The present invention relates generally to a new process for hermetically sealing of a high thermally conductive substrate, such as, an aluminum nitride substrate, using a low thermally conductive interposer and structure thereof. More particularly, the invention encompasses a hermetic cap which is secured...http://www.google.de/patents/US6037193?utm_source=gb-gplus-sharePatent US6037193 - Hermetic sealing of a substrate of high thermal conductivity using an interposer of low thermal conductivity
