuffe Method and apparatus for driving a signal using switchable on-die termination
US20050225353A1 (en) * 2004-04-08 2005-10-13 Hynix Semiconductor Inc. On die termination circuit

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
CAO ET AL: "On-Chip Programmable Termination Scheme", IP.COM JOURNAL, IP.COM INC., WEST HENRIETTA, NY, US, 1 February 1995 (1995-02-01), XP013102938, ISSN: 1533-0001 *

Also Published As

Publication number Publication date
US10236882B2 (en) 2019-03-19
US9338037B2 (en) 2016-05-10
US20200328745A1 (en) 2020-10-15
US8072235B2 (en) 2011-12-06
US7948262B2 (en) 2011-05-24
US20110128041A1 (en) 2011-06-02
WO2007078496A2 (en) 2007-07-12
US7439760B2 (en) 2008-10-21
US20210297079A1 (en) 2021-09-23
US7772876B2 (en) 2010-08-10
US20100237903A1 (en) 2010-09-23
US20190273498A1 (en) 2019-09-05
DE112006003478T5 (en) 2008-12-11
US11012071B2 (en) 2021-05-18
US8466709B2 (en) 2013-06-18
JP2009520443A (en) 2009-05-21
US11843372B2 (en) 2023-12-12
US20090051389A1 (en) 2009-02-26
US20070139071A1 (en) 2007-06-21
US9685951B2 (en) 2017-06-20
JP4990910B2 (en) 2012-08-01
US8941407B2 (en) 2015-01-27
US20160233864A1 (en) 2016-08-11
US20120074983A1 (en) 2012-03-29
US20170338817A1 (en) 2017-11-23
US20150130507A1 (en) 2015-05-14
DE112006003478B4 (en) 2013-11-21
US20140139261A1 (en) 2014-05-22
US10651848B2 (en) 2020-05-12

Similar Documents

Publication Publication Date Title
WO2007078496A3 (en) Configurable on-die termination
ATE441970T1 (en) DUAL CONVERSION RECEIVER WITH PROGRAMMABLE INTERMEDIATE FREQUENCY AND CHANNEL SELECTION
DE602006015134D1 (en) Current controlled fully differential CMOS broadband amplifier / equalizer with adjustable frequency response without increasing power consumption
WO2014016682A3 (en) Highly-spectrally-efficient receiver
WO2006110208A3 (en) Refrigerant system with variable speed compressor and reheat function
WO2010099349A8 (en) Low dissipation amplifier
WO2007002428A3 (en) Multiple output buck converter
WO2009022330A3 (en) Dynamically variable filter
WO2006130712A3 (en) Analog phase shifter using cascaded voltage tunable capacitor
WO2005099181A3 (en) Access point having at least one or more configurable radios
ATE431009T1 (en) LOW NOISE AMPLIFIER WITH VARIABLE GAIN FOR A WIRELESS TERMINAL
WO2005079534A3 (en) Systems and methods for parallel communication
WO2009100096A3 (en) Multi-mode high efficiency linear power amplifier
EP2058897A4 (en) Transmission line resonator, high-frequency filter using the same, high-frequency module, and radio device
WO2012084221A3 (en) Noise reduction between networks
DE602007008980D1 (en) Ultra-wideband differential input and output, high frequency active splitter in an integrated circuit
TWI318498B (en) Variable gain amplifying circuit and method of changing the gain amplifying path
WO2005008904A3 (en) Variable attenuation system having continuous input steering
WO2006013471A3 (en) An asymmetric radio-frequency switch
GB2427086B (en) Variable signal delaying circuit, quadrature frequency converter and radio frequency tuner
GB0816936D0 (en) Variable gain amplifier having wide gain variation and wide bandwidth
WO2009009494A3 (en) Switchable balanced amplifier
TWI339796B (en) Integrated circuit capable of independently operating a plurality of communication channels
WO2003021852A3 (en) Shdsl over pots
WO2006138598A3 (en) Systems and methods for dynamically controlling a tuner

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2008547256

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 1120060034782

Country of ref document: DE

RET De translation (de og part 6b)

Ref document number: 112006003478

Country of ref document: DE

Date of ref document: 20081211

Kind code of ref document: P

WWE Wipo information: entry into national phase

Ref document number: DE

122 Ep: pct application non-entry in european phase

Ref document number: 06838760

Country of ref document: EP

Kind code of ref document: A2