A semiconductor device includes a substrate having first and second surfaces, the substrate having an opening; a first adhesive layer provided on the first surface; a second adhesive layer provided under the second surface; a third adhesive layer provided around the opening; a semiconductor chip arranging...http://www.google.de/patents/US7298035?utm_source=gb-gplus-sharePatent US7298035 - Semiconductor device and a method of assembling a semiconductor device
