A light emitting diode (10) has a backside and a front-side with at least one n-type electrode (14) and at least one p-type electrode (12) disposed thereon defining a minimum electrodes separation (delectrodes). A bonding pad layer (50) includes at least one n-type bonding pad (64) and at least one p-type...http://www.google.de/patents/US7179670?utm_source=gb-gplus-sharePatent US7179670 - Flip-chip light emitting diode device without sub-mount
