The present invention provides an apparatus for vertically interconnecting semiconductor die, integrated circuit die, or multiple die segments. Metal rerouting interconnects which extend to one or more sides of the die or segment can be optionally added to the die or multi die segment to provide edge...http://www.google.de/patents/US7215018?utm_source=gb-gplus-sharePatent US7215018 - Stacked die BGA or LGA component assembly
