A method for forming integrated circuit lines provides a structure for improved operation on integrated circuits. A method includes forming a first layer of electrically conductive material on a substrate. A first layer of insulating material is formed on the first layer of the electrically conductive...http://www.google.de/patents/US6844256?utm_source=gb-gplus-sharePatent US6844256 - High permeability composite films to reduce noise in high speed interconnects
