A method of fabricating a high density electronic package is disclosed. The package includes a module of laminated semiconductor chips, including spare chip(s) and a supporting substrate with a fixed interconnect pattern. Chip connection pads are provided at a first pad level of the module; one or more...http://www.google.de/patents/US5414637?utm_source=gb-gplus-sharePatent US5414637 - Intra-module spare routing for high density electronic packages
