Capacitors or dual layer metalization interconnects are formed in an integrated circuit utilizing two layers of polycrystalline silicon (22, 24) separated by a thin insulation region (23). The insulation region formed between the two polycrystalline silicon regions has substantially fewer defects than...http://www.google.de/patents/US4455568?utm_source=gb-gplus-sharePatent US4455568 - Insulation process for integrated circuits
