WO2015105767A3 - System and method for electroplating of hole surfaces - Google Patents

System and method for electroplating of hole surfaces Download PDF

Info

Publication number
WO2015105767A3
WO2015105767A3 PCT/US2015/010249 US2015010249W WO2015105767A3 WO 2015105767 A3 WO2015105767 A3 WO 2015105767A3 US 2015010249 W US2015010249 W US 2015010249W WO 2015105767 A3 WO2015105767 A3 WO 2015105767A3
Authority
WO
WIPO (PCT)
Prior art keywords
hole
needle
needle anode
anode
plating
Prior art date
Application number
PCT/US2015/010249
Other languages
French (fr)
Other versions
WO2015105767A2 (en
Inventor
John Bradley Hunter
Chester P. Piechowiak
Theodore M. Heummler
Original Assignee
Teledyne Instruments, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teledyne Instruments, Inc. filed Critical Teledyne Instruments, Inc.
Priority to EP15701436.6A priority Critical patent/EP3092328A2/en
Publication of WO2015105767A2 publication Critical patent/WO2015105767A2/en
Publication of WO2015105767A3 publication Critical patent/WO2015105767A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/026—Electroplating of selected surface areas using locally applied jets of electrolyte
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/04—Tubes; Rings; Hollow bodies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/02—Heating or cooling

Abstract

An electroplating system and method has a needle anode associated with an XYZ or multi-direction positioning device and is configured for plating internal surfaces of holes in metal products. The needle anode is positioned such that an insertion portion of the needle anode is centered over a hole and inserted to a predetermined depth in the hole, with a discharge end located a predetermined distance from the inner end of the hole. Plating solution is supplied to the needle anode and flows continuously during plating from the discharge end of the needle, through a gap between the needle anode and inner surface of the hole, and out of the open end of the hole into a drain. In one example, the metal object is a terminal of an electrical connector and the hole is a solder cup at a terminal end of the connector.
PCT/US2015/010249 2014-01-09 2015-01-06 System and method for electroplating of hole surfaces WO2015105767A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP15701436.6A EP3092328A2 (en) 2014-01-09 2015-01-06 System and method for electroplating of hole surfaces

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/151,532 US9303328B2 (en) 2014-01-09 2014-01-09 System and method for electroplating of hole surfaces
US14/151,532 2014-01-09

Publications (2)

Publication Number Publication Date
WO2015105767A2 WO2015105767A2 (en) 2015-07-16
WO2015105767A3 true WO2015105767A3 (en) 2015-08-27

Family

ID=52424119

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2015/010249 WO2015105767A2 (en) 2014-01-09 2015-01-06 System and method for electroplating of hole surfaces

Country Status (3)

Country Link
US (2) US9303328B2 (en)
EP (1) EP3092328A2 (en)
WO (1) WO2015105767A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3279537A1 (en) * 2016-08-04 2018-02-07 ATOTECH Deutschland GmbH Flexible sealing element
KR102032296B1 (en) * 2017-11-01 2019-10-15 두산중공업 주식회사 Electroplating Repair Machine For Tack Expansion And Seal Welding Region, Electroplating Repair System, And Operating Method
US11168400B2 (en) * 2018-06-21 2021-11-09 International Business Machines Corporation Formation of terminal metallurgy on laminates and boards
CN110408978B (en) * 2019-08-06 2021-03-30 哈尔滨理工大学 Metal micro-component interconnection method based on electrochemical deposition
CN112301394B (en) * 2020-10-30 2022-05-24 西北工业大学 Plating cavity capable of improving uniformity of electroplated layer on inner surface of ring-shaped element
CN112831806A (en) * 2020-12-31 2021-05-25 大连大学 Direct-writing type metal electrochemical 3D printing device and printing method
CN114351199B (en) * 2022-02-09 2023-04-21 四川深北电路科技有限公司 Equipment and electroplating process for precisely electroplating through holes in high-frequency circuit board
CN115261936A (en) * 2022-05-17 2022-11-01 哈尔滨工业大学 Double-spraying type electrodeposition welding device and method
CN114855252A (en) * 2022-06-24 2022-08-05 中航飞机起落架有限责任公司 Blind hole chromium plating device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2318588A (en) * 1996-10-24 1998-04-29 Honda Motor Co Ltd Composite plating apparatus using jetted liquid
US5865976A (en) * 1994-10-07 1999-02-02 Toyoda Gosei Co., Inc. Plating method

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1953955A (en) 1932-01-04 1934-04-10 Edwin M Crouch Means for electroplating interior surfaces
US3645855A (en) * 1970-08-14 1972-02-29 Ibm Ultrasonic repair plating of microscopic interconnections
US3941312A (en) * 1973-11-23 1976-03-02 Research and Development Laboratories of Ohno Company Limited Ink jet nozzle for use in a recording unit
US4687562A (en) 1986-12-23 1987-08-18 Amp Incorporated Anode assembly for selectively plating electrical terminals
GB2214930A (en) * 1988-02-11 1989-09-13 Twickenham Plating & Enamellin Mask for use in electriplating on elongate substrate
US4911813A (en) 1988-11-23 1990-03-27 Amp Incorporated Apparatus for selectively plating interior surfaces of electrical terminals
FR2688804A1 (en) 1992-03-20 1993-09-24 Souriau & Cie METHOD FOR THE SELECTIVE ELECTROLYTIC DEPOSITION OF A METAL, PARTICULARLY A NOBLE METAL, SUCH AS GOLD ON THE INTERNAL SIDE OF HOLLOW BODY IN SOCKET FORM, IN PARTICULAR OF MACHINE CONNECTOR CONTACT ELEMENTS FOR IMPLEMENTING THE PROCESS, PRODUCT OBTAINED .
US5516415A (en) 1993-11-16 1996-05-14 Ontario Hydro Process and apparatus for in situ electroforming a structural layer of metal bonded to an internal wall of a metal tube
JP3081558B2 (en) 1997-04-30 2000-08-28 株式会社ダイワエクセル Inner plating method and auxiliary electrode for inner plating
US7722745B2 (en) 2004-07-27 2010-05-25 Von Detten Volker Device for plating contacts in hermetic connector assemblies
KR100828571B1 (en) 2006-06-21 2008-05-13 양경준 Method and appratus for plating thread section of high-pressure gas cylinder
DE102006056626A1 (en) 2006-11-30 2008-06-05 Advanced Micro Devices, Inc., Sunnyvale Conductive barrier layer producing method for manufacturing integrated circuit, involves depositing layer on exposed surfaces by self-restricted deposition technique, and providing surface with characteristics at reduced deposition rate
US20080237048A1 (en) * 2007-03-30 2008-10-02 Ismail Emesh Method and apparatus for selective electrofilling of through-wafer vias
US7842170B1 (en) 2009-03-09 2010-11-30 Von Detten Volker Device for selective plating of electrical contacts for connectors
US9487881B2 (en) * 2011-07-18 2016-11-08 Asm Technology Singapore Pte Ltd Apparatus for electroplating a tooling for use in semiconductor device encapsulation
MX352269B (en) * 2012-11-01 2017-11-16 Yuken Ind Co Ltd Plating device, nozzle anode unit, method for manufacturing plating member, and device for fixing plated member.

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5865976A (en) * 1994-10-07 1999-02-02 Toyoda Gosei Co., Inc. Plating method
GB2318588A (en) * 1996-10-24 1998-04-29 Honda Motor Co Ltd Composite plating apparatus using jetted liquid

Also Published As

Publication number Publication date
WO2015105767A2 (en) 2015-07-16
US20150191844A1 (en) 2015-07-09
US20160174389A1 (en) 2016-06-16
US9303328B2 (en) 2016-04-05
EP3092328A2 (en) 2016-11-16

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