A method and a system are provided for cleaning a CMP pad. The method starts by applying chemicals onto the surface of the CMP pad. The chemicals are then allowed to react with a residue that may be on the pad to produce by-products. Next, the pad surface is rinsed to substantially remove the by-products....http://www.google.de/patents/US6994611?utm_source=gb-gplus-sharePatent US6994611 - Method and system for cleaning a chemical mechanical polishing pad
