A method of chemical mechanical polishing organic silicon material with a low dielectric constant. An oxygen plasma treatment is performed on an organic silicon material with a low dielectric constant, so that the carbon contained in the organic silicon material is removed. A chemical mechanical polishing...http://www.google.de/patents/US6435943?utm_source=gb-gplus-sharePatent US6435943 - Method of chemical mechanical polishing organic silicon material with low dielectric constant
