A method for solder bumping a surface-mount circuit component, as well as electrically and mechanically connecting the component to a conductor on a substrate, and the components and assemblies formed thereby. The method generally entails forming a multilayer metal bump containing discrete layers, including...http://www.google.de/patents/US6281106?utm_source=gb-gplus-sharePatent US6281106 - Method of solder bumping a circuit component
