A semiconductor wafer includes a redistribution layer which is electrically connected with a pad which is an end portion of an interconnect, a first resin layer which is formed over the redistribution layer, a second resin layer which is formed over the first resin layer and covers the side surface of...http://www.google.de/patents/US7176572?utm_source=gb-gplus-sharePatent US7176572 - Semiconductor wafer, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
