An integrated circuit package having a lid is disclosed. The integrated circuit package comprises a substrate having an embedded conductor exposed on a surface; a lid comprising a plurality of conductive portions; and a solder bond between the embedded conductor and the plurality of conductive portions...http://www.google.de/patents/US7388284?utm_source=gb-gplus-sharePatent US7388284 - Integrated circuit package and method of attaching a lid to a substrate of an integrated circuit
