WO2010129360A3 - Semiconductor surface modification - Google Patents

Semiconductor surface modification Download PDF

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Publication number
WO2010129360A3
WO2010129360A3 PCT/US2010/032829 US2010032829W WO2010129360A3 WO 2010129360 A3 WO2010129360 A3 WO 2010129360A3 US 2010032829 W US2010032829 W US 2010032829W WO 2010129360 A3 WO2010129360 A3 WO 2010129360A3
Authority
WO
WIPO (PCT)
Prior art keywords
dopant
semiconductor material
surface modification
target region
fluid layer
Prior art date
Application number
PCT/US2010/032829
Other languages
French (fr)
Other versions
WO2010129360A2 (en
Inventor
Jason Sickler
Keith Donaldson
Original Assignee
Sionyx Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sionyx Inc. filed Critical Sionyx Inc.
Publication of WO2010129360A2 publication Critical patent/WO2010129360A2/en
Publication of WO2010129360A3 publication Critical patent/WO2010129360A3/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H01L21/228Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities using diffusion into or out of a solid from or into a liquid phase, e.g. alloy diffusion processes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/268Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/547Monocrystalline silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/914Doping

Abstract

Methods, systems, and devices associated with surface modifying a semiconductor material are taught. One such method includes providing a semiconductor material having a target region and providing a dopant fluid layer that is adjacent to the target region of the semiconductor material, where the dopant fluid layer includes at least one dopant. The target region of the semiconductor material is lased so as to incorporate the dopant or to surface modify the semiconductor material. During the surface modification, the dopant in the dopant fluid layer is actively replenished.
PCT/US2010/032829 2009-04-28 2010-04-28 Semiconductor surface modification WO2010129360A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/431,448 2009-04-28
US12/431,448 US8207051B2 (en) 2009-04-28 2009-04-28 Semiconductor surface modification

Publications (2)

Publication Number Publication Date
WO2010129360A2 WO2010129360A2 (en) 2010-11-11
WO2010129360A3 true WO2010129360A3 (en) 2011-02-24

Family

ID=42991364

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2010/032829 WO2010129360A2 (en) 2009-04-28 2010-04-28 Semiconductor surface modification

Country Status (2)

Country Link
US (2) US8207051B2 (en)
WO (1) WO2010129360A2 (en)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7442629B2 (en) 2004-09-24 2008-10-28 President & Fellows Of Harvard College Femtosecond laser-induced formation of submicrometer spikes on a semiconductor substrate
US7057256B2 (en) 2001-05-25 2006-06-06 President & Fellows Of Harvard College Silicon-based visible and near-infrared optoelectric devices
US8679959B2 (en) * 2008-09-03 2014-03-25 Sionyx, Inc. High sensitivity photodetectors, imaging arrays, and high efficiency photovoltaic devices produced using ion implantation and femtosecond laser irradiation
US8207051B2 (en) 2009-04-28 2012-06-26 Sionyx, Inc. Semiconductor surface modification
US9911781B2 (en) 2009-09-17 2018-03-06 Sionyx, Llc Photosensitive imaging devices and associated methods
US9673243B2 (en) 2009-09-17 2017-06-06 Sionyx, Llc Photosensitive imaging devices and associated methods
CN102630341A (en) * 2009-09-17 2012-08-08 西奥尼克斯股份有限公司 Photosensitive imaging devices and associated methods
US8692198B2 (en) 2010-04-21 2014-04-08 Sionyx, Inc. Photosensitive imaging devices and associated methods
US20110265875A1 (en) * 2010-05-03 2011-11-03 Sionyx, Inc. Copper and indium based photovoltaic devices and associated methods
US20120146172A1 (en) 2010-06-18 2012-06-14 Sionyx, Inc. High Speed Photosensitive Devices and Associated Methods
CN103392236B (en) 2010-12-21 2016-03-23 西奥尼克斯公司 There is semiconductor device and the correlation technique of the substrate damage of minimizing
US8871670B2 (en) * 2011-01-05 2014-10-28 The Board Of Trustees Of The University Of Illinois Defect engineering in metal oxides via surfaces
CN110896085B (en) 2011-03-10 2023-09-26 西奥尼克斯公司 Three-dimensional sensor, system and related methods
US9496308B2 (en) 2011-06-09 2016-11-15 Sionyx, Llc Process module for increasing the response of backside illuminated photosensitive imagers and associated methods
CN103946867A (en) 2011-07-13 2014-07-23 西奥尼克斯公司 Biometric imaging devices and associated methods
US8865507B2 (en) 2011-09-16 2014-10-21 Sionyx, Inc. Integrated visible and infrared imager devices and associated methods
US9064764B2 (en) 2012-03-22 2015-06-23 Sionyx, Inc. Pixel isolation elements, devices, and associated methods
WO2014127376A2 (en) 2013-02-15 2014-08-21 Sionyx, Inc. High dynamic range cmos image sensor having anti-blooming properties and associated methods
WO2014151093A1 (en) 2013-03-15 2014-09-25 Sionyx, Inc. Three dimensional imaging utilizing stacked imager devices and associated methods
US9209345B2 (en) 2013-06-29 2015-12-08 Sionyx, Inc. Shallow trench textured regions and associated methods
CN103746041B (en) * 2014-01-24 2016-03-30 哈尔滨工业大学 A kind of method that silica-based APD infrared-sensitive strengthens
DE112014005277T5 (en) * 2014-06-12 2016-10-06 Fuji Electric Co., Ltd. Device for introducing impurities, method for introducing impurities and method for producing a semiconductor element
US9805931B2 (en) * 2015-08-28 2017-10-31 Varian Semiconductor Equipment Associates, Inc. Liquid immersion doping
US10431455B2 (en) 2015-09-17 2019-10-01 The Regents Of The University Of Michigan Femtosecond laser-induced formation of single crystal patterned semiconductor surface
CN106711285A (en) * 2016-12-28 2017-05-24 东方环晟光伏(江苏)有限公司 Method for eliminating light induced degradation of boron-doped crystalline silicon cell and device thereof
US11894232B2 (en) * 2022-03-22 2024-02-06 Applied Materials, Inc. Methods for forming charge layers using gas and liquid phase coatings

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6818535B2 (en) * 1999-12-28 2004-11-16 Xerox Corporation Thin phosphorus nitride film as an n-type doping source used in a laser doping technology
US7211501B2 (en) * 2002-12-12 2007-05-01 Intel Corporation Method and apparatus for laser annealing
US7504325B2 (en) * 2002-11-05 2009-03-17 Semiconductor Energy Laboratory Co., Ltd. Laser doping processing method and method for manufacturing semiconductor device

Family Cites Families (100)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US496578A (en) 1893-05-02 Lubricator
US420145A (en) 1890-01-28 Charles r
US577382A (en) 1897-02-16 Wwhingtoh
US744262A (en) 1902-03-31 1903-11-17 Albert B Tomlin Rail-joint.
US705725A (en) 1902-05-14 1902-07-29 John M Van Orden Corset-cover.
US735479A (en) 1903-04-20 1903-08-04 Mears As Land-roller.
US739068A (en) 1903-05-04 1903-09-15 Hal E Ercanbrack Wrench.
US3487223A (en) 1968-07-10 1969-12-30 Us Air Force Multiple internal reflection structure in a silicon detector which is obtained by sandblasting
US4201450A (en) * 1978-04-03 1980-05-06 Polaroid Corporation Rigid electro-optic device using a transparent ferroelectric ceramic element
GB2030766A (en) 1978-09-02 1980-04-10 Plessey Co Ltd Laser treatment of semiconductor material
US4277793A (en) * 1979-07-16 1981-07-07 Rca Corporation Photodiode having enhanced long wavelength response
US4419533A (en) 1982-03-03 1983-12-06 Energy Conversion Devices, Inc. Photovoltaic device having incident radiation directing means for total internal reflection
US4514582A (en) 1982-09-17 1985-04-30 Exxon Research And Engineering Co. Optical absorption enhancement in amorphous silicon deposited on rough substrate
US4663188A (en) 1982-09-27 1987-05-05 Rca Corporation Method for making a photodetector with enhanced light absorption
JPS59127879A (en) 1983-01-12 1984-07-23 Semiconductor Energy Lab Co Ltd Photoelectric conversion device and manufacture thereof
US4493942A (en) 1983-01-18 1985-01-15 Exxon Research And Engineering Co. Solar cell with two-dimensional reflecting diffraction grating
US4536608A (en) 1983-04-25 1985-08-20 Exxon Research And Engineering Co. Solar cell with two-dimensional hexagonal reflecting diffraction grating
AU565214B2 (en) 1983-12-23 1987-09-10 Unisearch Limited Laser grooved solar cell
US5080725A (en) 1987-12-17 1992-01-14 Unisearch Limited Optical properties of solar cells using tilted geometrical features
US4965784A (en) * 1988-05-31 1990-10-23 Sandia Corporation Method and apparatus for bistable optical information storage for erasable optical disks
US5081049A (en) 1988-07-18 1992-01-14 Unisearch Limited Sculpted solar cell surfaces
US5383217A (en) * 1989-05-09 1995-01-17 Nikon Corporation Exposure apparatus with laser source requiring new gas introduction
JPH0795602B2 (en) 1989-12-01 1995-10-11 三菱電機株式会社 Solar cell and manufacturing method thereof
US5164324A (en) 1990-03-29 1992-11-17 The United States Of America As Represented By The Secretary Of The Navy Laser texturing
US5322988A (en) 1990-03-29 1994-06-21 The United States Of America As Represented By The Secretary Of The Navy Laser texturing
US5114876A (en) 1990-12-07 1992-05-19 The United States Of America As Represented By The United States Department Of Energy Selective epitaxy using the gild process
JP3194021B2 (en) * 1992-07-03 2001-07-30 経済産業省産業技術総合研究所長 Laser annealing equipment
JPH0653538A (en) 1992-07-28 1994-02-25 Toshiba Corp Semiconductor light receiving element
US5346850A (en) 1992-10-29 1994-09-13 Regents Of The University Of California Crystallization and doping of amorphous silicon on low temperature plastic
US5714404A (en) 1993-11-18 1998-02-03 Regents Of The University Of California Fabrication of polycrystalline thin films by pulsed laser processing
US5792280A (en) 1994-05-09 1998-08-11 Sandia Corporation Method for fabricating silicon cells
FR2735225B1 (en) * 1995-06-12 1997-09-05 Motorola Semiconducteurs OPTOELECTRONIC POSITION SENSOR AND COMPENSATION SYSTEM FOR SUCH A SENSOR
DE19522539C2 (en) 1995-06-21 1997-06-12 Fraunhofer Ges Forschung Solar cell with an emitter having a surface texture and method for producing the same
US5597621A (en) 1995-12-01 1997-01-28 University Of Florida Method of manufacturing photoluminescing semiconductor material using lasers
KR100269287B1 (en) * 1996-11-22 2000-11-01 윤종용 A method for forming hemi-spherical grain
US6071796A (en) * 1998-10-30 2000-06-06 Sharp Laboratories Of America, Inc. Method of controlling oxygen incorporation during crystallization of silicon film by excimer laser anneal in air ambient
JP3422290B2 (en) 1999-07-22 2003-06-30 日本電気株式会社 Manufacturing method of semiconductor thin film
KR100683390B1 (en) 1999-12-28 2007-02-15 매그나칩 반도체 유한회사 Method for manufacturing image sensor
DE10042733A1 (en) 2000-08-31 2002-03-28 Inst Physikalische Hochtech Ev Multicrystalline laser-crystallized silicon thin-film solar cell on a transparent substrate
US6580053B1 (en) * 2000-08-31 2003-06-17 Sharp Laboratories Of America, Inc. Apparatus to control the amount of oxygen incorporated into polycrystalline silicon film during excimer laser processing of silicon films
US7390689B2 (en) * 2001-05-25 2008-06-24 President And Fellows Of Harvard College Systems and methods for light absorption and field emission using microstructured silicon
US7057256B2 (en) 2001-05-25 2006-06-06 President & Fellows Of Harvard College Silicon-based visible and near-infrared optoelectric devices
US7442629B2 (en) * 2004-09-24 2008-10-28 President & Fellows Of Harvard College Femtosecond laser-induced formation of submicrometer spikes on a semiconductor substrate
US7354792B2 (en) * 2001-05-25 2008-04-08 President And Fellows Of Harvard College Manufacture of silicon-based devices having disordered sulfur-doped surface layers
US6607927B2 (en) * 2001-09-28 2003-08-19 Agere Systems, Inc. Method and apparatus for monitoring in-line copper contamination
US7109517B2 (en) 2001-11-16 2006-09-19 Zaidi Saleem H Method of making an enhanced optical absorption and radiation tolerance in thin-film solar cells and photodetectors
US6759262B2 (en) 2001-12-18 2004-07-06 Agilent Technologies, Inc. Image sensor with pixel isolation system and manufacturing method therefor
US6667528B2 (en) 2002-01-03 2003-12-23 International Business Machines Corporation Semiconductor-on-insulator lateral p-i-n photodetector with a reflecting mirror and backside contact and method for forming the same
US6583936B1 (en) 2002-03-11 2003-06-24 Eastman Kodak Company Patterned roller for the micro-replication of complex lenses
AU2003279758A1 (en) 2002-10-03 2004-04-23 Pan Jit Americas, Inc. Low temperature texturing layer to enhance adhesion of subsequent layers
TW569351B (en) * 2002-11-22 2004-01-01 Au Optronics Corp Excimer laser anneal apparatus and the application of the same
TWI227913B (en) 2003-05-02 2005-02-11 Au Optronics Corp Method of fabricating polysilicon film by excimer laser crystallization process
US7247527B2 (en) 2003-07-31 2007-07-24 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device, and laser irradiation apparatus
JP4442157B2 (en) 2003-08-20 2010-03-31 ソニー株式会社 Photoelectric conversion device and solid-state imaging device
KR100603318B1 (en) * 2003-11-27 2006-07-20 삼성에스디아이 주식회사 Inline processing apparatus for laser annealing of semiconductor device
US7419846B2 (en) 2004-04-13 2008-09-02 The Trustees Of Princeton University Method of fabricating an optoelectronic device having a bulk heterojunction
US7880255B2 (en) 2004-07-19 2011-02-01 Micron Technology, Inc. Pixel cell having a grated interface
DE102004036220B4 (en) 2004-07-26 2009-04-02 Jürgen H. Werner Method for laser doping of solids with a line-focused laser beam
JP4501633B2 (en) 2004-10-28 2010-07-14 ソニー株式会社 Solid-state imaging device and manufacturing method thereof
US8637340B2 (en) 2004-11-30 2014-01-28 Solexel, Inc. Patterning of silicon oxide layers using pulsed laser ablation
US20060118781A1 (en) 2004-12-03 2006-06-08 Omnivision Technologies, Inc. Image sensor and pixel having a polysilicon layer over the photodiode
US7482532B2 (en) 2005-01-19 2009-01-27 Massachusetts Institute Of Technology Light trapping in thin film solar cells using textured photonic crystal
US7456452B2 (en) 2005-12-15 2008-11-25 Micron Technology, Inc. Light sensor having undulating features for CMOS imager
WO2008127807A1 (en) 2007-03-09 2008-10-23 University Of Virginia Patent Foundation Systems and methods of laser texturing of material surfaces and their applications
WO2008091242A2 (en) 2005-12-21 2008-07-31 Uva Patent Foundation Systems and methods of laser texturing and crystallization of material surfaces
KR100741931B1 (en) 2005-12-28 2007-07-23 동부일렉트로닉스 주식회사 Image Sensor and Method of manufacturing the same
US8121356B2 (en) 2006-09-15 2012-02-21 Identix Incorporated Long distance multimodal biometric system and method
FR2906405B1 (en) 2006-09-22 2008-12-19 Commissariat Energie Atomique METHOD OF MAKING DOPED REGIONS IN A SUBSTRATE AND PHOTOVOLTAIC CELL
US7888159B2 (en) 2006-10-26 2011-02-15 Omnivision Technologies, Inc. Image sensor having curved micro-mirrors over the sensing photodiode and method for fabricating
US20080178932A1 (en) 2006-11-02 2008-07-31 Guardian Industries Corp. Front electrode including transparent conductive coating on patterned glass substrate for use in photovoltaic device and method of making same
JP4749351B2 (en) 2007-01-30 2011-08-17 富士通株式会社 Infrared detector
US7498650B2 (en) 2007-03-08 2009-03-03 Teledyne Licensing, Llc Backside illuminated CMOS image sensor with pinned photodiode
US8143514B2 (en) 2007-09-11 2012-03-27 Silicon China (Hk) Limited Method and structure for hydrogenation of silicon substrates with shaped covers
JP5248995B2 (en) 2007-11-30 2013-07-31 株式会社半導体エネルギー研究所 Method for manufacturing photoelectric conversion device
US7880168B2 (en) 2007-12-19 2011-02-01 Aptina Imaging Corporation Method and apparatus providing light traps for optical crosstalk reduction
US7982177B2 (en) 2008-01-31 2011-07-19 Omnivision Technologies, Inc. Frontside illuminated image sensor comprising a complex-shaped reflector
US7989859B2 (en) 2008-02-08 2011-08-02 Omnivision Technologies, Inc. Backside illuminated imaging sensor with silicide light reflecting layer
US7816220B2 (en) * 2008-02-27 2010-10-19 President & Fellows Of Harvard College Laser-induced structuring of substrate surfaces
US8058615B2 (en) 2008-02-29 2011-11-15 Sionyx, Inc. Wide spectral range hybrid image detector
US7759755B2 (en) 2008-05-14 2010-07-20 International Business Machines Corporation Anti-reflection structures for CMOS image sensors
US20100074396A1 (en) 2008-07-07 2010-03-25 Siemens Medical Solutions Usa, Inc. Medical imaging with black silicon photodetector
US7847253B2 (en) 2008-08-15 2010-12-07 Sionyx, Inc. Wideband semiconducting light detector
CN101656273B (en) 2008-08-18 2011-07-13 中芯国际集成电路制造(上海)有限公司 Selective emitter solar battery unit and manufacturing method thereof
US8679959B2 (en) 2008-09-03 2014-03-25 Sionyx, Inc. High sensitivity photodetectors, imaging arrays, and high efficiency photovoltaic devices produced using ion implantation and femtosecond laser irradiation
US7915154B2 (en) 2008-09-03 2011-03-29 Piwczyk Bernhard P Laser diffusion fabrication of solar cells
US7968834B2 (en) 2008-09-22 2011-06-28 Sionyx, Inc. Response-enhanced monolithic-hybrid pixel
US7745901B1 (en) 2009-01-29 2010-06-29 Sionyx, Inc. Highly-depleted laser doped semiconductor volume
JP5185205B2 (en) 2009-02-24 2013-04-17 浜松ホトニクス株式会社 Semiconductor photo detector
JP5185206B2 (en) 2009-02-24 2013-04-17 浜松ホトニクス株式会社 Semiconductor photo detector
US20100224229A1 (en) 2009-03-09 2010-09-09 Pralle Martin U Multi-junction semiconductor photovoltaic apparatus and methods
US7964431B2 (en) 2009-03-19 2011-06-21 Twin Creeks Technologies, Inc. Method to make electrical contact to a bonded face of a photovoltaic cell
US8207051B2 (en) 2009-04-28 2012-06-26 Sionyx, Inc. Semiconductor surface modification
KR101160112B1 (en) 2009-04-29 2012-06-26 주식회사 효성 A fabricating method of buried contact solar cell
US20100300505A1 (en) 2009-05-26 2010-12-02 Chen Yung T Multiple junction photovolatic devices and process for making the same
US8476681B2 (en) 2009-09-17 2013-07-02 Sionyx, Inc. Photosensitive imaging devices and associated methods
CN102630341A (en) 2009-09-17 2012-08-08 西奥尼克斯股份有限公司 Photosensitive imaging devices and associated methods
US9881965B2 (en) 2009-09-30 2018-01-30 Stmicroelectronics S.A. Back-side image sensor
US20120111396A1 (en) 2010-05-04 2012-05-10 Sionyx, Inc. Photovoltaic Devices and Associated Methods
US9496308B2 (en) 2011-06-09 2016-11-15 Sionyx, Llc Process module for increasing the response of backside illuminated photosensitive imagers and associated methods
US20120313205A1 (en) 2011-06-10 2012-12-13 Homayoon Haddad Photosensitive Imagers Having Defined Textures for Light Trapping and Associated Methods

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6818535B2 (en) * 1999-12-28 2004-11-16 Xerox Corporation Thin phosphorus nitride film as an n-type doping source used in a laser doping technology
US7504325B2 (en) * 2002-11-05 2009-03-17 Semiconductor Energy Laboratory Co., Ltd. Laser doping processing method and method for manufacturing semiconductor device
US7211501B2 (en) * 2002-12-12 2007-05-01 Intel Corporation Method and apparatus for laser annealing

Also Published As

Publication number Publication date
US8802549B2 (en) 2014-08-12
US8207051B2 (en) 2012-06-26
US20100270635A1 (en) 2010-10-28
WO2010129360A2 (en) 2010-11-11
US20120214260A1 (en) 2012-08-23

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