A semiconductor component includes a substrate, bonding pads on the substrate, and terminal contacts bonded to the bonding pads. Exemplary components include semiconductor packages, semiconductor wafers and semiconductor dice. Exemplary terminal contacts include contact balls, contact bumps and contact...http://www.google.de/patents/US6392291?utm_source=gb-gplus-sharePatent US6392291 - Semiconductor component having selected terminal contacts with multiple electrical paths
