A BGA package and a method for fabricating the package are provided. The package includes a semiconductor die, internal conductors wire bonded to bond pads on the die, external ball contacts attached to ball bonding pads formed on the conductors in a dense grid pattern, and an encapsulating resin encapsulating...http://www.google.de/patents/US6589810?utm_source=gb-gplus-sharePatent US6589810 - BGA package and method of fabrication
