The invention is a method of applying an array (134) of caps to a wafer (144) of semiconductor material which includes a plurality of microfabricated devices (146). The method includes applying the array (134) of first caps substantially simultaneously to one side of the wafer (144), bonding the array...http://www.google.de/patents/US6716666?utm_source=gb-gplus-sharePatent US6716666 - Wafer scale molding of protective caps
