A chip scale power semiconductor device (16) provides improved heat dissipation. A semiconductor die (19) is mounted in a first region of a substrate (18). The substrate is extended to a second region for disposing terminals (38) to make external connections to the semiconductor device. Conductors (34)...http://www.google.de/patents/US6040624?utm_source=gb-gplus-sharePatent US6040624 - Semiconductor device package and method
