A method of improving the yield and achievable tolerances of integrated circuits by obtaining surface measurements of non-reflective soft mounting films used in integrated circuit manufacture. The non-reflective surface of a mounting film is first rendered reflective by applying a reflective wafer atop...http://www.google.de/patents/US5866436?utm_source=gb-gplus-sharePatent US5866436 - Process of manufacturing an intergrated circuit having an interferometrically profiled mounting film
