A microelectronic package includes a microelectronic element having faces and contacts and a flexible substrate spaced from and overlying a first face of the microelectronic element. The package also includes a plurality of conductive posts extending from the flexible substrate and projecting away from...http://www.google.de/patents/US7176043?utm_source=gb-gplus-sharePatent US7176043 - Microelectronic packages and methods therefor
