A planarized passivation layer is described. A planarized passivation layer of the present invention preferably includes a fluorosilicate glass (FSG) layer and a silicon nitride layer. The FSG layer is preferably deposited using triethoxyfluorosilane (TEFS) and tetraethoxyorthosilicate (TEOS). The inclusion...http://www.google.de/patents/US5908672?utm_source=gb-gplus-sharePatent US5908672 - Method and apparatus for depositing a planarized passivation layer
