A method of soldering used in fabricating an electronic circuit device employs an organic material supplied to at least one of the connecting members to be bonded. The connecting members are positioned in an oxidizing atmosphere, and heated in a nonoxidizing atmosphere to remove oxide and/or contamination...http://www.google.de/patents/US5865365?utm_source=gb-gplus-sharePatent US5865365 - Method of fabricating an electronic circuit device
