A method for efficiently fabricating a via plug having high aspect ratio within an insulating layer with a diffusion barrier layer effectively surrounding the via plug. The method includes the steps of depositing a via photoresist layer over a first metal line of a first conductive material and etching...http://www.google.de/patents/US6083842?utm_source=gb-gplus-sharePatent US6083842 - Fabrication of a via plug having high aspect ratio with a diffusion barrier layer effectively surrounding the via plug
