A method for processing a semiconductor wafer or similar article includes the step of spinning the wafer and applying a fluid to a first side of the wafer, while it is spinning. The fluid flows radially outwardly in all directions, over the first side of the wafer, via centrifugal force. As the fluid...http://www.google.de/patents/US6447633?utm_source=gb-gplus-sharePatent US6447633 - Reactor for processing a semiconductor wafer
