WO2008127425A3 - Abatement of reaction gases from gallium nitride deposition - Google Patents

Abatement of reaction gases from gallium nitride deposition Download PDF

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Publication number
WO2008127425A3
WO2008127425A3 PCT/US2007/084839 US2007084839W WO2008127425A3 WO 2008127425 A3 WO2008127425 A3 WO 2008127425A3 US 2007084839 W US2007084839 W US 2007084839W WO 2008127425 A3 WO2008127425 A3 WO 2008127425A3
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor material
group iii
exhaust gases
wafers
methods
Prior art date
Application number
PCT/US2007/084839
Other languages
French (fr)
Other versions
WO2008127425A2 (en
Inventor
Chantal Arena
Christiaan Werkhoven
Original Assignee
Soitec Silicon On Insulator
Chantal Arena
Christiaan Werkhoven
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soitec Silicon On Insulator, Chantal Arena, Christiaan Werkhoven filed Critical Soitec Silicon On Insulator
Priority to EP07873617A priority Critical patent/EP2083935B1/en
Priority to US12/305,495 priority patent/US8585820B2/en
Priority to JP2009538458A priority patent/JP5575482B2/en
Priority to AT07873617T priority patent/ATE546570T1/en
Priority to KR1020097012936A priority patent/KR101353334B1/en
Publication of WO2008127425A2 publication Critical patent/WO2008127425A2/en
Publication of WO2008127425A3 publication Critical patent/WO2008127425A3/en
Priority to US14/055,281 priority patent/US9038565B2/en

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    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/14Feed and outlet means for the gases; Modifying the flow of the reactive gases
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/34Chemical or biological purification of waste gases
    • B01D53/74General processes for purification of waste gases; Apparatus or devices specially adapted therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J12/00Chemical processes in general for reacting gaseous media with gaseous media; Apparatus specially adapted therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/16Layered products comprising a layer of metal next to a particulate layer
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/08Reaction chambers; Selection of materials therefor
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/16Controlling or regulating
    • C30B25/165Controlling or regulating the flow of the reactive gases
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Environmental & Geological Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Biomedical Technology (AREA)
  • Analytical Chemistry (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Vapour Deposition (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

Methods for the sustained, high-volume production of Group III-V compound semiconductor material suitable for fabrication of optic and electronic components, for use as substrates for epitaxial deposition, or for wafers. The equipment and methods are optimized for producing Group III-N (nitrogen) compound semiconductor wafers and specifically for producing GaN wafers. The method includes reacting an amount of a gaseous Group III precursor as one reactant with an amount of a gaseous Group V component as another reactant in a reaction chamber to form the semiconductor material; removing exhaust gases including unreacted Group III precursor, unreacted Group V component and reaction byproducts; and heating the exhaust gases to a temperature sufficient to reduce condensation thereof and enhance manufacture of the semiconductor material. Advantageously, the exhaust gases are heated to sufficiently avoid condensation to facilitate sustained high volume manufacture of the semiconductor material.
PCT/US2007/084839 2006-11-22 2007-11-15 Abatement of reaction gases from gallium nitride deposition WO2008127425A2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
EP07873617A EP2083935B1 (en) 2006-11-22 2007-11-15 Method for epitaxial deposition of a monocrystalline Group III-V semiconductor material
US12/305,495 US8585820B2 (en) 2006-11-22 2007-11-15 Abatement of reaction gases from gallium nitride deposition
JP2009538458A JP5575482B2 (en) 2006-11-22 2007-11-15 Epitaxial deposition method and deposition system of single crystal III-V semiconductor material
AT07873617T ATE546570T1 (en) 2006-11-22 2007-11-15 METHOD FOR EPITACTICAL DEPOSITION OF SINGLE CRYSTALLINE III-V SEMICONDUCTOR MATERIAL
KR1020097012936A KR101353334B1 (en) 2006-11-22 2007-11-15 Abatement of reaction gases from gallium nitride deposition
US14/055,281 US9038565B2 (en) 2006-11-22 2013-10-16 Abatement of reaction gases from gallium nitride deposition

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US86692806P 2006-11-22 2006-11-22
US60/866,928 2006-11-22
US94283207P 2007-06-08 2007-06-08
US60/942,832 2007-06-08

Publications (2)

Publication Number Publication Date
WO2008127425A2 WO2008127425A2 (en) 2008-10-23
WO2008127425A3 true WO2008127425A3 (en) 2008-12-18

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/084839 WO2008127425A2 (en) 2006-11-22 2007-11-15 Abatement of reaction gases from gallium nitride deposition

Country Status (6)

Country Link
US (2) US8585820B2 (en)
EP (1) EP2083935B1 (en)
JP (1) JP5575482B2 (en)
KR (1) KR101353334B1 (en)
AT (1) ATE546570T1 (en)
WO (1) WO2008127425A2 (en)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8236267B2 (en) 2008-06-04 2012-08-07 Sixpoint Materials, Inc. High-pressure vessel for growing group III nitride crystals and method of growing group III nitride crystals using high-pressure vessel and group III nitride crystal
US8728234B2 (en) 2008-06-04 2014-05-20 Sixpoint Materials, Inc. Methods for producing improved crystallinity group III-nitride crystals from initial group III-nitride seed by ammonothermal growth
EP2038456B1 (en) * 2006-06-09 2014-03-05 Soitec System and process for high volume deposition of gallium nitride
JP5244814B2 (en) 2006-11-22 2013-07-24 ソイテック Method, assembly and system using temperature controlled purge gate valve for chemical vapor deposition chamber
US8382898B2 (en) 2006-11-22 2013-02-26 Soitec Methods for high volume manufacture of group III-V semiconductor materials
US9481943B2 (en) 2006-11-22 2016-11-01 Soitec Gallium trichloride injection scheme
KR101379410B1 (en) 2006-11-22 2014-04-11 소이텍 Eqipment for high volume manufacture of group ⅲ-ⅴ semiconductor materials
US8197597B2 (en) 2006-11-22 2012-06-12 Soitec Gallium trichloride injection scheme
US9481944B2 (en) 2006-11-22 2016-11-01 Soitec Gas injectors including a funnel- or wedge-shaped channel for chemical vapor deposition (CVD) systems and CVD systems with the same
EP2245218B1 (en) 2008-02-25 2019-06-19 SixPoint Materials, Inc. Method for producing group iii nitride wafers and group iii nitride wafers
WO2010129718A2 (en) * 2009-05-05 2010-11-11 Sixpoint Materials, Inc. Growth reactor for gallium-nitride crystals using ammonia and hydrogen chloride
DE102009043848A1 (en) * 2009-08-25 2011-03-03 Aixtron Ag CVD method and CVD reactor
US8133806B1 (en) 2010-09-30 2012-03-13 S.O.I.Tec Silicon On Insulator Technologies Systems and methods for forming semiconductor materials by atomic layer deposition
US8486192B2 (en) 2010-09-30 2013-07-16 Soitec Thermalizing gas injectors for generating increased precursor gas, material deposition systems including such injectors, and related methods
FR2968831B1 (en) * 2010-12-08 2012-12-21 Soitec Silicon On Insulator METHODS OF FORMING NITRIDE III MASSIVE MATERIALS ON METAL NITRIDE GROWTH MATRIX LAYERS AND STRUCTURES FORMED THEREFROM
FR2968830B1 (en) 2010-12-08 2014-03-21 Soitec Silicon On Insulator IMPROVED MATRIX LAYERS FOR THE HETEROEPITAXIAL DEPOSITION OF NITRIDE III SEMICONDUCTOR MATERIALS USING HVPE PROCESSES
US9023721B2 (en) 2010-11-23 2015-05-05 Soitec Methods of forming bulk III-nitride materials on metal-nitride growth template layers, and structures formed by such methods
FR2968678B1 (en) 2010-12-08 2015-11-20 Soitec Silicon On Insulator METHODS OF FORMING GROUP III NITRIDE MATERIALS AND STRUCTURES FORMED THEREFROM
JP2012248803A (en) * 2011-05-31 2012-12-13 Hitachi Cable Ltd Metal chloride gas generator and metal chloride gas generation method, and hydride vapor phase epitaxial growth apparatus, nitride semiconductor wafer, nitride semiconductor device, wafer for nitride semiconductor light-emitting diode, manufacturing method of nitride semiconductor self-supporting substrate, and nitride semiconductor crystal
US9238865B2 (en) 2012-02-06 2016-01-19 Asm Ip Holding B.V. Multiple vapor sources for vapor deposition
CN105981133B (en) * 2014-02-14 2019-06-28 应用材料公司 Top dome with fill assembly
WO2015141064A1 (en) 2014-03-18 2015-09-24 株式会社リコー Process for producing gallium nitride crystal
KR101840534B1 (en) 2016-02-12 2018-05-04 영남대학교 산학협력단 Reactor
US10947640B1 (en) * 2016-12-02 2021-03-16 Svagos Technik, Inc. CVD reactor chamber with resistive heating for silicon carbide deposition
US20180348034A1 (en) * 2017-05-31 2018-12-06 Air Liquide America Specialty Gases Llc Gas sampling apparatus
JP6934852B2 (en) * 2018-12-18 2021-09-15 信越化学工業株式会社 Manufacturing method of gallium oxide film
US11788190B2 (en) 2019-07-05 2023-10-17 Asm Ip Holding B.V. Liquid vaporizer
US11946136B2 (en) 2019-09-20 2024-04-02 Asm Ip Holding B.V. Semiconductor processing device
DE102022105526A1 (en) * 2022-03-09 2023-09-14 Aixtron Se CVD device and method for cleaning a process chamber of a CVD device
CN116403882B (en) * 2023-06-09 2023-08-08 雅安宇焜芯材材料科技有限公司 Semiconductor manufacturing system and method for improving semiconductor manufacturing quality

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5668395A (en) * 1994-11-22 1997-09-16 Northwestern University Composition for InSB and GaAs thin film on silicon substrate for use in photodetectors
US20020045362A1 (en) * 1999-07-09 2002-04-18 Yang Michael X. Method of forming a silicon nitride layer on a semiconductor wafer
US20020108714A1 (en) * 1997-03-03 2002-08-15 Kenneth Doering Processing chamber for atomic layer deposition processes
US20030094446A1 (en) * 2001-04-17 2003-05-22 Mattson Technology, Inc. Rapid thermal processing system for integrated circuits
US20040191142A1 (en) * 1999-11-02 2004-09-30 Ebara Corporation Burner for treating waste gas

Family Cites Families (101)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL292373A (en) * 1962-07-09
NL295293A (en) 1962-07-13
US3724490A (en) 1970-07-06 1973-04-03 Fuller Co Gate valve
DE2912661C2 (en) 1979-03-30 1982-06-24 Wacker-Chemitronic Gesellschaft Fuer Elektronik-Grundstoffe Mbh, 8263 Burghausen Process for the deposition of pure semiconductor material and nozzle for carrying out the process
US4264406A (en) * 1979-06-11 1981-04-28 The United States Of America As Represented By The Secretary Of The Army Method for growing crystals
US4362560A (en) 1980-11-28 1982-12-07 Abrjutin Vladimir N Process for producing high-purity gallium
JPS59188118A (en) 1983-04-08 1984-10-25 Toshiba Corp Manufacture of vapor phase epitaxial crystal
US4498953A (en) 1983-07-27 1985-02-12 At&T Bell Laboratories Etching techniques
US4669821A (en) * 1984-09-19 1987-06-02 Hughes Aircraft Company Radiation resistant optical fiber waveguide
JPS61254225A (en) * 1985-04-30 1986-11-12 Sumitomo Electric Ind Ltd Apparatus for recovering chemical substance in exhaust gas
US5250148A (en) 1985-05-15 1993-10-05 Research Development Corporation Process for growing GaAs monocrystal film
JPS6291494A (en) 1985-10-16 1987-04-25 Res Dev Corp Of Japan Method and device for growing compound semiconductor single crystal
JPS62291494A (en) 1986-06-12 1987-12-18 Mitsubishi Heavy Ind Ltd Control method for compressor
US4839145A (en) 1986-08-27 1989-06-13 Massachusetts Institute Of Technology Chemical vapor deposition reactor
US5151395A (en) 1987-03-24 1992-09-29 Novapure Corporation Bulk gas sorption and apparatus, gas containment/treatment system comprising same, and sorbent composition therefor
US5080549A (en) 1987-05-11 1992-01-14 Epsilon Technology, Inc. Wafer handling system with Bernoulli pick-up
JPS63291893A (en) * 1987-05-22 1988-11-29 Toshiba Corp Vapor growth device for compound semiconductor
US4798701A (en) 1987-07-13 1989-01-17 International Business Machines Corporation Method of synthesizing amorphous group IIIA-group VA compounds
US4792467A (en) 1987-08-17 1988-12-20 Morton Thiokol, Inc. Method for vapor phase deposition of gallium nitride film
JPS6451125A (en) * 1987-08-24 1989-02-27 Toshiba Corp Exhaust treatment device
US4881719A (en) 1988-09-23 1989-11-21 Bowman Jeffrey M Gate valve
US5136978A (en) * 1989-10-30 1992-08-11 The United States Of America As Represented By The Secretary Of The Air Force Heat pipe susceptor for epitaxy
US5077875A (en) * 1990-01-31 1992-01-07 Raytheon Company Reactor vessel for the growth of heterojunction devices
JPH04132681A (en) 1990-09-26 1992-05-06 Sumitomo Electric Ind Ltd Device for epitaxial growth of compound semiconductor
US5300185A (en) 1991-03-29 1994-04-05 Kabushiki Kaisha Toshiba Method of manufacturing III-V group compound semiconductor
TW337513B (en) * 1992-11-23 1998-08-01 Cvd Inc Chemical vapor deposition-produced silicon carbide having improved properties and preparation process thereof
JPH07254635A (en) 1994-03-15 1995-10-03 Hitachi Ltd Semiconductor producing apparatus
US5974069A (en) 1994-09-16 1999-10-26 Rohm Co., Ltd Semiconductor laser and manufacturing method thereof
US5820641A (en) * 1996-02-09 1998-10-13 Mks Instruments, Inc. Fluid cooled trap
US6162488A (en) * 1996-05-14 2000-12-19 Boston University Method for closed loop control of chemical vapor deposition process
US5782980A (en) 1996-05-14 1998-07-21 Advanced Micro Devices, Inc. Low pressure chemical vapor deposition apparatus including a process gas heating subsystem
DE19622402C1 (en) 1996-06-04 1997-10-16 Siemens Ag Substrate induction heating apparatus especially for CVD
KR100200705B1 (en) 1996-06-08 1999-06-15 윤종용 Manufacture apparatus of semiconductor device, process condition of manufacture apparatus, method of manufacturing capacitor using the same
JP3644191B2 (en) 1996-06-25 2005-04-27 住友電気工業株式会社 Semiconductor element
JP4502411B2 (en) 1996-12-05 2010-07-14 大日本スクリーン製造株式会社 Substrate processing equipment
US6066204A (en) 1997-01-08 2000-05-23 Bandwidth Semiconductor, Llc High pressure MOCVD reactor system
EP0942459B1 (en) 1997-04-11 2012-03-21 Nichia Corporation Method of growing nitride semiconductors
US6153260A (en) 1997-04-11 2000-11-28 Applied Materials, Inc. Method for heating exhaust gas in a substrate reactor
US6073366A (en) 1997-07-11 2000-06-13 Asm America, Inc. Substrate cooling system and method
JP2001522142A (en) 1997-11-03 2001-11-13 エーエスエム アメリカ インコーポレイテッド Improved low mass wafer support system
US6006204A (en) * 1997-12-18 1999-12-21 International Business Machines Corporation Correlating transaction records via user-specified identifier creating uncleared transaction
US6099649A (en) * 1997-12-23 2000-08-08 Applied Materials, Inc. Chemical vapor deposition hot-trap for unreacted precursor conversion and effluent removal
JP3068075B2 (en) 1998-01-17 2000-07-24 ハンベック コーポレイション Horizontal reactor for compound semiconductor production
US6126719A (en) * 1998-01-21 2000-10-03 The University Of Dayton Recovery of group III element component from group III-V waste materials
TW393786B (en) 1998-03-26 2000-06-11 Min Shr Method for manufacturing an epitaxial chip
US6086673A (en) 1998-04-02 2000-07-11 Massachusetts Institute Of Technology Process for producing high-quality III-V nitride substrates
US6620256B1 (en) 1998-04-28 2003-09-16 Advanced Technology Materials, Inc. Non-plasma in-situ cleaning of processing chambers using static flow methods
JP2000012463A (en) 1998-06-17 2000-01-14 Mitsubishi Electric Corp Film formation device
WO1999066565A1 (en) 1998-06-18 1999-12-23 University Of Florida Method and apparatus for producing group-iii nitrides
US6080241A (en) 1998-09-02 2000-06-27 Emcore Corporation Chemical vapor deposition chamber having an adjustable flow flange
GB2344822A (en) 1998-12-19 2000-06-21 Epichem Ltd Organometallic compound production using distillation
US6206971B1 (en) * 1999-03-29 2001-03-27 Applied Materials, Inc. Integrated temperature controlled exhaust and cold trap assembly
US6406540B1 (en) 1999-04-27 2002-06-18 The United States Of America As Represented By The Secretary Of The Air Force Process and apparatus for the growth of nitride materials
US6290774B1 (en) 1999-05-07 2001-09-18 Cbl Technology, Inc. Sequential hydride vapor phase epitaxy
US6207844B1 (en) 1999-05-12 2001-03-27 Arizona Board Of Regents Compounds and methods for depositing pure thin films of gallium nitride semiconductor
US6689252B1 (en) 1999-07-28 2004-02-10 Applied Materials, Inc. Abatement of hazardous gases in effluent
US6596079B1 (en) 2000-03-13 2003-07-22 Advanced Technology Materials, Inc. III-V nitride substrate boule and method of making and using the same
JP2001267250A (en) 2000-03-16 2001-09-28 Hitachi Kokusai Electric Inc Device for producing semiconductor
KR100471096B1 (en) * 2004-04-26 2005-03-14 (주)에피플러스 A method for fabricating semiconductor epitaxial layer using metal islands
FR2817395B1 (en) 2000-11-27 2003-10-31 Soitec Silicon On Insulator METHOD FOR MANUFACTURING A SUBSTRATE, IN PARTICULAR FOR OPTICS, ELECTRONICS OR OPTOELECTRONICS AND SUBSTRATE OBTAINED THEREBY
FR2840731B3 (en) 2002-06-11 2004-07-30 Soitec Silicon On Insulator METHOD FOR MANUFACTURING A SUBSTRATE HAVING A USEFUL LAYER OF SINGLE-CRYSTAL SEMICONDUCTOR MATERIAL OF IMPROVED PROPERTIES
US6599362B2 (en) 2001-01-03 2003-07-29 Sandia Corporation Cantilever epitaxial process
JP2002217118A (en) * 2001-01-22 2002-08-02 Japan Pionics Co Ltd Apparatus for manufacturing semiconductor of gallium- nitride film, exhaust gas cleaning equipment, and manufacturing facility
US6815362B1 (en) 2001-05-04 2004-11-09 Lam Research Corporation End point determination of process residues in wafer-less auto clean process using optical emission spectroscopy
US6632725B2 (en) 2001-06-29 2003-10-14 Centre National De La Recherche Scientifique (Cnrs) Process for producing an epitaxial layer of gallium nitride by the HVPE method
US20060011135A1 (en) * 2001-07-06 2006-01-19 Dmitriev Vladimir A HVPE apparatus for simultaneously producing multiple wafers during a single epitaxial growth run
US20070032046A1 (en) * 2001-07-06 2007-02-08 Dmitriev Vladimir A Method for simultaneously producing multiple wafers during a single epitaxial growth run and semiconductor structure grown thereby
US6613143B1 (en) 2001-07-06 2003-09-02 Technologies And Devices International, Inc. Method for fabricating bulk GaN single crystals
JP4121269B2 (en) 2001-11-27 2008-07-23 日本エー・エス・エム株式会社 Plasma CVD apparatus and method for performing self-cleaning
US6800255B2 (en) * 2002-01-23 2004-10-05 Agere Systems, Inc. System and method for the abatement of toxic constituents of effluent gases
US6911083B2 (en) 2002-06-11 2005-06-28 Tokyo Institute Of Technology Method for producing powders made of gallium nitride and apparatus for producing the same
US6921062B2 (en) 2002-07-23 2005-07-26 Advanced Technology Materials, Inc. Vaporizer delivery ampoule
GB0219735D0 (en) 2002-08-23 2002-10-02 Boc Group Plc Utilisation of waste gas streams
US6845619B2 (en) 2002-12-11 2005-01-25 Advanced Technology Materials, Inc. Integrated system and process for effluent abatement and energy generation
US7427555B2 (en) 2002-12-16 2008-09-23 The Regents Of The University Of California Growth of planar, non-polar gallium nitride by hydride vapor phase epitaxy
US20060169996A1 (en) 2002-12-27 2006-08-03 General Electric Company Crystalline composition, wafer, and semi-conductor structure
US6926756B1 (en) * 2003-03-31 2005-08-09 Macronix International Co. Ltd. Method and apparatus for controlling the operation of a scrubber
ATE335872T1 (en) 2003-04-24 2006-09-15 Norstel Ab DEVICE AND METHOD FOR PRODUCING SINGLE CRYSTALS BY VAPOR PHASE DEPOSITION
US7662233B2 (en) * 2003-06-27 2010-02-16 Ofer Sneh ALD apparatus and method
KR100524078B1 (en) 2003-11-18 2005-10-26 삼성전자주식회사 Automatic document feeding apparatus
US7223441B2 (en) * 2004-03-10 2007-05-29 Pilkington North America, Inc. Method for depositing gallium oxide coatings on flat glass
US20050221021A1 (en) 2004-03-31 2005-10-06 Tokyo Electron Limited Method and system for performing atomic layer deposition
US20050258459A1 (en) 2004-05-18 2005-11-24 Kiuchul Hwang Method for fabricating semiconductor devices having a substrate which includes group III-nitride material
US7368368B2 (en) 2004-08-18 2008-05-06 Cree, Inc. Multi-chamber MOCVD growth apparatus for high performance/high throughput
JP2006066540A (en) 2004-08-25 2006-03-09 Tokyo Electron Ltd Thin film forming device and cleaning method thereof
DE102004047440B4 (en) * 2004-09-28 2007-11-08 Centrotherm Clean Solutions Gmbh & Co.Kg Arrangement for the purification of toxic gases from production processes
US7390360B2 (en) 2004-10-05 2008-06-24 Rohm And Haas Electronic Materials Llc Organometallic compounds
JP2006165317A (en) * 2004-12-08 2006-06-22 Elpida Memory Inc Cleaning method of semiconductor manufacturing device
US20060131606A1 (en) 2004-12-18 2006-06-22 Amberwave Systems Corporation Lattice-mismatched semiconductor structures employing seed layers and related fabrication methods
US7534469B2 (en) 2005-03-31 2009-05-19 Asm Japan K.K. Semiconductor-processing apparatus provided with self-cleaning device
JP4792802B2 (en) * 2005-04-26 2011-10-12 住友電気工業株式会社 Surface treatment method of group III nitride crystal
US7632542B2 (en) 2005-10-26 2009-12-15 University Of Maryland Method for controlling uniformity of thin films fabricated in processing systems
US7942970B2 (en) * 2005-12-20 2011-05-17 Momentive Performance Materials Inc. Apparatus for making crystalline composition
US7641880B2 (en) 2006-05-03 2010-01-05 Ohio University Room temperature synthesis of GaN nanopowder
US20080018004A1 (en) 2006-06-09 2008-01-24 Air Products And Chemicals, Inc. High Flow GaCl3 Delivery
US20080050889A1 (en) * 2006-08-24 2008-02-28 Applied Materials, Inc. Hotwall reactor and method for reducing particle formation in GaN MOCVD
US8382898B2 (en) 2006-11-22 2013-02-26 Soitec Methods for high volume manufacture of group III-V semiconductor materials
US8197597B2 (en) 2006-11-22 2012-06-12 Soitec Gallium trichloride injection scheme
US7663148B2 (en) 2006-12-22 2010-02-16 Philips Lumileds Lighting Company, Llc III-nitride light emitting device with reduced strain light emitting layer
US9374348B2 (en) * 2007-07-19 2016-06-21 Google Technology Holdings LLC System and method to enable unlicensed mobile access across terminals
CN101849042B (en) 2007-12-20 2014-06-18 硅绝缘体技术有限公司 Apparatus for delivering precursor gases to an epitaxial growth substrate

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5668395A (en) * 1994-11-22 1997-09-16 Northwestern University Composition for InSB and GaAs thin film on silicon substrate for use in photodetectors
US20020108714A1 (en) * 1997-03-03 2002-08-15 Kenneth Doering Processing chamber for atomic layer deposition processes
US20020045362A1 (en) * 1999-07-09 2002-04-18 Yang Michael X. Method of forming a silicon nitride layer on a semiconductor wafer
US20040191142A1 (en) * 1999-11-02 2004-09-30 Ebara Corporation Burner for treating waste gas
US20030094446A1 (en) * 2001-04-17 2003-05-22 Mattson Technology, Inc. Rapid thermal processing system for integrated circuits

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