A polishing apparatus includes a rotatable platen, a first driving device for causing the rotatable platen to rotate, a polishing head provided above the platen rotatably and holding a substrate in a manner such that the substrate faces the platen, a second driving device for causing the polishing head...http://www.google.de/patents/US6086454?utm_source=gb-gplus-sharePatent US6086454 - Method of fabricating a semiconductor device using a CMP process
