A process for underfilling a bumped die surface using a lamination step and compound film such that solder bumps on the die are exposed during lamination. The compound film comprises a first layer containing an underfill material and a second layer on the first layer. The underfill material and the second...http://www.google.de/patents/US6916684?utm_source=gb-gplus-sharePatent US6916684 - Wafer-applied underfill process
