A semiconductor package includes a semiconductor die, a lead frame wire bonded to the die, and a plastic body encapsulating the die. The package also includes a first heat sink attached to a face of the die, and a second heat sink attached to a back side of the die. Thermally conductive adhesive layers...http://www.google.de/patents/US6075288?utm_source=gb-gplus-sharePatent US6075288 - Semiconductor package having interlocking heat sinks and method of fabrication
