A method for and an electronic device circuit board having a contact and an integrated circuit chip of a given physical geometry, the chip having a lead electrically connected in hot-soldered relation to the contact, the chip having a protective composition congruent therewith and adhering thereto, the...http://www.google.de/patents/US6492204?utm_source=gb-gplus-sharePatent US6492204 - Electronic devices having thermodynamic encapsulant portions predominating over thermostatic encapsulant portions
