WO2010057673A3 - Machining system, in particular for a clean room machining installation, and a transfer device therefor - Google Patents

Machining system, in particular for a clean room machining installation, and a transfer device therefor Download PDF

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Publication number
WO2010057673A3
WO2010057673A3 PCT/EP2009/008349 EP2009008349W WO2010057673A3 WO 2010057673 A3 WO2010057673 A3 WO 2010057673A3 EP 2009008349 W EP2009008349 W EP 2009008349W WO 2010057673 A3 WO2010057673 A3 WO 2010057673A3
Authority
WO
WIPO (PCT)
Prior art keywords
machining
row
clean room
stations
transfer device
Prior art date
Application number
PCT/EP2009/008349
Other languages
German (de)
French (fr)
Other versions
WO2010057673A2 (en
Inventor
Klaus HÜGLER
Original Assignee
Asys Automatic Systems Gmbh & Co. Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asys Automatic Systems Gmbh & Co. Kg filed Critical Asys Automatic Systems Gmbh & Co. Kg
Priority to EP09759679A priority Critical patent/EP2368261A2/en
Publication of WO2010057673A2 publication Critical patent/WO2010057673A2/en
Publication of WO2010057673A3 publication Critical patent/WO2010057673A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices

Abstract

A machining installation (1), in particular for machining flat substrates under clean room and/or ultra-clean room conditions, is designed, with regard to a low space requirement with high throughput and approximately the same short residence times in the respective stations (4, 5), with a transfer device (8), which can move in a linear fashion between the stations (4, 5) arranged in rows (2, 3) and allows access to multiple stations (4, 5) of first one row (9) and then the other row (3), in a clocked manner with short travel paths, so as to yield passage through all stations (4, 5) at the same clock sequence and with reversal of the direction of passage during the transition from the one row (2) to row (3).
PCT/EP2009/008349 2008-11-24 2009-11-24 Machining system, in particular for a clean room machining installation, and a transfer device therefor WO2010057673A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP09759679A EP2368261A2 (en) 2008-11-24 2009-11-24 Machining system, in particular for a clean room machining installation, and a transfer device therefor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008058805A DE102008058805B4 (en) 2008-11-24 2008-11-24 Processing system for flat substrates and transfer device therefor
DE102008058805.9 2008-11-24

Publications (2)

Publication Number Publication Date
WO2010057673A2 WO2010057673A2 (en) 2010-05-27
WO2010057673A3 true WO2010057673A3 (en) 2010-10-07

Family

ID=42133932

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2009/008349 WO2010057673A2 (en) 2008-11-24 2009-11-24 Machining system, in particular for a clean room machining installation, and a transfer device therefor

Country Status (3)

Country Link
EP (1) EP2368261A2 (en)
DE (1) DE102008058805B4 (en)
WO (1) WO2010057673A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104802187B (en) * 2015-05-16 2017-02-08 希美埃（芜湖）机器人技术有限公司 Rotating base for multi-position robot

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5700127A (en) * 1995-06-27 1997-12-23 Tokyo Electron Limited Substrate processing method and substrate processing apparatus
US6264748B1 (en) * 1997-08-15 2001-07-24 Tokyo Electron Limited Substrate processing apparatus
US20040151562A1 (en) * 2002-07-22 2004-08-05 Christopher Hofmeister Substrate processing apparatus
JP2004265894A (en) * 2003-01-17 2004-09-24 Tokyo Electron Ltd Substrate treating device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6752584B2 (en) * 1996-07-15 2004-06-22 Semitool, Inc. Transfer devices for handling microelectronic workpieces within an environment of a processing machine and methods of manufacturing and using such devices in the processing of microelectronic workpieces
JP4025069B2 (en) * 2001-12-28 2007-12-19 大日本スクリーン製造株式会社 Substrate processing apparatus and substrate processing method
DE10227213B4 (en) 2002-06-18 2004-07-22 Asys Automatic Systems Gmbh & Co. Kg Transfer device for microsystems

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5700127A (en) * 1995-06-27 1997-12-23 Tokyo Electron Limited Substrate processing method and substrate processing apparatus
US6264748B1 (en) * 1997-08-15 2001-07-24 Tokyo Electron Limited Substrate processing apparatus
US20040151562A1 (en) * 2002-07-22 2004-08-05 Christopher Hofmeister Substrate processing apparatus
JP2004265894A (en) * 2003-01-17 2004-09-24 Tokyo Electron Ltd Substrate treating device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2368261A2 *

Also Published As

Publication number Publication date
DE102008058805A1 (en) 2010-06-02
DE102008058805B4 (en) 2013-11-21
EP2368261A2 (en) 2011-09-28
WO2010057673A2 (en) 2010-05-27

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