A method for fabricating a stacked chip package comprises the steps of: (a) attaching a lower chip to a substrate or a lead frame; (b) electrically coupling the lower chip to the substrate or the lead frame; (c) providing a dummy chip with a film adhesive on a upper surface thereof; (d) attaching the...http://www.google.de/patents/US6503776?utm_source=gb-gplus-sharePatent US6503776 - Method for fabricating stacked chip package
