A method is proposed for fabricating a TFBGA (Thin & Fine Ball-Grid Array) package with embedded heat spreader. Conventionally, since an individual TFBGA package is quite small in size, it would be highly difficult to incorporate an embedded heat spreader therein. As a solution to this problem, the proposed...http://www.google.de/patents/US6949414?utm_source=gb-gplus-sharePatent US6949414 - Method of fabricating a thin and fine ball-grid array package with embedded heat spreader
