A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving a bonding capillary upward, moving the bonding capillary sideways and then downward, bonding an Au wire to the ball bond portion, and cutting the Au...http://www.google.de/patents/US6894387?utm_source=gb-gplus-sharePatent US6894387 - Semiconductor element having protruded bump electrodes
