A method and apparatus for assembling and packaging semiconductor dice. The semiconductor dice or assemblies of stacked and electrically interconnected semiconductor dice are placed at mutually spaced locations with respect to a common plane and encapsulated in a dielectric material so that end portions...http://www.google.de/patents/US6965160?utm_source=gb-gplus-sharePatent US6965160 - Semiconductor dice packages employing at least one redistribution layer
