A process for making an electronic device structure which comprises a metal plate, a semiconductor material chip attached to the plate, terminal leads, interconnection wires between the leads and metallized regions of the chip, and a plastic body which encapsulates the whole with the ...http://www.google.de/patents/US5763296?utm_source=gb-gplus-sharePatent US5763296 - Method for fabricating an electronic device structure with studs locating lead frame on backing plate 
