Methods for forming multilayer circuit structures are disclosed. In some embodiments, conductive layers, dielectric layers and conductive posts can be formed on both sides of a circuitized core structure. The conductive posts are disposed in the dielectric layers and can be stacked to form a generally...http://www.google.de/patents/US6428942?utm_source=gb-gplus-sharePatent US6428942 - Multilayer circuit structure build up method
